Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
60 words
A heterojunction bipolar transistor (HBT) comprising: a silicon collector layer of a first conductivity type; a base region of a second conductivity type formed adjacent to the collector layer; an epitaxially grown gallium phosphide (GaP) region formed on top of of the base region; and an epitaxially grown silicon emitter of the first conductivity type formed over the GaP region.
Claim 2
Dependent Claim
60 words
A heterojunction bipolar transistor (HBT) comprising: a silicon collector layer of a first conductivity type; a base region of a second conductivity type formed adjacent to the collector layer; an epitaxially grown gallium phosphide (GaP) region formed on top of of the base region; and an epitaxially grown silicon emitter of the first conductivity type formed over the GaP region.
Claim 3
Dependent Claim
17 words
The HBT of claim 1 wherein the GaP region is from 0.01 microns to 0.03 microns thick.
Claim 4
Dependent Claim
16 words
The HBT of claim 1 wherein the GaP region is essentially free of lattice mismatch defects.
Claim 5
Dependent Claim
80 words
A heterojunction bipolar transistor (HBT) comprising: a silicon layer of a first conductivity type which serves as a collector; a base region of a second conductivity type formed on the silicon layer of a first conductivity type; an epitaxially grown coherently strained region formed on top of the base region, wherein the coherently strained region has a wider bandgap than that of silicon; and an epitaxially grown silicon emitter of the first conductivity type formed over the coherently strained region.
Claim 6
Dependent Claim
80 words
A heterojunction bipolar transistor (HBT) comprising: a silicon layer of a first conductivity type which serves as a collector; a base region of a second conductivity type formed on the silicon layer of a first conductivity type; an epitaxially grown coherently strained region formed on top of the base region, wherein the coherently strained region has a wider bandgap than that of silicon; and an epitaxially grown silicon emitter of the first conductivity type formed over the coherently strained region.
Claim 7
Dependent Claim
21 words
The HBT of claim 4 wherein the coherently strained region comprises a material with a lattice constant which closely matches silicon.
Claim 8
Dependent Claim
30 words
The HBT of claim 4 wherein the thickness of the coherently strained region is such that hole tunneling through the coherently strained region is significantly less probable than electron tunneling.
Claim 9
Dependent Claim
14 words
The HBT of claim 4 wherein the silicon emitter has a graded doping concentration.
Claim 10
Dependent Claim
14 words
The HBT of claim 4 wherein the silicon emitter has an abrupt doping concentration.
Claim 11
Dependent Claim
54 words
A heterojunction bipolar transistor (HBT) comprising: a silicon substrate of a first conductivity type which serves as a collector; a base region of a second conductivity type formed in the substrate; an emitter multilayer formed in contact with the base region, wherein the emitter multilayer forms a valence band discontinuity with the base region.
Claim 12
Dependent Claim
54 words
A heterojunction bipolar transistor (HBT) comprising: a silicon substrate of a first conductivity type which serves as a collector; a base region of a second conductivity type formed in the substrate; an emitter multilayer formed in contact with the base region, wherein the emitter multilayer forms a valence band discontinuity with the base region.
Claim 13
Dependent Claim
15 words
The HBT of claim 9 wherein the valence band discontinuity is greater than 0.25 eV.
Claim 14
Dependent Claim
41 words
The HBT of claim 9 wherein the emitter multilayer comprises a GaP layer which is formed in contact with the base region and a silicon emitter layer of the first conductivity type which is formed in contact with the GaP layer.