Patent US4933228A successfully refreshed from Google Patents.
US4933228A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermosetting resin and prepreg and laminate using the same
Assignee: Hitachi Ltd
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Filing: 1989-06-19
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Granted: 1990-06-12
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Expires: 2009-06-19
Abstract
Abstract A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
Inventors
- 👤 Junichi Katagiri
- 👤 Akira Nagai
- 👤 Keiko Tawara
- 👤 Akio Takahashi
- 👤 Motoyo Wajima
- 👤 Toshikazu Narahara
- 👤 Ryo Hiraga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:35
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/02; C08G59/027; C08L; C08L25/00; C08L25/02; C08L25/04; C08F; C08F12/00; C08F12/02; C08F12/04; C08F12/14; C08F12/22; C08F290/00; C08F290/08; C08F290/12; C08F290/124; C08F299/00; C08F8/00; C08L63/00; C08L63/08; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31511; Y10T428/31529; Y10T428/31678; Y10T428/31692; Y10T428/31696; Y10T442/00; Y10T442/60; Y10T442/674
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
160 words
A multilayer printed circuit board comprising a plurality of insulating layers and a plurality of circuit conductor layers, said insulating layers and said circuit conductor layers being laminated and bonded alternately, said insulating layers being obtained by impregnating a sheet-like base material with a varnish containing a solvent and a thermosetting resin composition comprising a poly(p-hydroxystyrene) derivative resin represented by the formula: ##STR7## wherein A is an alkyl group; X is a halogen group; R is an alkylene or alkenoyl group having 2 to 4 carbon atoms; p is an integer of 1 to 4; q is zero or an integer of 1 to 3; and n is an integer of 1 to 100, a radical polymerization initiator and an epoxy modified polybutadiene represented by the formula: ##STR8## wherein Y is an epoxy resin; and m is an integer of 4 to 100, in an amount of 20 to 80% by weight, followed by removal of the solvent by drying.
Claim 2
Dependent Claim
160 words
A multilayer printed circuit board comprising a plurality of insulating layers and a plurality of circuit conductor layers, said insulating layers and said circuit conductor layers being laminated and bonded alternately, said insulating layers being obtained by impregnating a sheet-like base material with a varnish containing a solvent and a thermosetting resin composition comprising a poly(p-hydroxystyrene) derivative resin represented by the formula: ##STR7## wherein A is an alkyl group; X is a halogen group; R is an alkylene or alkenoyl group having 2 to 4 carbon atoms; p is an integer of 1 to 4; q is zero or an integer of 1 to 3; and n is an integer of 1 to 100, a radical polymerization initiator and an epoxy modified polybutadiene represented by the formula: ##STR8## wherein Y is an epoxy resin; and m is an integer of 4 to 100, in an amount of 20 to 80% by weight, followed by removal of the solvent by drying.
Claim 3
Dependent Claim
201 words
A multilayer printed circuit board comprising a plurality of insulating layers and a plurality of circuit conductor layers, said insulating layers and said circuit conductor layers being laminated and bonded alternately, said insulating layers being obtained by impregnating a fibrous cloth with a varnish containing a solvent and a thermosetting resin composition comprising a poly(p-hydroxystyrene) derivative resin represented by the formula: ##STR9## wherein A is an alkyl group; X is a halogen group; R is an alkylene or alkenoyl group having 2 to 4 carbon atoms; p is an integer of 1 to 4; q is zero or an integer of 1 to 3; and n is an integer of 1 to 100, a radical polymerization initiator and an epoxy modified polybutadiene represented by the formula: ##STR10## wherein Y is an epoxy resin; and m is an integer of 4 to 100, followed by removal of the solvent by drying, said insulating layer having a dielectric constant of 3.5 or less at 1 MHz, said resin composition having flame retardancy of V-O by the standard of UL 94, a glass transition temperature of 200° C. or higher, and a thermal expansion coefficient of 10 -4 /°C. or less at room temperature.
Claim 4
Dependent Claim
201 words
A multilayer printed circuit board comprising a plurality of insulating layers and a plurality of circuit conductor layers, said insulating layers and said circuit conductor layers being laminated and bonded alternately, said insulating layers being obtained by impregnating a fibrous cloth with a varnish containing a solvent and a thermosetting resin composition comprising a poly(p-hydroxystyrene) derivative resin represented by the formula: ##STR9## wherein A is an alkyl group; X is a halogen group; R is an alkylene or alkenoyl group having 2 to 4 carbon atoms; p is an integer of 1 to 4; q is zero or an integer of 1 to 3; and n is an integer of 1 to 100, a radical polymerization initiator and an epoxy modified polybutadiene represented by the formula: ##STR10## wherein Y is an epoxy resin; and m is an integer of 4 to 100, followed by removal of the solvent by drying, said insulating layer having a dielectric constant of 3.5 or less at 1 MHz, said resin composition having flame retardancy of V-O by the standard of UL 94, a glass transition temperature of 200° C. or higher, and a thermal expansion coefficient of 10 -4 /°C. or less at room temperature.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-11 | 1993-12-11 | 1994-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-11 | 1997-12-11 | 1998-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-11 | 2001-12-11 | 2002-06-12 | $7700.00 | Window Closed / Lapsed |