Abstract Testsite system for use in an integrated circuit handler, the testsite system for testing plastic leaded chip carriers (PLCC), leadless chip carriers (LCC) and other IC packages. The testsite system utilizes a pocket in a socket which is moveable in a frame between a insert position for the IC and a test position for the IC. The testsite includes an ejector which operates against a first spring constant and a moveable pocket assembly which operates against a second spring constant. The moveable pocket in the socket provides for alignment between the IC package and the contact wires insuring positive electrical integrity. The spring action provides for ejection of an IC after test from the pocket by a spring actuated ejector, as well as the socket assembly returning to a home position while carrying the ejector and IC at the same time through the second spring action.
Testsite comprising: a. extender housing means for supporting a first spring and a plurality of contact wire arrays; b. frame means for enclosing said contact wire arrays and including a inner rectangular area; c. socket assembly means for engaging within said inner rectangular area of said frame means, said socket assembly means including a plurality of slits for encompassing said contact wire arrays, a lower member for engaging said first spring, said lower member including a housing for supporting a second spring in alignment with said first spring, and an inner rectangular pocket area for supporting an integrated circuit package; d. ejector means supported in a central portion of said socket assembly means, extending through a base of said socket assembly means, and riding on said second spring; and, e. cover means affixed to said frame means and including an inner rectangular area for encompassing said socket assembly means.
Claim 2
Dependent Claim
149 words
Testsite comprising: a. extender housing means for supporting a first spring and a plurality of contact wire arrays; b. frame means for enclosing said contact wire arrays and including a inner rectangular area; c. socket assembly means for engaging within said inner rectangular area of said frame means, said socket assembly means including a plurality of slits for encompassing said contact wire arrays, a lower member for engaging said first spring, said lower member including a housing for supporting a second spring in alignment with said first spring, and an inner rectangular pocket area for supporting an integrated circuit package; d. ejector means supported in a central portion of said socket assembly means, extending through a base of said socket assembly means, and riding on said second spring; and, e. cover means affixed to said frame means and including an inner rectangular area for encompassing said socket assembly means.
Claim 3
Dependent Claim
16 words
Testsite of claim 1 comprising impedance cable means connected to each of said contact wire arrays.