Conforming heat sink assembly

Claim 2

A heat sink assembly comprising: a heat dispersing member; an elastomeric member disposed between said heat dispersing member and an irregular surface to be cooled having protrusions, which physically contacts said heat dispersing member and said irregular surface; at least one of said heat dispersing member and said elastomeric member defining a plurality of voids at a junction thereof, each of said voids disposed along the junction between said elastomeric member and said heat dispersing member and said voids spaced with respect to each other and are aligned with same protrusions, to enable said protrusions to displace said elastomeric member into said voids, to increase the amount of surface area of said elastomeric member that is in contact with said irregular surface and enhance thermal conductivity from said irregular surface to said heat dispersing member.

Claim 3

The heat sink assembly of claim 1 in which said elastomeric member is thermally conductive and electrically insulative.

Claim 4

The heat sink assembly of claim 1 in which said voids are established by periodic channels or holes.

Claim 5

The heat sink assembly of claim 1 in which said elastomeric member exhibits a periodic undulating shape.

Claim 6

A heat sink assembly comprising: a heat dispersing member; means mounting said dispersing member in spaced relationship to a device to be cooled having protrusions, to establish a first volume between said heat dispersing member and the device and for establishing a clamping force; and an elastomeric, thermally conductive member disposed in said first volume, at least one of said elastomeric member and said heat dispersing member defining a plurality of voids at a junction thereof, each of said voids disposed along the junction between said elastomeric member and said heat dispersing member and said voids spaced with respect to each other and are aligned with said protrusions, to enable said elastomeric member to be deformed and displaced by said protrusions into at least a portion of the unoccupied portion of said first volume to relieve stress generated by the clamping force of said means mounting between said heat dispersing member and said device to be cooled.

Claim 7

A heat sink assembly comprising: a heat dispersing member; means mounting said dispersing member in spaced relationship to a device to be cooled having protrusions, to establish a first volume between said heat dispersing member and the device and for establishing a clamping force; and an elastomeric, thermally conductive member disposed in said first volume, at least one of said elastomeric member and said heat dispersing member defining a plurality of voids at a junction thereof, each of said voids disposed along the junction between said elastomeric member and said heat dispersing member and said voids spaced with respect to each other and are aligned with said protrusions, to enable said elastomeric member to be deformed and displaced by said protrusions into at least a portion of the unoccupied portion of said first volume to relieve stress generated by the clamping force of said means mounting between said heat dispersing member and said device to be cooled.

Claim 8

The heat sink assembly of claim 5 in which said elastomeric member is electrically insulative.

Claim 9

The heat sink assembly of claim 5 in which said elastomeric member includes a silicone material.

Claim 10

The heat sink assembly of claim 5 in which said elastomeric member contains one or more thermally conductive fillers.

Claim 11

The heat sink assembly of claim 8 in which said filler is selected from the group including boron nitride, aluminum oxide, silicon carbide, aluminum nitride, magnesium oxide, and beryllium oxide.

Claim 12

The heat sink assembly of claim 5 in which said elastomeric member defines a plurality of voids.

Claim 13

The heat sink assembly of claim 10 in which said voids are located on a surface of said elastomeric member.

Claim 14

The heat sink assembly of claim 11 in which said voids are established by a plurality of generally parallel channels which extend substantially in a first direction and are generally parallel in a second direction transverse to said first direction.

Claim 15

The heat sink assembly of claim 12 in which said voids are further established by a second plurality of channels which extend substantially in said second direction and are generally parallel in said first direction.

Claim 16

The heat sink assembly of claim 5 in which said elastomeric member exhibits a periodic undulating shape.

Claim 17

The heat sink assembly of claim 5 in which said heat dispersing member defines a plurality of voids.

Claim 18

The heat sink assembly of claim 15 in which said voids are located on the surface of said heat dispersing member.

Claim 19

The heat sink assembly of claim 15 in which said voids are established by a plurality of generally parallel.

