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US4949156A
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Semiconductor string connection structure
Assignee: Individual
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Filing: 1988-02-10
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Granted: 1990-08-14
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Expires: 2008-02-10
Abstract
Abstract A semiconductor string connection structure comprising a plurality of encasements, each of which has a light emitting diode chip and a pair of conducting leads, a plurality of binding pieces connected between the encasements, a plurality of longitudinal pieces disposed between two pairs of the conducting leads or at the right-most or left-most side thereof, a plurality of transverse thin pieces connected with the leads and longitudinal pieces, and a transverse plate disposed and connected with lower ends of the leads and longitudinal piece. The transverse plate serves as a common line, therefore, the lower half of the semiconductor string connection structure is folded 180 degrees such that the whole structure can be mounted on a circuit board to form a large display.
Inventors
- 👤 Adam Mii
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 12:58
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/857; G; G09; G09F; G09F9/00; G09F9/30; G09F9/33; H10W; H10W90/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
142 words
A semiconductor string connection structure comprising: a plurality of encasements, each of which encloses a semiconductor chip, and a plurality of conducting leads projecting parallel from one end thereof; a transverse plate integral with said plurality of conducting leads and disposed at an end opposite to the encasements; a plurality of longitudinal pieces, each longitudinal piece disposed between two pairs of said conducting leads and integral with the transverse plate; a plurality of stop pieces, integrally formed with the conducting leads and disposed at a midpoint of the conducting leads; a plurality of binding pieces integrally formed with the disposed between each encasement; a plurality of transverse thin pieces, integral with the conducting leads and/or the longitudinal pieces and disposed between the conducting leads and longitudinal pieces; and a plurality of positioning holes uniformly disposed along a length of the transverse piece.
Claim 2
Dependent Claim
142 words
A semiconductor string connection structure comprising: a plurality of encasements, each of which encloses a semiconductor chip, and a plurality of conducting leads projecting parallel from one end thereof; a transverse plate integral with said plurality of conducting leads and disposed at an end opposite to the encasements; a plurality of longitudinal pieces, each longitudinal piece disposed between two pairs of said conducting leads and integral with the transverse plate; a plurality of stop pieces, integrally formed with the conducting leads and disposed at a midpoint of the conducting leads; a plurality of binding pieces integrally formed with the disposed between each encasement; a plurality of transverse thin pieces, integral with the conducting leads and/or the longitudinal pieces and disposed between the conducting leads and longitudinal pieces; and a plurality of positioning holes uniformly disposed along a length of the transverse piece.
Claim 3
Dependent Claim
100 words
A semiconductor string connection structure as set forth in claim 1, wherein: the transverse thin pieces are cut away after fabrication; the binding pieces are cut away after fabrication; the conducting leads not intended to be collectively connected are separated from the transverse plate; the conducting leads attached to the transverse plate are folded 90 degrees twice, such that respective free ends of the longitudinal pieces are directed in a same direction as the free ends of said separated conducting leads; a plurality of longitudinal pieces are cut away after fabrication; and the lead frame is separable into various lengths.
Claim 4
Dependent Claim
30 words
A semiconductor string connection structure as in claim 1, wherein said encasement encloses more than one semiconductor chip and an additional conducting lead is provided for each additional semiconductor chip.
Claim 5
Dependent Claim
30 words
A semiconductor string connection structure as in claim 1, wherein said transverse plate is of sufficient width to adequately conduct the total electrical current required for all the semiconductor chips.
Claim 6
Dependent Claim
34 words
A semiconductor string connection structure as in claim 1, wherein the transverse plate is folded 180 degrees along a line perpendicular to the conducting leads and midway along the width of said transverse plate.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-13 | 1994-02-12 | 1994-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-13 | 1998-02-12 | 1998-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-13 | 2002-02-12 | 2002-08-14 | $7700.00 | Window Closed / Lapsed |