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US4960610A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of treating semiconductor wafers in a magnetically confined plasma at low pressure by monitoring peak to peak voltage of the plasma

Assignee: CollabRx Inc
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Filing: 1989-11-13
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Granted: 1990-10-02
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Expires: 2009-11-13
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Abstract

Abstract In a magnetically confined plasma, optimal pressure is found by measuring the peak to peak voltage of the plasma and looking for a distinct minimum in the peak to peak voltage. The pressure at which the minimum occurs can be used to calibrate a manometer used in the system.

Inventors

  • 👤 Ole Krogh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 14:59
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32917; H01J37/32935; H01J37/32431; H01J37/3244

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 61 words
In a process for treating a semiconductor wafer in a chamber containing an RF induced, magnetically confined glow discharge at a pressure below two hundred millitorr, the improvement comprising the steps of: monitoring the peak to peak voltage in said chamber; and maintaining the gas pressure within said chamber at a value corresponding approximately to the minimum peak to peak voltage
Claim 2
Dependent Claim 61 words
In a process for treating a semiconductor wafer in a chamber containing an RF induced, magnetically confined glow discharge at a pressure below two hundred millitorr, the improvement comprising the steps of: monitoring the peak to peak voltage in said chamber; and maintaining the gas pressure within said chamber at a value corresponding approximately to the minimum peak to peak voltage
Claim 3
Dependent Claim 58 words
The process as set forth in claim 1 wherein said maintaining step comprises: supplying one or more gases to said chamber at or below a predetermined flow; exhausting said chamber with a pump having a capacity greater than said predetermine flow; and regulating the exhausting of said chamber with a valve interposed between said chamber and said pump.
Claim 4
Dependent Claim 31 words
The process as set forth in claim 1 and further comprising the step of: adjusting the pressure in said chamber to an initial value by monitoring the pressure within said chamber.
Claim 5
Dependent Claim 45 words
The process as set forth in claim 1 wherein said value is retained as a reference value and further comprising the steps of: adjusting the pressure in said chamber to a value higher than said reference value, and treating said wafer at said higher value.
Claim 6
Dependent Claim 57 words
In a process for treating a semiconductor wafer in a chamber containing an RF induced, magnetically confined glow discharge at a pressure below two hundred millitorr, the improvement comprising the steps of: monitoring the ion density in said chamber; and maintaining the gas pressure within said chamber at a value corresponding approximately to the maximum ion density.
Claim 7
Dependent Claim 57 words
In a process for treating a semiconductor wafer in a chamber containing an RF induced, magnetically confined glow discharge at a pressure below two hundred millitorr, the improvement comprising the steps of: monitoring the ion density in said chamber; and maintaining the gas pressure within said chamber at a value corresponding approximately to the maximum ion density.
Claim 8
Dependent Claim 31 words
The process as set forth in claim 5 and further comprising the step of: adjusting the pressure in said chamber to an initial value by monitoring the pressure within said chamber.

References Cited (Backward Citations)

US4609426A Cited
US4683838A Cited
US4602981A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-10-01 1994-04-02 1994-10-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-10-01 1998-04-02 1998-10-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-10-01 2002-04-02 2002-10-02 $7700.00 Window Closed / Lapsed

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