Patent US4951124A successfully refreshed from Google Patents.
US4951124A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Toshiba Corp
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Filing: 1989-04-28
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Granted: 1990-08-21
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Expires: 2009-04-28
Abstract
Abstract A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.
Inventors
- 👤 Hiromichi Sawaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 13:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/308; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H05K1/00; H05K1/02; H05K1/0201; H05K2201/00; H05K2201/06; H05K2201/066; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/0979; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10696; H05K2201/10742; H05K2201/1075; H05K2201/10787; H05K2201/10856; H05K2201/10871; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
178 words
A semiconductor device comprising: a package having a front surface, a back surface, and a bottom surface; a heat sink disposed in said front surface and a semiconductor pellet disposed between said front and back surfaces; a plurality of external lead-in wires extending from said bottom surface of said package, selected ones of said lead-in wires being bent at a predetermined interval toward said back surface of said package to form a first row of external lead-in wires, the remaining ones of said external lead-in wires forming a second row offset with respect to said first row; and projection means, formed on selected ones of said second row of external lead-in wires, for offsetting a force applied to said external lead-in wires by the weight of said heat sink to thereby prevent tilting of said package about said external lead-in wires and to prevent subsequently formed cracks in said pellet when the tilting is forcibly reversed, said projection means extending substantially perpendicular to respective ones of said outermost external lead-in wires toward said front surface of said package.
Claim 2
Dependent Claim
178 words
A semiconductor device comprising: a package having a front surface, a back surface, and a bottom surface; a heat sink disposed in said front surface and a semiconductor pellet disposed between said front and back surfaces; a plurality of external lead-in wires extending from said bottom surface of said package, selected ones of said lead-in wires being bent at a predetermined interval toward said back surface of said package to form a first row of external lead-in wires, the remaining ones of said external lead-in wires forming a second row offset with respect to said first row; and projection means, formed on selected ones of said second row of external lead-in wires, for offsetting a force applied to said external lead-in wires by the weight of said heat sink to thereby prevent tilting of said package about said external lead-in wires and to prevent subsequently formed cracks in said pellet when the tilting is forcibly reversed, said projection means extending substantially perpendicular to respective ones of said outermost external lead-in wires toward said front surface of said package.
Claim 3
Dependent Claim
25 words
A semiconductor device according to claim 1, wherein each said projection includes a distal end portion extending substantially parallel to said outermost external lead-in wires.
Claim 4
Dependent Claim
23 words
A semiconductor device according to claim 1, wherein said projection is formed on each of said external lead-in wires of said second row.
References Cited (Backward Citations)
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US4707726A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-20 | 1994-02-19 | 1994-08-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-20 | 1998-02-19 | 1998-08-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-20 | 2002-02-19 | 2002-08-21 | $7700.00 | Window Closed / Lapsed |