Loading and accurate measurement of integrated dynamic parameters at point of contact in automatic device handlers

Claim 2

In a test system for making accurate measurements of semiconductor devices under test, a connect device comprising: (a) a controlled impedance multilayer printed circuit defining transmission lines and ground planes, (b) electrical components mounted on said multilayer printed circuit, (c) spatially fixed contact fingers secured to said electrical components for contacting said semiconductor devices under test, (d) two lines from the test system to a device under test, one line being a power line from a driver circuit and the other line being a sense line to a receiver circuit, and (e) said electrical components including means for selectively and reversibly switching in and connecting the semiconductor devices to load devices.

Claim 3

The connect device according to claim 1, wherein said load device is at least one of resistive or capacitive.

Claim 4

The connect device according to claim 1, further including a load board and said load devices secured to said load board, said multilayer printed circuit being secured to said load board at locations thereon spaced from said contact fingers to make contact therewith.

Claim 5

The connect device according to claim 1, wherein said multilayer printed circuit includes two transmission lines and two ground planes.

Claim 6

In a test system for making accurate measurements of semiconductor devices, a connect device comprising: (a) a controlled impedance multilayer printed circuit defining transmission line means and ground plane means, (b) electrical components mounted on said multilayer printed circuit, (c) spatially fixed contact fingers secured to said surface mount components for contacting said semiconductor devices, (d) said surface mount components including means for switching in and connecting the semiconductor devices to load devices, (e) said multilayer printed circuit including two transmission lines and two ground planes, (f) further including two lines from the test system to a device under test, one line being a power line including a driver circuit and one of said transmission lines and the other line being a sense line including a receiver and the other of said transmission lines, and (g) a relay to switch from the driver circuit to a capacitive load.

Claim 7

In a test system for making accurate measurements of semiconductor devices, a connect device comprising: (a) a controlled impedance multilayer printed circuit defining transmission line means and ground plane means, (b) electrical components mounted on said multilayer printed circuit, (c) spatially fixed contact fingers secured to said surface mount components for contacting said semiconductor devices, (d) said surface mount components including means for switching in and connecting the semiconductor devices to load devices, (e) said multilayer printed circuit including two transmission lines and two ground planes, (f) further including two lines from the test system to a device under test, one line being a power line including a driver circuit and one of said transmission lines and the other line being a sense line including a receiver and the other of said transmission lines, and (g) a relay to switch from the driver circuit to a capacitive load.

Claim 8

The connect device according to claim 1, wherein said sense line has a predetermined characteristic impedance, further including a resistor coupled to said sense line to provide resistive device loading of the device under test.

Claim 9

The connect device according to claim 6, wherein said resistor is a chip resistor and is placed adjacent to the output pin of the device under test.

Claim 10

The connect device according to claim 5, wherein said relay is one of said components in the form of a pin diode to switch from said driver circuit to said capacitive load.

Claim 11

In a test system for making accurate measurements of semiconductor devices, the combination of: (a) a test system, (b) a device track for moving a device to be tested into and out of contact with said test system, and (c) a connect device for connecting the device to be tested with said test system, said connect device comprising: (d) a controlled impedance multilayer printed circuit defining transmission line means and ground plane means, (e) electrical components mounted on said multilayer printed circuit, and (f) spatially fixed contact fingers secured to said surface mount components and said device track for contacting said semiconductor devices, (g) said surface mount components including means for switching in and connecting the semiconductor devices to at least one load device.

Claim 12

In a test system for making accurate measurements of semiconductor devices, the combination of: (a) a test system, (b) a device track for moving a device to be tested into and out of contact with said test system, and (c) a connect device for connecting the device to be tested with said test system, said connect device comprising: (d) a controlled impedance multilayer printed circuit defining transmission line means and ground plane means, (e) electrical components mounted on said multilayer printed circuit, and (f) spatially fixed contact fingers secured to said surface mount components and said device track for contacting said semiconductor devices, (g) said surface mount components including means for switching in and connecting the semiconductor devices to at least one load device.

Claim 13

The combination according to claim 9, wherein said contact fingers are brought into sliding engagement with a device to be tested as said device to be tested is moved along said device track.

Claim 14

The connect device according to claim 9, wherein said load device is at least one of resistive or capacitive.

Claim 15

The connect device according to claim 9, wherein said multilayer printed circuit is a flex printed circuit.

Claim 16

The connect device according to claim 11, including contact fingers connected to one end of the multilayer flex circuit for contacting the semiconductor device.

Claim 17

The contact device according to claim 9, further including a load board and said load devices secured to said load board, said multilayer printed circuit being secured to said load board at locations thereon spaced from said contact fingers to make contact therewith.

Claim 18

The connect device according to claim 9, wherein said multilayer printed circuit includes two transmission lines and two ground planes.

Claim 19

The connect device according to claim 9, including two lines from the test system to a device under test, one line being a power line including a driver circuit and one of said transmission lines and the other line being a sense line including a receiver and the other of said transmission lines.

Claim 20

The connect device according to claim 16, further including a capacitive load and a relay in the form of a pin diode forming one of said components to switch from said driver circuit to said capacitive load.

Claim 21

The connect device according to claim 16, wherein said sense line has a predetermined characteristic impedance, further including a resistor coupled to said sense line to provide resistive device loading of the device under test.