Patent US4972043A successfully refreshed from Google Patents.
US4972043A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-lead hermetic power package with high packing density
Assignee: IXYS LLC
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Filing: 1989-01-30
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Granted: 1990-11-20
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Expires: 2009-01-30
Abstract
Abstract An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs protruding from opposite corners thereof. The mounting tabs are configured to allow the packages to be nested together. A cover attached to the walls provides a hermetically sealed package.
Inventors
- 👤 Walter Noll
- 👤 Chuck Heron
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:42
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
136 words
A package for a semiconductor device comprising: a semiconductor device mounting cavity of generally rectangular configuration, the cavity being defined by walls surrounding its periphery; a base affixed to the semiconductor device mounting cavity, the base having a spaced-apart pair of mounting tabs extending from diagonally opposite corners of the walls of the cavity, the mounting tabs being adapted to enable the base to be affixed to a mounting surface, wherein the mounting tabs each extend outward from the base by an equal distance and occupy an area equal to about one-half of the area defined by the length of the base times the width of the tab; and at least two leads extending through openings in the walls of the cavity to enable electrical signals to communicate from within the cavity to outside the walls.
Claim 2
Dependent Claim
136 words
A package for a semiconductor device comprising: a semiconductor device mounting cavity of generally rectangular configuration, the cavity being defined by walls surrounding its periphery; a base affixed to the semiconductor device mounting cavity, the base having a spaced-apart pair of mounting tabs extending from diagonally opposite corners of the walls of the cavity, the mounting tabs being adapted to enable the base to be affixed to a mounting surface, wherein the mounting tabs each extend outward from the base by an equal distance and occupy an area equal to about one-half of the area defined by the length of the base times the width of the tab; and at least two leads extending through openings in the walls of the cavity to enable electrical signals to communicate from within the cavity to outside the walls.
Claim 3
Dependent Claim
23 words
A package as in claim 1 wherein: each of the first and second tabs are tapered to become smaller further from the base.
Claim 4
Dependent Claim
22 words
A package as in claim 2 wherein: the first and second tabs have geometries that are inverted mirror images of each other.
Claim 5
Dependent Claim
22 words
A package as in claim 3 wherein: the first tab includes a mounting hole; and the second tab includes a mounting slot.
Claim 6
Dependent Claim
37 words
A package as in claim 1 wherein the at least two leads comprise: two leads extending through openings in one wall of the cavity; and a plurality of leads extending through an opposite wall of the cavity.
Claim 7
Dependent Claim
20 words
A package as in claim 5 wherein the two leads enable coupling the package to be source of electrical power.
Claim 8
Dependent Claim
14 words
A package as in claim 6 wherein the plurality of leads comprises five leads.
Claim 9
Dependent Claim
25 words
A package as in claim 1 wherein the cavity is defined by four walls extending upward from the base to thereby define the rectangular configuration.
Claim 10
Dependent Claim
52 words
A package as in claim 8 wherein: the openings in the walls for the leads are larger than the leads to define an annular region about each lead where it passes through the wall; and an electrically insulating material is disposed in the openings to electrically isolate the leads from the walls.
Claim 11
Dependent Claim
23 words
A package as in claim 1 further comprising: a cover disposed over the cavity and affixed to the walls to enclose the cavity.
Claim 12
Dependent Claim
13 words
A package as in claim 10 wherein the cover hermetically encloses the cavity.
References Cited (Backward Citations)
US3206704A
Cited
US3876926A
Cited
US4636580A
Cited
US4506108A
Cited
US4546412A
Cited
US4713634A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-11-19 | 1994-05-21 | 1994-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-11-19 | 1998-05-21 | 1998-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-11-19 | 2002-05-21 | 2002-11-20 | $7700.00 | Window Closed / Lapsed |