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US4956411A
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Epoxy resin composition for composite material from m- or o-substituted triglycidylaminophenols, diaminodiphenylsulfone and latent curing agents
Assignee: Mitsubishi Chemical Corp
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Filing: 1989-01-30
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Granted: 1990-09-11
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Expires: 2009-01-30
Abstract
Abstract An epoxy resin composition is disclosed that can be cured at a temperature of 150 DEG C. or below, and can be used to provide a high performance carbon fiber composite material having a 0 DEG direction bending strength of 220 kg/mm2 or over, and an interlayer shear strength of 10 kg/mm2 or over. The composition is made up of: (A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenyl-ester or its oligomer, (B) diaminodiphenylsulfone and/or diaminodiphenylmethane, (C) dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipil dihydrazide, azelayl dihydrazide, or isophthalic acid dihydrazide, and (D) a urea compound.
Inventors
- 👤 Hisashi Tada
- 👤 Yoshinobu Shiraishi
- 👤 Shigetsugu Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:54
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/68; C08G59/686; C07; C07D; C07D303/00; C07D303/02; C07D303/36; C08G59/32; C08G59/3227; C08G59/40; C08G59/4007; C08G59/4014; C08G59/50; C08G59/5033; C08G59/56; C08J; C08J5/00; C08J5/24; C08L; C08L63/00; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
151 words
An epoxy resin composition for composite materials, comprising: (A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenylglycidyl-ether or its oligomer, (B) a diaminodiphenylsulfone and/or a diaminodiphenylmethane in an amount of 50 to 200% for the total epoxy equivalent of the epoxy compound, (C) 1 to 10 parts by weight of at least one compound selected from the group consisting of dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipyl dihydrazide, azelayl dihydrazide, and isophthalic acid dihydrazide for 100 parts by weight of the epoxy compound, and (D) 1.5 to 15 parts by weight of one or more of urea compounds represented by the following general formula: ##STR12## wherein X 1 and X 2 , which may be the same or different, each represents --Cl, --Br, --NO 2 , --CH 3 , --H, --OCH.sub. 3, --C 2 H 5 , or ##STR13## for 100 parts by weight of the epoxy compound.
Claim 2
Dependent Claim
151 words
An epoxy resin composition for composite materials, comprising: (A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenylglycidyl-ether or its oligomer, (B) a diaminodiphenylsulfone and/or a diaminodiphenylmethane in an amount of 50 to 200% for the total epoxy equivalent of the epoxy compound, (C) 1 to 10 parts by weight of at least one compound selected from the group consisting of dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipyl dihydrazide, azelayl dihydrazide, and isophthalic acid dihydrazide for 100 parts by weight of the epoxy compound, and (D) 1.5 to 15 parts by weight of one or more of urea compounds represented by the following general formula: ##STR12## wherein X 1 and X 2 , which may be the same or different, each represents --Cl, --Br, --NO 2 , --CH 3 , --H, --OCH.sub. 3, --C 2 H 5 , or ##STR13## for 100 parts by weight of the epoxy compound.
Claim 3
Dependent Claim
35 words
The composition of claim 1, wherein a phenol-novolak epoxy resin and/or a cresol-novolak epoxy resin is used as an epoxy compound in combination with the component (A), that is, m- or o-methyl-p-N,N-diglycidyl-aminophenylglycidyl-ether or its oligomer.
Claim 4
Dependent Claim
11 words
The composition of claim 1, wherein the component (C) is dicyandiamide.
Claim 5
Dependent Claim
21 words
The composition of claim 1, wherein each of X 1 and X 2 in the component (D) represents a chlorine atom.
References Cited (Backward Citations)
JPS5840975A
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US4480082A
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JPS59176316A
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US4714648A
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JPS6215570A
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JPS6257416A
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EP0217657A2
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JPS62183341A
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JPS62183342A
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JPS62183340A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-09-10 | 1994-03-12 | 1994-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-10 | 1998-03-12 | 1998-09-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-10 | 2002-03-12 | 2002-09-11 | $7700.00 | Window Closed / Lapsed |