Wire bonding apparatus

Abstract

Abstract PURPOSE:To identify a defective device when defective bonding is carried out on a fabricated semiconductor device and thereby easily reject defective pellets by giving a mark on a frame immediately before bonding the pellets on a frame to be fabricated. CONSTITUTION:A bonding apparatus is formed with a plurality of apparatuses. These are all the same in the type and therefore only one apparatus is indicated here. A marking apparatus 23 having a marker 22 which gives marks to a frame 15 is provided at the supply starting end of frame 15 of a frame guide 21. A wire bonding head 24 for executing bonding to pellets on the frame 15 to be carried is provided on the guide 21 and such a frame 15 is sent to the guide 21 using a carrier 18 and a supply belt 25. The bonded frame 15 is then returned to the carrier 18 by the exhaustion belt 26 and such an operation is carried out by individual apparatus. In this case, the marker 22 used by the marking apparatus 23 is given different colors.

Inventors

• 👤 Kiyoto Hirase
• 👤 平瀬　清人

Bibliographic Details