Patent US4944850A successfully refreshed from Google Patents.
US4944850A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tape automated bonded (tab) circuit and method for making the same
Assignee: HP Inc
•
Filing: 1989-12-18
•
Granted: 1990-07-31
•
Expires: 2009-12-18
Abstract
Abstract Improved TAB circuit and method for producing the same. Specifically, new methods and materials are used to electro-plate and test TAB circuits. A typical TAB circuit includes a substrate having a plurality of conductive traces thereon, each trace terminating in a lead. All of the leads extend inwardly into a window through the substrate. To short the leads for electro-plating, a metal conductive portion is provided within the window which is attached to the leads. The conductive portion may consist of a separate unit secured to the leads, or may be integrally formed with the leads as a single unit. Testing of the traces for opens is accomplished by running a current from the conductive portion to the opposite end of each trace. For short testing, the conductive portion is easily severed from all of the leads using a punch assembly or the like.
Inventors
- 👤 John H. Dion
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 09:42
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/241; H05K3/242; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/67; H10W70/688; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K1/18; H05K1/182; H05K2203/00; H05K2203/15; H05K2203/1545; H05K2203/17; H05K2203/175; H05K3/0011; H05K3/0044; H05K3/005; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
119 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate, said pattern terminating in a plurality of leads which extend into said opening; leaving a region of said metal layer intact over said opening, said region being smaller than said opening and conductively connected to all of said leads in order to short said leads together for the electro-plating thereof; and electro-plating a metal coating onto said pattern of conductive traces, said region of said metal layer remaining in position over said opening during said electro-plating.
Claim 2
Independent Claim
119 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate, said pattern terminating in a plurality of leads which extend into said opening; leaving a region of said metal layer intact over said opening, said region being smaller than said opening and conductively connected to all of said leads in order to short said leads together for the electro-plating thereof; and electro-plating a metal coating onto said pattern of conductive traces, said region of said metal layer remaining in position over said opening during said electro-plating.
Claim 3
Dependent Claim
23 words
The method of claim 1 further comprising the step of detaching said region of said metal layer from said leads after said electro-plating.
Claim 4
Dependent Claim
30 words
The method of claim 2 wherein said detaching of said region of said metal layer from said leads comprises the step of severing all of said leads from said region.
Claim 5
Dependent Claim
110 words
The method of claim 3 wherein said severing of all of said leads from said region of said metal layer comprises the steps of: providing a punch press assembly comprising a support structure having a bore therethrough, said bore being larger in size than said region of said metal layer, and a punch member sized to pass through said bore of said support structure; positioning said substrate against said support structure with said region of said metal layer being placed in alignment with said bore; and urging said punch member toward said bore and against said region of said metal layer so as to sever said region from said leads.
Claim 6
Independent Claim
125 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate, said pattern terminating in a plurality of leads which extend into said opening; securing a conductive metal member to said leads, said conductive metal member being smaller than said opening through said substrate and positioned therein, said conductive metal member being connected to all of said leads in order to short said leads together for the electro-plating thereof; and electro-plating a metal coating onto said pattern of conductive traces, said conductive metal member remaining in position over said opening during said electro-plating.
Claim 7
Independent Claim
125 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate, said pattern terminating in a plurality of leads which extend into said opening; securing a conductive metal member to said leads, said conductive metal member being smaller than said opening through said substrate and positioned therein, said conductive metal member being connected to all of said leads in order to short said leads together for the electro-plating thereof; and electro-plating a metal coating onto said pattern of conductive traces, said conductive metal member remaining in position over said opening during said electro-plating.
Claim 8
Dependent Claim
22 words
The method of claim 5 wherein said conductive metal member is secured to said leads by the soldering of said leads thereto.
Claim 9
Dependent Claim
22 words
The method of claim 5 wherein said conductive metal member is secured to said leads by the welding of said leads thereto.
Claim 10
Dependent Claim
21 words
The method of claim 5 further comprising the step of detaching said conductive metal member from said leads after said electro-plating.
Claim 11
Dependent Claim
28 words
The method of claim 8 wherein said detaching of said conductive metal member from said leads comprises the step of severing all of said leads from said member.