Claim 20

A thermal interface comprising: a thermally conductive and electrically insulative elastomeric member having first and second sides, a plurality of recesses defined by said elastomeric member on said first side, said elastomeric member disposed between an irregular surface to be cooled having protrusions and a heat dispersing member with said second side toward said irregular surface, said recesses spaced with respect to each other and are aligned with said protrusions, to enable said elastomeric member to be displaced into said recesses by said protrusions, to increase the surface area of said elastomeric member that is in contact with said irregular surface and enhance thermal conductivity from said irregular surface to said heat dispersing member.

Claim 21

A thermal interface comprising: a thermally conductive and electrically insulative elastomeric member having first and second sides, a plurality of recesses defined by said elastomeric member on said first side, said elastomeric member disposed between an irregular surface to be cooled having protrusions and a heat dispersing member with said second side toward said irregular surface, said recesses spaced with respect to each other and are aligned with said protrusions, to enable said elastomeric member to be displaced into said recesses by said protrusions, to increase the surface area of said elastomeric member that is in contact with said irregular surface and enhance thermal conductivity from said irregular surface to said heat dispersing member.

Claim 22

The thermal interface of claim 18 in which said recesses are established by periodic channels or holes.

Claim 23

The thermal interface of claim 19 in which said recesses are established by periodic undulations.

Claim 24

The thermal interface of claim 18 in which said elastomeric member includes a silicone material.

Claim 25

The thermal interface of claim 18 in which said elastomeric member contains one or more thermally conductive fillers.

Claim 26

The thermal interface of claim 22 in which said filler is selected from the group including boron nitride, aluminum oxide, silicon carbide, aluminum nitride, magnesium oxide, and beryllium oxide.

Claim 27

A heat sink assembly comprising: a printed circuit board including a first surface having at least one heat generating source, and a second, irregular surface having a plurality of protrusions from which heat is to be conducted: a heat dispersing member; means mounting said heat dispersing member proximate to said second surface of said printed circuit board; an elastomeric member disposed between said second surface and said heat dispersing member; and at least one of said heat dispersing member and said elastomeric member defining a plurality of voids at a junction thereof, each of said voids disposed along the junction between said elastomeric member and said heat dispersing member and said voids spaced with respect to each other and are aligned with said protrusions, said elastomeric member deformed by said protrusions and conformed to said irregular surface to enable said elastomeric member to be displaced into said voids by said irregular surface, to increase surface area of said elastomeric member that is in contact with said irregular surface and enhance thermal conductivity from said irregular surface to said heat dispersing member.

Claim 28

A heat sink assembly comprising: a printed circuit board including a first surface having at least one heat generating source, and a second, irregular surface having a plurality of protrusions from which heat is to be conducted: a heat dispersing member; means mounting said heat dispersing member proximate to said second surface of said printed circuit board; an elastomeric member disposed between said second surface and said heat dispersing member; and at least one of said heat dispersing member and said elastomeric member defining a plurality of voids at a junction thereof, each of said voids disposed along the junction between said elastomeric member and said heat dispersing member and said voids spaced with respect to each other and are aligned with said protrusions, said elastomeric member deformed by said protrusions and conformed to said irregular surface to enable said elastomeric member to be displaced into said voids by said irregular surface, to increase surface area of said elastomeric member that is in contact with said irregular surface and enhance thermal conductivity from said irregular surface to said heat dispersing member.

Claim 29

The heat sink assembly claim 24 in which said heat generating source includes at least one electronic component and said irregularities of said second surface include a plurality of leads of a said electronic component.

Claim 30

The heat sink assembly of claim 24 in which said voids are recesses established by periodic channels.

Claim 31

The heat sink assembly of claim 24 in which said elastomeric member is electrically insulative and thermally conductive.

Claim 32

The heat sink assembly of claim 27 in which said elastomeric member includes a silicone material and a thermally conductive filler from the group consisting of boron nitride, aluminum oxide, silicon carbide, aluminum nitride, magnesium oxide, and beryllium oxide.