Patent US4947235A successfully refreshed from Google Patents.
US4947235A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit shield
Assignee: Delphi Technologies Inc
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Filing: 1989-02-21
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Granted: 1990-08-07
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Expires: 2009-02-21
Abstract
Abstract Propagation of electromagnetic interference waves is eliminated or substantially reduced by providing an electromagnetic interference shield suitable for shielding electromagnetic interference or radio frequency interference which are generated by offending components on a monolithic integrated circuit chip. The shield is disposed over the offending components of the integrated circuit and is sufficiently large to eliminate or substantially reduce the propagation of any offending interference waves. Alternatively, the shield may be disposed over a non-offending component to prevent radiated electromagnetic interference from entering the non-offending component. The shield is electrically conductive and maintained at a predetermined, primarily constant, electrical potential with respect to the underlying integrated circuit chip. The shield is integral with the electrically conductive tape used with tape automated bonding manufacturing techniques, or, in an alternative embodiment, the flexible conductive circuitry pattern used with flexible circuitry manufacturing techniques.
Inventors
- 👤 Norman J. Roth
- 👤 Robert J. Wallace
- 👤 Domenica N. Hartman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 12:10
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
169 words
An electrically conductive tape suitable for electrically interconnecting a plurality of bonding sites on a monolithic integrated circuit chip, the electrically conductive tape comprising: a plurality of electrically conductive strips having a first end and a second end, said strips being integral with the electrically conductive tape at said first end, said second end provides the bonding site for electrical connection between said electrically conductive strips and the monolithic integrated circuit chip; and an electrical shield having a first end and a second end, said electrical shield being integral with the electrically conductive tape at said first end and said second end, said electrical shield being maintained at a predetermined, primarily constant, electrical potential with the monolithic integrated circuit chip, and said electrical shield having a portion disposed over a predetermined region of the monolithic integrated circuit chip, said portion being sufficiently large to shield electromagnetic interference generated from electromagnetic generating components on the monolithic integrated circuit yet not so large as to shield the entire monolithic integrated circuit.
Claim 2
Dependent Claim
169 words
An electrically conductive tape suitable for electrically interconnecting a plurality of bonding sites on a monolithic integrated circuit chip, the electrically conductive tape comprising: a plurality of electrically conductive strips having a first end and a second end, said strips being integral with the electrically conductive tape at said first end, said second end provides the bonding site for electrical connection between said electrically conductive strips and the monolithic integrated circuit chip; and an electrical shield having a first end and a second end, said electrical shield being integral with the electrically conductive tape at said first end and said second end, said electrical shield being maintained at a predetermined, primarily constant, electrical potential with the monolithic integrated circuit chip, and said electrical shield having a portion disposed over a predetermined region of the monolithic integrated circuit chip, said portion being sufficiently large to shield electromagnetic interference generated from electromagnetic generating components on the monolithic integrated circuit yet not so large as to shield the entire monolithic integrated circuit.
Claim 3
Dependent Claim
15 words
An electrically conductive tape as recited in claim 1 wherein said electrical conductor comprises copper.
Claim 4
Dependent Claim
18 words
An electrically conductive tape as recited in claim 1 suitable for use with tape automated bonding manufacturing techniques.
Claim 5
Dependent Claim
17 words
An electrically conductive tape as recited in claim 1 suitable for use with flexible circuitry manufacturing techniques.
Claim 6
Dependent Claim
115 words
An interconnection lead suitable for shielding electromagnetic interference generated by offending components on a monolithic integrated circuit chip, said interconnection lead comprising: a first end and a second end, said first and second ends are physically and electrically integral with an electrically conductive tape; means for maintaining a predetermined, primarily constant, electrical potential between said interconnection lead and the monolithic integrated circuit chip; and wherein a portion of said interconnection lead provided between said first and second ends is disposed over the offending components of the monolithic integrated circuit chip and is sufficiently large to shield electromagnetic interference generated by the offending components yet not so large as to shield the entire monolithic integrated circuit.
Claim 7
Dependent Claim
115 words
An interconnection lead suitable for shielding electromagnetic interference generated by offending components on a monolithic integrated circuit chip, said interconnection lead comprising: a first end and a second end, said first and second ends are physically and electrically integral with an electrically conductive tape; means for maintaining a predetermined, primarily constant, electrical potential between said interconnection lead and the monolithic integrated circuit chip; and wherein a portion of said interconnection lead provided between said first and second ends is disposed over the offending components of the monolithic integrated circuit chip and is sufficiently large to shield electromagnetic interference generated by the offending components yet not so large as to shield the entire monolithic integrated circuit.
Claim 8
Dependent Claim
14 words
An interconnection lead as stated in claim 5 wherein said interconnection lead comprises copper.
References Cited (Backward Citations)
US3616546A
Cited
US3754170A
Cited
JPS57464A
Cited
JPS57104243A
Cited
US4423548A
Cited
US4559579A
Cited
US4661837A
Cited
US4514749A
Cited
JPS59205740A
Cited
EP0303974A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-06 | 1994-02-05 | 1994-08-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-06 | 1998-02-05 | 1998-08-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-06 | 2002-02-05 | 2002-08-07 | $7700.00 | Window Closed / Lapsed |