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US4953834A Expired / Lapsed US ⏱️ 0.0 years remaining

Pendulum with bending spring joint

Assignee: Northrop Grumman Litef GmbH
•
Filing: 1988-01-20
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Granted: 1990-09-04
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Expires: 2008-01-20
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Abstract

Abstract A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.

Inventors

  • 👤 Wolfram Ebert
  • 👤 Eberhard Handrich
  • 👤 Martin Hafen
  • 👤 Bruno Ryrko

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 21:17
CPC Classifications
F; F16; F16F; F16F1/00; F16F1/02; F16F1/18; F16C; F16C11/00; F16C11/04; F16C11/12

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 83 words
A pendulum device comprising in combination: (a) a generally T-shaped pendulum; (b) a pendulum fastening device; (c) said pendulum and said pendulum fastening device being formed from a wafer; (d) said pendulum being joined to said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer; and (e) said pendulum device being selectively etched from a single wafer.
Claim 2
Dependent Claim 83 words
A pendulum device comprising in combination: (a) a generally T-shaped pendulum; (b) a pendulum fastening device; (c) said pendulum and said pendulum fastening device being formed from a wafer; (d) said pendulum being joined to said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer; and (e) said pendulum device being selectively etched from a single wafer.
Claim 3
Dependent Claim 17 words
A pendulum device as defined in claim 1 further characterized in that said wafer is of silicon.
Claim 4
Dependent Claim 98 words
A pendulum device comprising, in combination: (a) a generally T-shaped pendulum; (b) a pendulum fastening device; (c) said pendulum and said pendulum fastening device being formed from a generally-planar wafer; (d) said pendulum being joined at said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs so arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer as to cross in a plane perpendicular to the plane of said wafer; and (e) said pendulum device being selectively etched from a single wafer.
Claim 5
Dependent Claim 98 words
A pendulum device comprising, in combination: (a) a generally T-shaped pendulum; (b) a pendulum fastening device; (c) said pendulum and said pendulum fastening device being formed from a generally-planar wafer; (d) said pendulum being joined at said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs so arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer as to cross in a plane perpendicular to the plane of said wafer; and (e) said pendulum device being selectively etched from a single wafer.
Claim 6
Dependent Claim 17 words
A pendulum device as defined in claim 3 further characterized in that said wafer is of silicon.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-09-03 1994-03-05 1994-09-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-09-03 1998-03-05 1998-09-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-09-03 2002-03-05 2002-09-04 $7700.00 Window Closed / Lapsed

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