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US4977916A Expired / Lapsed US ⏱️ 0.0 years remaining

Mass flow controller

Assignee: Stec KK
•
Filing: 1989-06-15
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Granted: 1990-12-18
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Expires: 2009-06-15
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Abstract

Abstract A mass flow controller including a valve assembly wherein a flow rate-controlling portion of the valve assembly is mirror finished and wherein the maximum flow rate through the flow rate-controlling portion during the time that the flow rate is not being controlled is set so as to be sufficiently large in comparison with the flow rate during control whereby a moisture purging function may be performed without external fluid bypass circuits.

Inventors

  • 👤 Tadahiro Ohmi
  • 👤 Hiroshi Mihara
  • 👤 Kiyoshi Satoh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 16:40
CPC Classifications
G; G01; G01F; G01F1/00; G01F1/68; G01F1/684; G01F1/6847; G05; G05D; G05D7/00; G05D7/06; G05D7/0617; G05D7/0629; G05D7/0635; Y; Y10; Y10T; Y10T137/00; Y10T137/0318; Y10T137/0324; Y10T137/0357; Y10T137/7722; Y10T137/7758; Y10T137/7759; Y10T137/7761

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 195 words
An improved mass flow controller for monitoring a flow rate of a fluid and for purging a fluid delivery system of moisture, comprising: a fluid intake conduit adapted to be connected to a source of fluid; a mass flow meter connected to the fluid intake conduit including a capillary tube and a flow sensing means connected to the capillary tube for providing a signal of the flow rate, and a fluid controlling portion including an annular rimmed valve port with a conduit connected to the intake conduit and having a flat mirror finish surface, the valve port being significantly larger than a cross-sectional size of the conduit, a valve head having a flat mirror finish, a support diaphragm for positioning the valve head adjacent the annular rimmed valve port, and a valve drive means for driving the valve head relative to the valve port in response to the flow rate signal, the mirror finish surface having a maximum surface roughness height of 0.5 microns, wherein the fluid controlling portion can accurately control a very low flow rate and can also provide a large purging rate of flow to remove moisture from a fluid delivery system.
Claim 2
Dependent Claim 195 words
An improved mass flow controller for monitoring a flow rate of a fluid and for purging a fluid delivery system of moisture, comprising: a fluid intake conduit adapted to be connected to a source of fluid; a mass flow meter connected to the fluid intake conduit including a capillary tube and a flow sensing means connected to the capillary tube for providing a signal of the flow rate, and a fluid controlling portion including an annular rimmed valve port with a conduit connected to the intake conduit and having a flat mirror finish surface, the valve port being significantly larger than a cross-sectional size of the conduit, a valve head having a flat mirror finish, a support diaphragm for positioning the valve head adjacent the annular rimmed valve port, and a valve drive means for driving the valve head relative to the valve port in response to the flow rate signal, the mirror finish surface having a maximum surface roughness height of 0.5 microns, wherein the fluid controlling portion can accurately control a very low flow rate and can also provide a large purging rate of flow to remove moisture from a fluid delivery system.
Claim 3
Dependent Claim 28 words
The improved mass flow controller of claim 1 wherein the fluid intake conduit includes a bypass portion having a constant flow dividing ratio characteristic to the capillary tube.
Claim 4
Dependent Claim 19 words
The improved mass flow controller of claim 1 wherein the valve drive means includes a plurality of piezo elements.
Claim 5
Dependent Claim 18 words
The improved mass flow controller of claim 1 wherein the valve port has an enlarged bell mouth configuration.
Claim 6
Dependent Claim 209 words
An improved mass flow controller having a mass flow meter portion for measuring a flow rate of a gas and a gas-controlling portion for controlling the flow rate of the gas provided between a gas inlet and a gas outlet, the improvement comprising: said gas-controlling portion having a controlled flow position wherein the gas flow rate may be accurately controlled at very low flow rates and a purging flow position wherein the gas flow rate is increased to a gas flow rate that exceeds the gas flow rate in the controlled flow position by a factor of at least 50, the gas-controlling portion consists of a gas control valve, the operative surfaces of said gas control valve having a mirror-finish in order to achieve the high control accuracy at very low flow rates, the gas-controlling portion consists of a gas control valve comprised of a valve head which movably opposes a valve mouth, the opposing planar surfaces of the valve head and the valve mouth being mirror-finished so as to provide a very low and controlled flow rate that may be varied with high accuracy, wherein the planar surfaces of the valve mouth and valve head have a maximum height variance of 0.5 microns or less from their surfaces.
Claim 7
Dependent Claim 209 words
An improved mass flow controller having a mass flow meter portion for measuring a flow rate of a gas and a gas-controlling portion for controlling the flow rate of the gas provided between a gas inlet and a gas outlet, the improvement comprising: said gas-controlling portion having a controlled flow position wherein the gas flow rate may be accurately controlled at very low flow rates and a purging flow position wherein the gas flow rate is increased to a gas flow rate that exceeds the gas flow rate in the controlled flow position by a factor of at least 50, the gas-controlling portion consists of a gas control valve, the operative surfaces of said gas control valve having a mirror-finish in order to achieve the high control accuracy at very low flow rates, the gas-controlling portion consists of a gas control valve comprised of a valve head which movably opposes a valve mouth, the opposing planar surfaces of the valve head and the valve mouth being mirror-finished so as to provide a very low and controlled flow rate that may be varied with high accuracy, wherein the planar surfaces of the valve mouth and valve head have a maximum height variance of 0.5 microns or less from their surfaces.
Claim 8
Dependent Claim 19 words
The improved mean flow controller of claim 5 wherein the valve head is movably supported by a metal diaphragm.
Claim 9
Dependent Claim 150 words
In a method of controlling the supply of gases in the production of semiconductor elements to prevent the contamination of moisture with a mass flow controller having a mass flow meter and a gas-controlling portion with a valve assembly of an enlarged annular rimmed valve port of a mirror finish surface having a maximum surface roughness height of 0.5 microns and a valve head, also of a mirror finish surface, having a maximum surface roughness height of 0.5 microns, the gas-controlling portion connected to a source of purging gas such as N 2 or Ar gas, the improvement comprising: increasing the flow rate of a nitrogen purging gas through the valve assembly to 5 liters/minute for several days to provide a new point of -100° C., and subsequently precisely controlling the flow of argon through the same valve assembly at less than 100 cc/minute to enable sputtering for semiconductor production.
Claim 10
Dependent Claim 150 words
In a method of controlling the supply of gases in the production of semiconductor elements to prevent the contamination of moisture with a mass flow controller having a mass flow meter and a gas-controlling portion with a valve assembly of an enlarged annular rimmed valve port of a mirror finish surface having a maximum surface roughness height of 0.5 microns and a valve head, also of a mirror finish surface, having a maximum surface roughness height of 0.5 microns, the gas-controlling portion connected to a source of purging gas such as N 2 or Ar gas, the improvement comprising: increasing the flow rate of a nitrogen purging gas through the valve assembly to 5 liters/minute for several days to provide a new point of -100° C., and subsequently precisely controlling the flow of argon through the same valve assembly at less than 100 cc/minute to enable sputtering for semiconductor production.

References Cited (Backward Citations)

US4099703A Cited
US4278234A Cited
US4585209A Cited
US4687020A Cited
US4858643A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-12-17 1994-06-18 1994-12-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-12-17 1998-06-18 1998-12-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-12-17 2002-06-18 2002-12-18 $7700.00 Window Closed / Lapsed

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