Claim 12
Dependent Claim
104 words
The method of claim 9 wherein said severing of all of said leads from said conductive metal member comprises the steps of: providing a punch press assembly comprising a support structure having a bore therethrough, said bore being larger in size than said conductive metal member, and a punch member sized to pass through said bore of said support structure; positioning said substrate against said support structure with said conductive metal member being placed in alignment with said bore; and urging said punch member toward said bore and against said conductive metal member so as to sever said conductive metal member from said leads.
Claim 13
Independent Claim
172 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each trace comprising one of said leads; leaving a region of said metal layer intact over said opening, said region being smaller than said opening and conductively connected to all of said leads in order to short said leads together; electro-plating a metal coating onto said pattern of conductive traces, said region of said metal layer remaining in position over said opening during said electro-plating; applying an electrical current to said circuit; and determining if said current flows between said first end of each of said traces and said region, said flow of current therebetween indicating that each of said traces has no open sections therein.
Claim 14
Independent Claim
172 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each trace comprising one of said leads; leaving a region of said metal layer intact over said opening, said region being smaller than said opening and conductively connected to all of said leads in order to short said leads together; electro-plating a metal coating onto said pattern of conductive traces, said region of said metal layer remaining in position over said opening during said electro-plating; applying an electrical current to said circuit; and determining if said current flows between said first end of each of said traces and said region, said flow of current therebetween indicating that each of said traces has no open sections therein.
Claim 15
Independent Claim
194 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads; leaving a region of said metal layer intact over said opening, said region being smaller than said opening and conductively connected to all of said leads in order to short said leads together; electro-plating a metal coating onto said pattern of conductive traces, said region of said metal layer remaining in position over said opening during said electro-plating; detaching said region of said metal layer from said leads; applying an electrical current to at least one selected trace in said pattern; and determining if said current is present in any traces adjacent to said selected trace, whereby the presence of said current in any traces adjacent to said selected trace indicates the presence of electrical shorts in said circuit.
Claim 16
Independent Claim
194 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads; leaving a region of said metal layer intact over said opening, said region being smaller than said opening and conductively connected to all of said leads in order to short said leads together; electro-plating a metal coating onto said pattern of conductive traces, said region of said metal layer remaining in position over said opening during said electro-plating; detaching said region of said metal layer from said leads; applying an electrical current to at least one selected trace in said pattern; and determining if said current is present in any traces adjacent to said selected trace, whereby the presence of said current in any traces adjacent to said selected trace indicates the presence of electrical shorts in said circuit.
Claim 17
Dependent Claim
30 words
The method of claim 12 wherein said detaching of said region of said metal layer from said leads comprises the step of severing all of said leads from said region.
Claim 18
Dependent Claim
110 words
The method of claim 13 wherein said severing of all of said leads from said region of said metal layer comprises the steps of: providing a punch press assembly comprising a support structure having a bore therethrough, said bore being larger in size than said region of said metal layer, and a punch member sized to pass through said bore of said support structure; positioning said substrate against said support structure with said region of said metal layer being placed in alignment with said bore; and urging said punch member toward said bore and against said region of said metal layer so as to sever said region from said leads.
Claim 19
Independent Claim
187 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads; securing a conductive metal member to said leads, said conductive metal member being smaller than said opening through said substrate and positioned therein, said conductive metal member being connected to all of said leads in order to short all of said leads together for the electro-plating thereof; electro-plating a metal coating onto said pattern of conductive traces, said conductive metal member remaining in position over said opening during said electro-plating; applying an electrical current to said circuit; and determining if said current flows between said first end of each of said traces and said region, said flow of said current therebetween indicating that each of said traces has no open sections therein.
Claim 20
Independent Claim
187 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads; securing a conductive metal member to said leads, said conductive metal member being smaller than said opening through said substrate and positioned therein, said conductive metal member being connected to all of said leads in order to short all of said leads together for the electro-plating thereof; electro-plating a metal coating onto said pattern of conductive traces, said conductive metal member remaining in position over said opening during said electro-plating; applying an electrical current to said circuit; and determining if said current flows between said first end of each of said traces and said region, said flow of said current therebetween indicating that each of said traces has no open sections therein.
