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Process for preparing the printed-circuit boards using a photosensitive composition containing a reduction type leico pigment

Assignee: Kansai Paint Co Ltd
•
Filing: 1990-03-21
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Granted: 1990-10-23
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Expires: 2010-03-21
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Abstract

Abstract Disclosed is an improved process for preparing the printed circuit board, which comprises coating a photo-curable electrodeposition coating composition on the surface of the copper foil of a copper-clad, laminated plate to form a photo-sensitive resist film thereon, lapping a photographic negative or positive film onto the photo-sensitive resist film, and exposing to an active light, followed by development, the improvement comprising incorporating a colorless or substantially colorless reduction-type leico pigment into the electrodeposition coating composition to form a photo-sensitive resist film containing the leico pigment, and to develop a color in an exposed area of the photo-sensitive resist film by exposing to the active light.

Inventors

  • 👤 Tsutomu Maruyama
  • 👤 Kiyotake Fukawa
  • 👤 Atsushi Akiyama
  • 👤 Yoshihiro Kiyomura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 17:49
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/105; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K1/0269; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; H05K2203/16; H05K2203/161; H05K3/00; H05K3/0073; H05K3/0076; H05K3/02; H05K3/06; H05K3/061; H05K3/064

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 104 words
An improved process for preparing the printed circuit board, which comprises coating a photo-curable electrodeposition coating composition on the surface of the copper foil of a copper-clad, laminated plate to form a photo-sensitive resist film thereon, lapping a photographic negative or positive film onto the photo-sensitive resist film, and exposing to an active light, followed by development, the improvement comprising incorporating a colorless or substantially colorless reduction-type leico pigment into the electrodeposition coating composition to form a photo-sensitive resist film containing the leico pigment, and to develop a color in an exposed area of the photo-sensitive resist film by exposing to the active light.
Claim 2
Dependent Claim 104 words
An improved process for preparing the printed circuit board, which comprises coating a photo-curable electrodeposition coating composition on the surface of the copper foil of a copper-clad, laminated plate to form a photo-sensitive resist film thereon, lapping a photographic negative or positive film onto the photo-sensitive resist film, and exposing to an active light, followed by development, the improvement comprising incorporating a colorless or substantially colorless reduction-type leico pigment into the electrodeposition coating composition to form a photo-sensitive resist film containing the leico pigment, and to develop a color in an exposed area of the photo-sensitive resist film by exposing to the active light.
Claim 3
Dependent Claim 50 words
An improved process as claimed in claim 1, wherein the photo-curable electrodeposition coating composition is selected from a photographic negative type anionic electrodeposition coating composition, a photographic negative type cationic electrodeposition coating composition, a photographic positive type anionic electrodeposition coating composition and a photographic positive type cationic electrodeposition coating composition.
Claim 4
Dependent Claim 55 words
An improved process as claimed in claim 1, wherein the leico pigment is represented by the following general formula (I): ##STR3## where R 1 , R 2 , R 3 and R 4 represent hydrogen atom or an alkyl group having 1 to 4 carbon atoms respectively, and R 5 represents the following groups: ##STR4##
Claim 5
Dependent Claim 26 words
An improved process as claimed in claim 1, wherein the leico pigment is selected from Leico Crystal Violet, Naphthalene Green V. Fuchsine, and Patent Blue V.
Claim 6
Dependent Claim 38 words
An improved process as claimed in claim 1, wherein the leico pigment is used in an amount of 0.05 to 5% by weight based on an amount of a resin for use in the photo-curable electrodeposition coating composition.

References Cited (Backward Citations)

US4425424A Cited
US4687728A Cited
US4634655A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-10-22 1994-04-23 1994-10-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-10-22 1998-04-23 1998-10-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-10-22 2002-04-23 2002-10-23 $7700.00 Window Closed / Lapsed

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