IC package positioning device in IC socket for IC carrier

Claim 1

An IC socket apparatus for receiving and positioning an IC package which has a plurality of IC leads projecting laterally therefrom and carried in an IC carrier, comprising: an IC socket having an IC package receiving recess therein and having a plurality of contacts mounted around the periphery of said recess for engaging and contacting leads of an IC package inserted into said recess, said contacts being shiftable in the peripheral direction of said recess, said socket further having guide means thereon for contacting with a guide means on an IC carrier for guiding an IC carrier onto said IC socket with an IC package guided into said recess; and a guide member in said recess and having a front surface facing toward the opening of said recess and having a plurality of IC package guide portions extending upright from said front surface and spaced for engaging peripheral edge portions of an IC package to be received and positioned in said recess, and having a plurality of contact guide portions on the periphery thereof and defining a plurality of contact engaging grooves between adjacent contact guide portions at positions corresponding to positions of leads on an IC package relative to said guide portions and in which grooves said contacts are engaged, said guide member having the periphery thereof spaced inwardly from the inner peripheral surface of said recess and being movably positioned in said recess for movement laterally to and rotationally around an axis parallel to the direction in which said guide means guides an IC carrier onto said socket; whereby when an IC carrier carrying an IC package is placed on said IC socket to cause the IC package to move into said recess, the peripheral edge portions of the IC package engage said IC package portions, and if the IC package is shifted relative to said axis or positioned rotationally relative to said axis such that the IC package leads are not aligned with the positions of said contacts, said guide member is shifted for causing said contact guide portions to shift said contacts to positions where they will engage the leads on the IC package.