Patent US4394487A successfully refreshed from Google Patents.
Patent US3963623A successfully refreshed from Google Patents.
Patent US4948700A successfully refreshed from Google Patents.
US4948700A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Liquid light-sensitive resinous composition
Assignee: Fujifilm Holdings Corp
•
Filing: 1989-08-03
•
Granted: 1990-08-14
•
Expires: 2009-08-03
Abstract
Abstract A liquid heat- and light-sensitive resinous composition which contains as main components (A) a photopolymerizable compound prepared by reacting a novolak type epoxy compound with successively, an unsaturated monocarboxylic acid represented by at least one of formula (I) and (II) and a saturated or unsaturated polybasic acid anhydride, (B) a photopolymerizable compound having at least one ethylenic unsaturated double bond, (C) an epoxy compound having at least one epoxy group, (D) a photopolymerization initiator, (E) a thermosetting catalysts capable of making an epoxy group undergo a thermal reaction, and (F) an organic solvent; <IMAGE> (I) <IMAGE> (II) wherein R represents -H or -CH3; R1, R2 and R3 each represents an unsubstituted or substituted alkylene group, an unsubstituted or substituted arylene group, or an unsubstituted or substituted aralkylene group; and X represents -COO-, -OCO- or -O-. The composition exhibits photo- and thermocurability, developability with an alkaline aqueous solution and ability to form a permanent protective mask for printed circuit boards.
Inventors
- 👤 Minoru Maeda
- 👤 Yuichi Wakata
- 👤 Sadao Fujikura
- 👤 Masayuki Iwasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:15
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; C; C08; C08F; C08F299/00; C08F299/02; C08F299/026; C08G; C08G59/00; C08G59/14; C08G59/1433; C08G59/1438; C08G59/1455; C08G59/1461; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
137 words
A liquid heat-sensitive and light-sensitive resinous composition containing as main components (A) a photopolymerizable compound prepared by reacting a novolak type epoxy compound with, successively, an unsaturated monocarboxylic acid represented by at least one of formula (I) and (II) and a saturated or unsaturated polybasic acid anhydride, (B) a photopolymerizable compound having at least one ethylenic unsaturated double bond, (C) an epoxy compound having at least one epoxy group, (D) a photopolymerization initiator, (E) a thermosetting catalysts capable of making an epoxy group undergo a thermal reaction, and (F) an organic solvent: ##STR8## wherein R represents --H or --CH 3 ; R 1 , R 2 and R 3 each represents an unsubstituted or substituted alkylene group, an unsubstituted or substituted arylene group, or an unsubstituted or substituted aralkylene group, and X represents --COO--, --OCO-- or --O--.
Claim 2
Dependent Claim
137 words
A liquid heat-sensitive and light-sensitive resinous composition containing as main components (A) a photopolymerizable compound prepared by reacting a novolak type epoxy compound with, successively, an unsaturated monocarboxylic acid represented by at least one of formula (I) and (II) and a saturated or unsaturated polybasic acid anhydride, (B) a photopolymerizable compound having at least one ethylenic unsaturated double bond, (C) an epoxy compound having at least one epoxy group, (D) a photopolymerization initiator, (E) a thermosetting catalysts capable of making an epoxy group undergo a thermal reaction, and (F) an organic solvent: ##STR8## wherein R represents --H or --CH 3 ; R 1 , R 2 and R 3 each represents an unsubstituted or substituted alkylene group, an unsubstituted or substituted arylene group, or an unsubstituted or substituted aralkylene group, and X represents --COO--, --OCO-- or --O--.
Claim 3
Dependent Claim
66 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein R represents --H or --CH 3 ; R 1 , R 2 and R 3 each represents an unsubstituted or substituted alkylene group containing 1 to 10 carbon atoms, an unsubstituted or substituted arylene group containing 6 to 12 carbon atoms, or an unsubstituted or substituted aralkylene group containing 7 to 21 carbon atoms.
Claim 4
Dependent Claim
66 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein R represents --H or --CH 3 ; R 1 , R 2 and R 3 each represents an unsubstituted or substituted alkylene group containing 2 to 6 carbon atoms, an unsubstituted or substituted arylene group containing 6 to 10 carbon atoms, or an unsubstituted or substituted aralkylene group containing 7 to 15 carbon atoms.
Claim 5
Dependent Claim
70 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein the unsaturated carboxylic acid reacted with the novolak type epoxy resin is from 0.8 to 1.2 equivalent of carboxyl groups per 1 equivalent of epoxy groups of the novolak type epoxy resin, and the amount of polybasic acid anhydride reacted is from 0.1 to 1.0 equivalent per 1 equivalent of epoxy groups of the novolak type epoxy resin.
Claim 6
Dependent Claim
68 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein the unsaturated carboxylic acid reacted with the novolak type epoxy resin is from 0.9 to 1.1 equivalent of carboxyl groups per 1 equivalent of epoxy groups of the novolak type epoxy resin and the amount of polybasic acid anhydride is 0.3 to 1.0 equivalent per 1 equivalent of epoxy groups of the novolak type epoxy resin.
Claim 7
Dependent Claim
37 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein the photopolymerizable compound comprises from 10 to 60 parts by weight per 100 parts by weight of solid components in the liquid light-sensitive resinous composition.
Claim 8
Dependent Claim
43 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein the photopolymerization initiators are used in an amount of from 0.1 to 20 parts by weight per 100 parts by weight of the solid components in the liquid light-sensitive resinous composition.
Claim 9
Dependent Claim
43 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein the epoxy compounds are used in an amount of from 1 to 40 parts by weight per 100 parts by weight of the solid components in the liquid light-sensitive resinous composition.
Claim 10
Dependent Claim
43 words
A liquid heat-sensitive and light-sensitive resinous composition as in claim 1, wherein the thermosetting catalysts are used in an amount of from 0.01 to 10 parts by weight per 100 parts by weight of the solid components in the liquid light-sensitive resinous composition.
Claim 11
Dependent Claim
91 words
A process for forming an image, comprising coating the liquid heat-sensitive and light-sensitive resinous composition of claim 1 on a substrate, curing the coat sufficiently by heat to render the surface of the coat nonadhesive, contacting the face of a pattern mask to the surface of the coated composition, exposing the coating composition to light through the pattern mask to cure the resinous composition and render it insoluble in an alkaline aqueous solution relative to the non-light-cured composition, and then developing with an alkaline aqueous solution to elute the uncured coat.
Claim 12
Dependent Claim
29 words
A process as in claim 10, wherein said heat curing is carried out from 5 minutes to 10 minutes at a temperature of from 70° C. to 120° C.
Claim 13
Dependent Claim
20 words
A process as in claim 10, wherein the liquid light-sensitive resinous composition is heated after image formation to effect after-curing.
References Cited (Backward Citations)
US4398013A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-13 | 1994-02-12 | 1994-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-13 | 1998-02-12 | 1998-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-13 | 2002-02-12 | 2002-08-14 | $7700.00 | Window Closed / Lapsed |