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US4936930A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for improved alignment for semiconductor devices with buried layers

Assignee: Vishay Siliconix Inc
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Filing: 1988-01-06
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Granted: 1990-06-26
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Expires: 2008-01-06
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Abstract

Abstract A method is provided to improve the alignment process in fabricating an integrated circuit with buried layers. The buried layers are implanted in a substrate and driven in, but without the usual step at their perimeter. A target pattern is etched into the substrate surface by means of plasma-assisted etching. An isotropic epitaxial layer is then grown at reduced pressure over the substrate surface so that the target is replicated on the epitaxial layer surface. The target as replicated is thus suitable for optical alignment, either manually or by automatic alignment equipment.

Inventors

  • 👤 Gilbert A. Gruber
  • 👤 Zolik Fichtenholz

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 18:25
CPC Classifications
H; H10; H10W; H10W46/00; H10W15/00; H10W15/01; H10W46/501; Y; Y10; Y10S; Y10S148/00; Y10S148/102; Y10S438/00; Y10S438/975

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 89 words
A semiconductor device comprising: a semiconductor substrate of a first conductivity type, having a principal surface; at least one region of a second conductivity type formed in said substrate; at least one target etched in said principal surface, said target being located at a known position relative to the position of said region and having an outline different from that of said region; and an isotropic crystal layer overlying and in contact with said principal surface, wherein said target is replicated on the surface of said isotropic crystal layer.
Claim 2
Dependent Claim 89 words
A semiconductor device comprising: a semiconductor substrate of a first conductivity type, having a principal surface; at least one region of a second conductivity type formed in said substrate; at least one target etched in said principal surface, said target being located at a known position relative to the position of said region and having an outline different from that of said region; and an isotropic crystal layer overlying and in contact with said principal surface, wherein said target is replicated on the surface of said isotropic crystal layer.
Claim 3
Dependent Claim 25 words
The device of claim 1, further comprising said target replicated on said surface of said isotropic crystal layer being readily detectable by optical alignment equipment.
Claim 4
Dependent Claim 15 words
The device of claim 1, wherein said isotropic crystal layer is formed by epitaxial growth.
Claim 5
Dependent Claim 18 words
The device of claim 1, wherein said isotropic crystal layer is formed by low ambient pressure epitaxial growth.
Claim 6
Dependent Claim 13 words
The device of claim 1, wherein said target is etched by plasma-assisted etching.
Claim 7
Dependent Claim 14 words
The device of claim 1, wherein said target is etched by reactive ion etching.
Claim 8
Dependent Claim 21 words
The device of claim 1, wherein said target comprises an etched-away area with an X-shaped area standing inside said etched-away area.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-06-25 1993-12-25 1994-06-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-06-25 1997-12-25 1998-06-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-06-25 2001-12-25 2002-06-26 $7700.00 Window Closed / Lapsed

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