Patent US4926239A successfully refreshed from Google Patents.
US4926239A
Expired / Lapsed
US
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Plastic encapsulant for semiconductor
Assignee: Sharp Corp
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Filing: 1989-08-02
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Granted: 1990-05-15
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Expires: 2009-08-02
Abstract
Abstract A plastic encapsulant for a semiconductor chip comprises an epoxy resin, an organosilicon compound, a hardener, a pigment, and an organic solvent. The epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, three methoxy groups. The hardener is a resol type phenol resin hardener. The organic solvent is a mixture of ketones, alcohols, and aromatic hydrocarbons.
Inventors
- 👤 Kazuya Fujita
- 👤 Takamichi Maeda
- 👤 Masao Hayakawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:37
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W72/00; H10W72/701; Y; Y10; Y10T; Y10T428/00; Y10T428/23; Y10T428/239
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
95 words
A semiconductor device comprising: a semiconductor chip; a support for supporting said semiconductor chip; and a plastic encapsulant for encasing said semiconductor chip to said supporter; said encapsulant consisting essentially of: a liquid epoxy resin; an organosilicon compound having at least one methoxy group; a resol-type phenol resin hardener; a pigment; and an organic solvent mixture in which the boiling points of the individual solvents differ; wherein the amount of said organosilicon compound is less than 30% by weight based on the total weight of said liquid epoxy resin, said organosilicon compound and said hardener.
Claim 2
Dependent Claim
95 words
A semiconductor device comprising: a semiconductor chip; a support for supporting said semiconductor chip; and a plastic encapsulant for encasing said semiconductor chip to said supporter; said encapsulant consisting essentially of: a liquid epoxy resin; an organosilicon compound having at least one methoxy group; a resol-type phenol resin hardener; a pigment; and an organic solvent mixture in which the boiling points of the individual solvents differ; wherein the amount of said organosilicon compound is less than 30% by weight based on the total weight of said liquid epoxy resin, said organosilicon compound and said hardener.
Claim 3
Dependent Claim
30 words
The semiconductor device of claim 1, wherein said organic solvent mixture is present in an amount of from 30-80% by weight to the total weight of said plastic encapsulant composition.
Claim 4
Dependent Claim
15 words
The semiconductor device of claim 1, wherein said plastic encapsulant is about 100 μm thick.
Claim 5
Dependent Claim
13 words
The semiconductor device of claim 1, wherein said pigment is an organic pigment.
Claim 6
Dependent Claim
18 words
The semiconductor device of claim 1, wherein said liquid epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin.
Claim 7
Dependent Claim
16 words
The semiconductor of claim 1, wherein the organosilicon compound is an organosilicon with three methoxy groups.
Claim 8
Dependent Claim
12 words
The semiconductor of claim 1, wherein said pigment is an inorganic pigment.
Claim 9
Dependent Claim
18 words
The semiconductor device of claim 1, wherein the organic solvent mixture contains a ketone, alcohol and aromatic hydrocarbon.
Claim 10
Dependent Claim
19 words
The semiconductor device of claim 1, wherein said organic solvent mixture contains toluene, xylene, butanol, and methyl isobutyl ketone.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-14 | 1993-11-13 | 1994-05-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-14 | 1997-11-13 | 1998-05-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-14 | 2001-11-13 | 2002-05-15 | $7700.00 | Window Closed / Lapsed |