Process for preparing the printed-circuit boards using a photosensitive composition containing a reduction type leico pigment
Abstract
Abstract Disclosed is an improved process for preparing the printed circuit board, which comprises coating a photo-curable electrodeposition coating composition on the surface of the copper foil of a copper-clad, laminated plate to form a photo-sensitive resist film thereon, lapping a photographic negative or positive film onto the photo-sensitive resist film, and exposing to an active light, followed by development, the improvement comprising incorporating a colorless or substantially colorless reduction-type leico pigment into the electrodeposition coating composition to form a photo-sensitive resist film containing the leico pigment, and to develop a color in an exposed area of the photo-sensitive resist film by exposing to the active light.
Inventors
- 👤 Tsutomu Maruyama
- 👤 Kiyotake Fukawa
- 👤 Atsushi Akiyama
- 👤 Yoshihiro Kiyomura
Bibliographic Details
Claims Analysis
Total Claims: 6References Cited (Backward Citations)
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