Abstract The manufacture of monolithic HgCdTe detectors and Si circuitry in an IR focal plane array is achieved by forming a protective layer of SiO 2 or SiN x on a silicon wafer containing silicon circuits, etching steep-wall recesses into the wafer, selectively depositing epitaxial single-crystal layers of GaAs, CdTe, and HgCdTe in the recesses fabricating HgCdTe IR arrays, and depositing appropriate insulating and conductive interconnection patterns to interconnect the Si devices with one another and the HgCdTe devices with the Si devices. Little or no GaAs, CdTe, and HgCdTe grows on the SiO 2 or SiN x outside the recesses. Since material grown outside the recess is polycrystalline, it is easily chemomechanically removed.
A monolithic focal plane array structure including interconnected silicon circuitry and HgCdTe detectors, comprising: (a) a silicon substrate having silicon signal readout device circuitry formed therein; (b) said substrate having recesses formed therein, said recesses being filled with monocrystalline layers of GaAs, CdTe, and HgCdTe formed on top of one another, the surface of said HgCdTe layer being substantially level with the surface of said silicon substrate; and (c) patterns of insulating material and metallic interconnectors superimposed upon said substrate surface and said HgCdTe layer surface.
Claim 2
Dependent Claim
86 words
A monolithic focal plane array structure including interconnected silicon circuitry and HgCdTe detectors, comprising: (a) a silicon substrate having silicon signal readout device circuitry formed therein; (b) said substrate having recesses formed therein, said recesses being filled with monocrystalline layers of GaAs, CdTe, and HgCdTe formed on top of one another, the surface of said HgCdTe layer being substantially level with the surface of said silicon substrate; and (c) patterns of insulating material and metallic interconnectors superimposed upon said substrate surface and said HgCdTe layer surface.