Patent US4930001A successfully refreshed from Google Patents.
US4930001A
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Alloy bonded indium bumps and methods of processing same
Assignee: Raytheon Co
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Filing: 1989-03-23
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Granted: 1990-05-29
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Expires: 2009-03-23
Abstract
Abstract Apparatus comprising an indium bump that may be etched in a low concentration of hydrochloric acid (typically 1%) to remove oxide buildup, and a pad generally comprising a three layer arrangement of gold over nickel over titanium. The indium bump and the gold pad are pressed together for a short period of time, typically on the order of ten seconds, and then the pressed components are allowed to alloy weld over an extended period of time. Alternatively, the bump and pad may be heated at approximately 100 degrees Celsius for a period of about one hour to accelerate the alloy process. The heating diffuses the gold from the pad into the indium bump, thus forming a true alloy weld between the two that has incredibly strong bonding strength. Such bonding materials and methods are useful in bonding integrated circuit components, and the like.
Inventors
- 👤 Ronald L. Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 04:32
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/251; H10W72/90; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
68 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; providing a substrate; providing a gold bonding pad disposed on the substrate; pressing the indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad; and allowing the bump and bonding pad to completely alloy over an extended period of time.
Claim 2
Independent Claim
68 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; providing a substrate; providing a gold bonding pad disposed on the substrate; pressing the indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad; and allowing the bump and bonding pad to completely alloy over an extended period of time.
Claim 3
Dependent Claim
25 words
The method of claim 1 further comprising the step of: etching the indium bump in a low concentration of hydrochloric acid to remove oxide therefrom.
Claim 4
Dependent Claim
36 words
The method of claim 1 further comprising the step of: heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 5
Dependent Claim
36 words
The method of claim 2 further comprising the step of: heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 6
Independent Claim
80 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; providing a substrate; providing a gold plated bonding pad disposed on the substrate; pressing the indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad; and heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 7
Independent Claim
80 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; providing a substrate; providing a gold plated bonding pad disposed on the substrate; pressing the indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad; and heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 8
Independent Claim
92 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; etching the indium bump in a low concentration of hydrochloric acid; providing a substrate; providing a gold plated bonding pad disposed on the substrate; pressing the etched indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad; and heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 9
Independent Claim
92 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; etching the indium bump in a low concentration of hydrochloric acid; providing a substrate; providing a gold plated bonding pad disposed on the substrate; pressing the etched indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad; and heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 10
Independent Claim
117 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; etching the indium bump in a low concentration of hydrochloric acid; providing a substrate; providing a bonding pad disposed on the substrate comprising a layer of titanium, a layer of nickel deposited over the titanium and a layer of gold deposited over the layer of titanium; pressing the etched indium bump onto the bonding pad for a short period of time to initiate the alloy process between the bump to the pad; and heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to form a alloy bond between the bump and the pad.
Claim 11
Independent Claim
117 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; etching the indium bump in a low concentration of hydrochloric acid; providing a substrate; providing a bonding pad disposed on the substrate comprising a layer of titanium, a layer of nickel deposited over the titanium and a layer of gold deposited over the layer of titanium; pressing the etched indium bump onto the bonding pad for a short period of time to initiate the alloy process between the bump to the pad; and heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to form a alloy bond between the bump and the pad.
Claim 12
Independent Claim
92 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; providing a substrate; depositing a layer of titanium on the substrate; depositing a layer of nickel on top of the layer of titanium; depositing a layer of gold on top of the layer of nickel; photolithographically etching the layers of titanium, nickel and gold to form a gold plated bonding pad; and pressing the indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad.
Claim 13
Independent Claim
92 words
A method of providing for alloy bonding of indium bumps comprising the steps of: providing an indium bump; providing a substrate; depositing a layer of titanium on the substrate; depositing a layer of nickel on top of the layer of titanium; depositing a layer of gold on top of the layer of nickel; photolithographically etching the layers of titanium, nickel and gold to form a gold plated bonding pad; and pressing the indium bump onto the bonding pad for a short period of time to temporarily fuse the bump to the pad.
Claim 14
Dependent Claim
22 words
The method of claim 8 further comprising the step of: chemically etching the indium bump in a low concentration of hydrochloric acid.
Claim 15
Dependent Claim
36 words
The method of claim 8 further comprising the step of: heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 16
Dependent Claim
36 words
The method of claim 9 further comprising the step of: heating the pressed bump and pad for about one hour at approximately 100 degrees Celsius to accelerate the alloy bond between the bump and the pad.
Claim 17
Dependent Claim
56 words
Apparatus comprising: a substrate; a gold bonding pad disposed on the substrate; an indium bump pressed onto the gold bonding pad for a short period of time to temporarily fuse the bump to the pad and allowed to cure for an extended period of time to form an alloy bond between the bump and the pad.
Claim 18
Dependent Claim
56 words
Apparatus comprising: a substrate; a gold bonding pad disposed on the substrate; an indium bump pressed onto the gold bonding pad for a short period of time to temporarily fuse the bump to the pad and allowed to cure for an extended period of time to form an alloy bond between the bump and the pad.
Claim 19
Dependent Claim
57 words
Apparatus comprising: a substrate; a gold bonding pad disposed on the substrate; an indium bump pressed onto the gold bonding pad for a short period of time to temporarily fuse the bump to the pad and heated for about one hour at approximately 100 degrees Celsius to form an alloy bond between the bump and the pad.
Claim 20
Dependent Claim
57 words
Apparatus comprising: a substrate; a gold bonding pad disposed on the substrate; an indium bump pressed onto the gold bonding pad for a short period of time to temporarily fuse the bump to the pad and heated for about one hour at approximately 100 degrees Celsius to form an alloy bond between the bump and the pad.
Claim 21
Dependent Claim
66 words
Apparatus comprising: a substrate; a gold bonding pad disposed on the substrate; an indium bump etched in a low concentration of hydrochloric acid and pressed onto the gold bonding pad for a short period of time to temporarily fuse the bump to the pad and heated for about one hour at approximately 100 degrees Celsius to form an alloy bond between the bump and the pad.
Claim 22
Dependent Claim
66 words
Apparatus comprising: a substrate; a gold bonding pad disposed on the substrate; an indium bump etched in a low concentration of hydrochloric acid and pressed onto the gold bonding pad for a short period of time to temporarily fuse the bump to the pad and heated for about one hour at approximately 100 degrees Celsius to form an alloy bond between the bump and the pad.
Claim 23
Dependent Claim
88 words
Apparatus comprising: a substrate; a bonding pad disposed on the substrate comprising a layer of titanium, a layer of nickel deposited over the titanium and a layer of gold deposited over the layer of titanium; an indium bump etched in a low concentration of hydrochloric acid and pressed onto the bonding pad for a short period of time to temporarily fuse the bump to the pad and heated for about one hour at approximately 100 degrees Celsius to form an alloy bond between the bump and the pad.
Claim 24
Dependent Claim
88 words
Apparatus comprising: a substrate; a bonding pad disposed on the substrate comprising a layer of titanium, a layer of nickel deposited over the titanium and a layer of gold deposited over the layer of titanium; an indium bump etched in a low concentration of hydrochloric acid and pressed onto the bonding pad for a short period of time to temporarily fuse the bump to the pad and heated for about one hour at approximately 100 degrees Celsius to form an alloy bond between the bump and the pad.
References Cited (Backward Citations)
US4740700A
Cited
US4796082A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-28 | 1993-11-27 | 1994-05-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-28 | 1997-11-27 | 1998-05-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-28 | 2001-11-27 | 2002-05-29 | $7700.00 | Window Closed / Lapsed |