US4979289A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of die bonding semiconductor chip by using removable non-wettable by solder frame
Assignee: Samsung Electronics Co Ltd
•
Filing: 1989-02-10
•
Granted: 1990-12-25
•
Expires: 2009-02-10
Abstract
Abstract A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A removable non-wettable by solder frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
Inventors
- 👤 Thomas J. Dunaway
- 👤 Richard K. Spielberger
- 👤 Lori A. Dicks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 10:31
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/0711; H10W72/90; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/073; H10W72/07302; H10W72/07304; H10W72/07331; H10W72/07337; H10W72/07551; H10W72/07554; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/541; H10W72/5445; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/755; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49155; Y10T29/49158
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
148 words
A low cost high throughput method of die bonding a semiconductor chip to a package die bond pad, comprising: (a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; (b) providing bonding material located on the die bond pad; (c) placing a removable frame non-wettable by solder into the package cavity, the frame comprising top and bottom surfaces, an outer section, and an inner section, the outer section comprising means for achieving substantially slidable contact with peripheral walls of the package cavity, and the inner section defining a central aperture extending through the frame, the inner section comprising means for defining a wide upper opening and a narrower lower opening; (d) placing the semiconductor chip through the frame aperture into contact with the die bond pad bonding material; (e) heating the bonding material; and (f) removing the frame from the cavity.
Claim 2
Dependent Claim
148 words
A low cost high throughput method of die bonding a semiconductor chip to a package die bond pad, comprising: (a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; (b) providing bonding material located on the die bond pad; (c) placing a removable frame non-wettable by solder into the package cavity, the frame comprising top and bottom surfaces, an outer section, and an inner section, the outer section comprising means for achieving substantially slidable contact with peripheral walls of the package cavity, and the inner section defining a central aperture extending through the frame, the inner section comprising means for defining a wide upper opening and a narrower lower opening; (d) placing the semiconductor chip through the frame aperture into contact with the die bond pad bonding material; (e) heating the bonding material; and (f) removing the frame from the cavity.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein the step of providing bonding material comprises providing non-organic bonding material.
Claim 4
Dependent Claim
19 words
The method according to claim 2 wherein the step of providing non-organic bonding material comprises providing solder bonding material.
Claim 5
Dependent Claim
102 words
A low cost method of die bonding a semiconductor chip to a package die bond pad, comprising: (a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; (b) providing bonding material located at the die bond pad; (c) placing into the package cavity a removable frame which is non-wettable by solder and, which has at least one aperture; (d) placing the semiconductor chip through the selected aperture into contact with the die bond bonding material; (e) heating the bonding material to bond the chip to the package; and (f) removing the frame from the cavity.
Claim 6
Dependent Claim
102 words
A low cost method of die bonding a semiconductor chip to a package die bond pad, comprising: (a) providing a semiconductor chip package having a chip mounting cavity configured with a die bond pad; (b) providing bonding material located at the die bond pad; (c) placing into the package cavity a removable frame which is non-wettable by solder and, which has at least one aperture; (d) placing the semiconductor chip through the selected aperture into contact with the die bond bonding material; (e) heating the bonding material to bond the chip to the package; and (f) removing the frame from the cavity.
Claim 7
Dependent Claim
128 words
A low cost method for non-organic bonding of a semiconductor chip to a semiconductor package die bond pad, comprising the steps of: (a) providing a semiconductor chip package having a chip mounting cavity comprising walls surrounding a die bond pad and non-organic bonding material located on the bonding pad; (b) placing into a slidable contact with walls of the package cavity a removable frame which is non-wettable by solder and which has a central aperture; (c) orienting a semiconductor chip to the aperture of the frame; (d) placing the semiconductor chip through the frame aperture into contact with the bonding material on the die bond pad; (d) heating the bonding material to bond the chip to the die bond pad; and (f) removing the frame from the cavity.
Claim 8
Dependent Claim
128 words
A low cost method for non-organic bonding of a semiconductor chip to a semiconductor package die bond pad, comprising the steps of: (a) providing a semiconductor chip package having a chip mounting cavity comprising walls surrounding a die bond pad and non-organic bonding material located on the bonding pad; (b) placing into a slidable contact with walls of the package cavity a removable frame which is non-wettable by solder and which has a central aperture; (c) orienting a semiconductor chip to the aperture of the frame; (d) placing the semiconductor chip through the frame aperture into contact with the bonding material on the die bond pad; (d) heating the bonding material to bond the chip to the die bond pad; and (f) removing the frame from the cavity.
Claim 9
Dependent Claim
19 words
The method according to claim 5 wherein the step of providing non-organic bonding material comprises providing solder bonding material.
Claim 10
Dependent Claim
43 words
The method according to claim 5 wherein the step of providing a package with a semiconductor chip cavity comprises providing a package having a semiconductor chip cavity sized for receipt of a semiconductor chip having a side length greater than about 400 mils.
Claim 11
Dependent Claim
128 words
A low cost method for non-organic bonding of a semiconductor chip to a semiconductor package die bond pad, comprising the steps of: (a) providing a semiconductor chip package having a chip mounting cavity comprising walls surrounding a die bond pad and non-organic bonding material located on the bonding pad; (b) placing into slidable contact with walls of the package cavity a removable frame which is non-wettable by solder and which has a central aperture; (c) orienting a semiconductor chip to the aperture of the frame; (d) placing the semiconductor chip through the frame aperture into contact with the bonding material on the die bond pad; (e) heating the bonding material to bond the chip to the die bond pad; and (f) removing the frame from the package cavity.
Claim 12
Dependent Claim
128 words
A low cost method for non-organic bonding of a semiconductor chip to a semiconductor package die bond pad, comprising the steps of: (a) providing a semiconductor chip package having a chip mounting cavity comprising walls surrounding a die bond pad and non-organic bonding material located on the bonding pad; (b) placing into slidable contact with walls of the package cavity a removable frame which is non-wettable by solder and which has a central aperture; (c) orienting a semiconductor chip to the aperture of the frame; (d) placing the semiconductor chip through the frame aperture into contact with the bonding material on the die bond pad; (e) heating the bonding material to bond the chip to the die bond pad; and (f) removing the frame from the package cavity.
References Cited (Backward Citations)
US3458780A
Cited
US3780429A
Cited
US4025716A
Cited
US4079511A
Cited
US4139726A
Cited
US4408218A
Cited
US4670770A
Cited
US4685606A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-12-24 | 1994-06-25 | 1994-12-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-24 | 1998-06-25 | 1998-12-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-24 | 2002-06-25 | 2002-12-25 | $7700.00 | Window Closed / Lapsed |