Claim 21
Independent Claim
204 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads; securing a conductive metal member to said leads, said conductive metal member being smaller than said opening through said substrate and positioned therein, said conductive metal member being connected to all of said leads in order to short all of said leads together for the electro-plating thereof; electro-plating a metal coating onto said pattern of conductive traces, said conductive metal member remaining in position over said opening during said electro-plating; detaching said conductive metal member from said leads; applying an electrical current to at least one selected trace in said pattern; and determining if said current is present in any traces adjacent to said selected trace, whereby the presence of said current in any traces adjacent to said selected trace indicates the presence of electrical shorts in said circuit.
Claim 22
Independent Claim
204 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads; securing a conductive metal member to said leads, said conductive metal member being smaller than said opening through said substrate and positioned therein, said conductive metal member being connected to all of said leads in order to short all of said leads together for the electro-plating thereof; electro-plating a metal coating onto said pattern of conductive traces, said conductive metal member remaining in position over said opening during said electro-plating; detaching said conductive metal member from said leads; applying an electrical current to at least one selected trace in said pattern; and determining if said current is present in any traces adjacent to said selected trace, whereby the presence of said current in any traces adjacent to said selected trace indicates the presence of electrical shorts in said circuit.
Claim 23
Dependent Claim
28 words
The method of claim 16 wherein said detaching of said conductive metal member from said leads comprises the step of severing all of said leads from said member.
Claim 24
Dependent Claim
104 words
The method of claim 17 wherein said severing of all of said leads from said conductive metal member comprises the steps of: providing a punch press assembly comprising a support structure having a bore therethrough, said bore being larger in size than said conductive metal member, and a punch member sized to pass through said bore of said support structure; positioning said substrate against said support structure with said conductive metal member being placed in alignment with said bore; and urging said punch member toward said bore and against said conductive metal member so as to sever said conductive metal member from said leads.
Claim 25
Independent Claim
286 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads, each of said leads being shorted together in said opening by a conductive metal section; electro-plating a metal coating onto said metal layer, said conductive metal section remaining in position over said opening during said electro-plating; applying an electrical current to said circuit; determining if said current flows between said first end of each of said traces and said conductive metal section, said flow of said current therebetween indicating that each of said traces has no open zones therein; providing a punch press assembly comprising a support structure having a bore therethrough, said bore being larger in size than said conductive metal section, and a punch member sized to pass through said bore of said support structure; positioning said substrate against said support structure with said conductive metal section being placed in alignment with said bore; urging said punch member toward said bore and against said conductive metal section so as to sever said conductive metal section from said leads; applying an electrical current to at least one selected trace in said pattern; and determining if said current is present in any traces adjacent to said selected trace, whereby the presence of said current in any traces adjacent to said selected trace indicates the presence of electrical shorts in said circuit.
Claim 26
Independent Claim
286 words
A method of manufacturing a tape automated bonded circuit comprising: providing a flexible substrate having at least one conductive metal layer thereon and an opening therethrough; selectively removing portions of said metal layer to form a pattern of conductive traces on said substrate terminating in a plurality of leads extending into said opening, each of said traces having first and second ends, said second end of each of said traces comprising one of said leads, each of said leads being shorted together in said opening by a conductive metal section; electro-plating a metal coating onto said metal layer, said conductive metal section remaining in position over said opening during said electro-plating; applying an electrical current to said circuit; determining if said current flows between said first end of each of said traces and said conductive metal section, said flow of said current therebetween indicating that each of said traces has no open zones therein; providing a punch press assembly comprising a support structure having a bore therethrough, said bore being larger in size than said conductive metal section, and a punch member sized to pass through said bore of said support structure; positioning said substrate against said support structure with said conductive metal section being placed in alignment with said bore; urging said punch member toward said bore and against said conductive metal section so as to sever said conductive metal section from said leads; applying an electrical current to at least one selected trace in said pattern; and determining if said current is present in any traces adjacent to said selected trace, whereby the presence of said current in any traces adjacent to said selected trace indicates the presence of electrical shorts in said circuit.
References Cited (Backward Citations)
US4380042A
Cited
US4806409A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-30 | 1994-01-29 | 1994-07-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-30 | 1998-01-29 | 1998-07-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-30 | 2002-01-29 | 2002-07-31 | $7700.00 | Window Closed / Lapsed |