US4947238A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Submount for semiconductor laser element
Assignee: Mitsubishi Electric Corp
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Filing: 1989-05-01
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Granted: 1990-08-07
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Expires: 2009-05-01
Abstract
Abstract A submount for a semiconductor laser element includes a substrate and a barrier layer disposed on opposed surfaces of the substrate and including a plurality of layers wherein the outermost layer of the barrier layers is Au and Ag. A metal alloy solder layer comprising Sn, Ag, and Sb is deposited on the barrier layers.
Inventors
- 👤 Mitsuo Ishii
- 👤 Seiichi Nagai
- 👤 Kazuyoshi Hasegawa
- 👤 Toshio Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 16:10
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
90 words
A submount for a semiconductor laser element comprising: a substrate having a surface; a barrier layer disposed on the surface of said substrate, said barrier layer including a plurality of layers successively deposited on said substrate, the outermost layer of said barrier layer being one of Au and Ag; and an alloy solder layer comprising about 65 weight percent Sn, about 25 weight percent Ag, and about 10 weight percent Sb disposed on said outermost surface of said barrier layer for attachment of a semiconductor laser element to the submount.
Claim 2
Dependent Claim
90 words
A submount for a semiconductor laser element comprising: a substrate having a surface; a barrier layer disposed on the surface of said substrate, said barrier layer including a plurality of layers successively deposited on said substrate, the outermost layer of said barrier layer being one of Au and Ag; and an alloy solder layer comprising about 65 weight percent Sn, about 25 weight percent Ag, and about 10 weight percent Sb disposed on said outermost surface of said barrier layer for attachment of a semiconductor laser element to the submount.
Claim 3
Dependent Claim
11 words
The submount of claim 1 wherein said substrate is electrically conducting.
Claim 4
Dependent Claim
11 words
The submount of claim 1 wherein said substrate is electrically insulating.
Claim 5
Dependent Claim
20 words
The submount of claim 1 wherein said solder layer is disposed on the entire outermost surfaces of the barrier laters.
Claim 6
Dependent Claim
26 words
The submount of claim 1 wherein said solder layer is disposed on only part of the outermost surface of at least one of said barrier layers.
References Cited (Backward Citations)
US4170472A
Cited
US4480261A
Cited
JPS5858786A
Cited
JPS58138056A
Cited
JPS6081884A
Cited
JPS60103860A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-06 | 1994-02-05 | 1994-08-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-06 | 1998-02-05 | 1998-08-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-06 | 2002-02-05 | 2002-08-07 | $7700.00 | Window Closed / Lapsed |