V-shaped clip for attaching a semiconductor device to a heat sink

Claim 1

A clip for attaching a semiconductor to a heat sink comprising: a first surface, said first surface having a flat section with a pair of sidewalls extending downwardly therefrom so as to define an opening adapted to receive a semiconductor when said clip is in use wherein said flat section contacts the semiconductor which is held in place by said sidewalls, said flat section being connected to an upwardly angled spring section, an attachment means, said attachment means connected to said spring section of said first surface, said attachment means comprising a V-shaped portion having at least a first and a second leg, said legs being joined at one end to form an apex and being spaced apart at their opposite ends, said V-shaped portion having a connecting leg, said connecting leg being attached to said spring section, said V-shaped portion having lip means and shelf means which are spaced apart, whereby when said clip is in use said V-shaped portion, which si resilient, is compressed so as to insert it into a slot in the heat sink, so that when said V-shaped portion is allowed to flex back to is normal position, the portion of the heat sink adjacent to the slot is secured between said lip means and said shelf means and as a result when a semiconductor is placed in said opening, said spring section forces said flat section in a direction parallel to said V-shaped portion against said semiconductor to hold it in place on the heat sink.