Inspection of multipattern circuit boards

Claim 2

A patterned substrate comprising a first metal pattern overlying a substrate and a second metal pattern on the side of said substrate opposing said overlying metal pattern wherein the thickness of said substrate is less than about 1.25 mm and said substrate includes a light scattering medium, and said substrate further includes a dye capable of fluorescing upon interacting with light, wherein said dye is distributed in regions of said substrate underlying or overlying said first metal pattern and said second metal pattern, and wherein said dye has a chemical structure represented by a member chosen from the group consisting of (1) ##STR3## and (2) ##STR4## where Y is SO 3 G, (G is an alkali metal cation), or H, R 1 and R 2 are individually hydrogen, methyl, or ethyl, and R 3 is a lower alkyl, p-tolyl, xylyl, or hydrogen, and Z - is Cl - , Br - , I - , NO 3 - , or p-toluenesulfonate.

Claim 3

The patterned substrate of claim 1 wherein said light scattering medium comprises titanium dioxide.

Claim 4

The patterned substrate of claim 1 wherein said substrate comprises a cured epoxy resin.

Claim 5

The patterned substrate of claim 3 wherein said dye is chemically bound to said substrate.

Claim 6

The patterned substrate of claim 4 wherein said light scattering medium comprises titanium dioxide.

Claim 7

The patterned substrate of claim 4 wherein said first metal pattern and said second metal pattern comprise copper metal patterns.

Claim 8

The patterned substrate of claim 1 wherein said dye denominated (1) is employed where R 1 , R 2 and R 3 are hydrogen and where said dye is reacted with bisphenol-A diglycidyl ether.

Claim 9

A process for detecting flaws in a first metal pattern which is formed on a substrate that has a second metal pattern on the side of said substrate opposing said metal pattern comprising the steps of illuminating said substrate with a source of electromagnetic radiation, detecting the resulting fluorescence from said substrate, and further processing said substrate on the basis of said detection wherein the thickness of said substrate is less than about 1.25 mm and said substrate includes a electromagnetic radiation scattering medium, and said substrate includes a dye capable of fluorescing, wherein said dye is distributed in regions of said substrate underlying or overlying said first metal pattern and said second metal pattern, and wherein said dye comprises a material having a chemical structure represented by a member chosen from the group consisting of (1) ##STR5## and (2) ##STR6## where Y is SO 3 G or hydrogen, G is an alkali metal cation, R 1 and R 2 are individually hydrogen, methyl, or ethyl, and R 3 is a lower alkyl, p-tolyl, xylyl, or hydrogen, and Z - is Cl - , Cr - , I - , NO 3 - or p-toluenesulfonate.

Claim 10

A process for detecting flaws in a first metal pattern which is formed on a substrate that has a second metal pattern on the side of said substrate opposing said metal pattern comprising the steps of illuminating said substrate with a source of electromagnetic radiation, detecting the resulting fluorescence from said substrate, and further processing said substrate on the basis of said detection wherein the thickness of said substrate is less than about 1.25 mm and said substrate includes a electromagnetic radiation scattering medium, and said substrate includes a dye capable of fluorescing, wherein said dye is distributed in regions of said substrate underlying or overlying said first metal pattern and said second metal pattern, and wherein said dye comprises a material having a chemical structure represented by a member chosen from the group consisting of (1) ##STR5## and (2) ##STR6## where Y is SO 3 G or hydrogen, G is an alkali metal cation, R 1 and R 2 are individually hydrogen, methyl, or ethyl, and R 3 is a lower alkyl, p-tolyl, xylyl, or hydrogen, and Z - is Cl - , Cr - , I - , NO 3 - or p-toluenesulfonate.

Claim 11

The process of claim 7 wherein said scattering medium comprises titanium dioxide.

Claim 12

The process of claim 7 wherein said substrate comprises a cured epoxy resin.

Claim 13

The process of claim 9 wherein said dye is chemically bound to said substrate.

Claim 14

The process of claim 10 wherein said scattering medium comprises titanium dioxide.

Claim 15

The process of claim 10 wherein said first metal pattern and said second metal pattern comprise copper metal patterns.

Claim 16

The process of claim 7 wherein said dye denominated (1) is employed, where R 1 , R 2 and R 3 are hydrogen and where said dye is reacted with bisphenol-A diglycidyl ether.