Integrated electrical conducting, cooling and clamping assembly for power semiconductors

Claim 2

A multiple phase electronic semiconductor package comprising; a stack of electrically conductive plates, including two opposite end plates, at least one interposed semiconductor component and two side plates flanking said stack; the height of said side plates being less than the height of said conductive plates and semiconductor components; and a means to secure said opposite end plates to said side plates causing a pre-determined amount of pressure between said conductive plates and semiconductor components.

Claim 3

A multiple phase electronic semiconductor package of claim 1 where said means securing said end plates to said side plates causes said conductive plates and semiconductor components to compress to a height substantially equal to the height of said side plates.

Claim 4

A multiple phase electronic semiconductor package of claim 1 where said package includes coolant inlet and exit caps at opposite ends of said package.

Claim 5

A multiple phase electronic semiconductor package of claim 3 where said conductive plates include passages extending therethrough.

Claim 6

A multiple phase electronic semiconductor package of claim 4 where fluid flow into said coolant inlet cap, through said passages in said conductive plates and out the coolant exit cap.

Claim 7

A multiple phase electronic semiconductor package comprising; a stack of electrically conductive plates, including two opposed clamping plates, at least one interposed semiconductor component and two side plates flanking said stack; the height of said side plates being a predetermined amount less than the combined height of said stack of the electrically conductive plates and semiconductor components when unstressed; a means to secure said opposed clamping plates to said side plates; said means causing said opposed clamping plates to abut said side plates and causing a predetermined amount of pressure between said conductive plates and semiconductor components; and said side plates thermally expanding with said conductive and semiconductor plates during use.

Claim 8

A multiple phase electronic semiconductor package comprising; a stack of electrically conductive plates, including two opposed clamping plates, at least one interposed semiconductor component and two side plates flanking said stack; the height of said side plates being a predetermined amount less than the combined height of said stack of the electrically conductive plates and semiconductor components when unstressed; a means to secure said opposed clamping plates to said side plates; said means causing said opposed clamping plates to abut said side plates and causing a predetermined amount of pressure between said conductive plates and semiconductor components; and said side plates thermally expanding with said conductive and semiconductor plates during use.

Claim 9

The multiple phase electronic semiconductor package of claim 6 where said means securing said opposite end plates to said side plates causes tension in said side plates.

Claim 10

The multiple phase electronic semiconductor package of claim 6 where said conductive plates include passages extending therethrough.

Claim 11

The multiple phase electronic semiconductor package of claim 8 where coolant inlet and exit caps are disposed at opposite ends of said package, said caps including passages extending from the caps into said package.

Claim 12

The multiple phase electronic semiconductor package of claim 9 where fluid is introduced in said package at said coolant inlet cap and passes through said passages in said conductive plates and exits said package at said exit cap, and thereby uniformly cools the package.

Claim 13

A multiple phase electronic semiconductor package comprising; a stack of electrically conductive plates, said plates including a plurality of passages extending therethrough, said stack including two opposed clamping plates, at least one interposed semiconductor component and two side plates flanking said stack; the height of said side plates being a predetermined amount less than the combined height of said stack of said electrically conductive plates and semiconductor components when unstressed, the length of said side plates equal to the length of said end plates, the side plates being a constant thickness throughout; a plurality of equally spaced threaded fasteners extending through said opposed clamping plates and into said side plates; said fasteners causing said opposed clamping plates to abut said side plates, and thereby causing a predetermined amount of pressure between said conductive plates and semiconductor components; said side plates thermally expanding with said conductive plates and semiconductor components during use, said pressure between said conductive plates and semiconductor is maintained relatively constant throughout; a coolant inlet cap and exit cap disposed at opposite ends of said package, both caps including at least one passage(s) for fluid to pass through; and means within said package interconnecting the passages of said caps and defining a coolant flow path thru said package in heat transfer relative to said semiconductor.

Claim 14

A multiple phase electronic semiconductor package comprising; a stack of electrically conductive plates, said plates including a plurality of passages extending therethrough, said stack including two opposed clamping plates, at least one interposed semiconductor component and two side plates flanking said stack; the height of said side plates being a predetermined amount less than the combined height of said stack of said electrically conductive plates and semiconductor components when unstressed, the length of said side plates equal to the length of said end plates, the side plates being a constant thickness throughout; a plurality of equally spaced threaded fasteners extending through said opposed clamping plates and into said side plates; said fasteners causing said opposed clamping plates to abut said side plates, and thereby causing a predetermined amount of pressure between said conductive plates and semiconductor components; said side plates thermally expanding with said conductive plates and semiconductor components during use, said pressure between said conductive plates and semiconductor is maintained relatively constant throughout; a coolant inlet cap and exit cap disposed at opposite ends of said package, both caps including at least one passage(s) for fluid to pass through; and means within said package interconnecting the passages of said caps and defining a coolant flow path thru said package in heat transfer relative to said semiconductor.