US4924111A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microprocessor layout minimizing temperature and current effects
Assignee: NXP USA Inc
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Filing: 1988-10-31
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Granted: 1990-05-08
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Expires: 2008-10-31
Abstract
Abstract An integrated circuit having a microprocessor core interfaced to large power transistors is described. This integrated circuit provides the capability to intelligently control and drive loads requiring currents exceeding 250 milli amps. The large power transistors are built in a technology compatible with the microprocessor core technology resulting in a more readily manufacturable circuit. The microprocessor core is layed out in a manner which provides the greatest distance between the most heat sensitive microprocessor core circuits and the power devices. On chip temperature sensing and feedback is provided for junction temperature monitoring and control.
Inventors
- 👤 Floyd E. Anderson
- 👤 Stephen P. Robb
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 06:42
CPC Classifications
H; H03; H03K; H03K17/00; H03K17/14; H03K17/145; H10; H10D; H10D89/00; H10D89/10; H10D89/105; Y; Y10; Y10S; Y10S257/00; Y10S257/92
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
100 words
A monolithically integrated circuit comprising: at least one power output device having a current drive capability of greater than 0.25 amps; a microprocessor core coupled to said at least one power output device for driving said at least one power output device, wherein said microprocessor core has a heat sensitive circuit which is more heat sensitive than other portions of said microprocessor core, and wherein said heat sensitive circuit is located at a distance remote from said at least one power output device in order to minimize the effects of heat dissipation from said at least one power output device.
Claim 2
Dependent Claim
100 words
A monolithically integrated circuit comprising: at least one power output device having a current drive capability of greater than 0.25 amps; a microprocessor core coupled to said at least one power output device for driving said at least one power output device, wherein said microprocessor core has a heat sensitive circuit which is more heat sensitive than other portions of said microprocessor core, and wherein said heat sensitive circuit is located at a distance remote from said at least one power output device in order to minimize the effects of heat dissipation from said at least one power output device.
Claim 3
Dependent Claim
24 words
The monolithically integrated circuit according to claim 1 wherein said at least one power output device has a rdson of less than 1 ohm.
Claim 4
Dependent Claim
35 words
The monolithically integrated circuit according to claim 1 wherein said heat sensitive circuit is located at a greater distance from said at least one power output device than said other portions of said microprocessor core.
Claim 5
Dependent Claim
35 words
The monolithically integrated circuit according to claim 3 further comprising an isolation means coupled to a voltage and located between said at least one power output device and said microprocessor core for collecting substrate currents.
Claim 6
Dependent Claim
32 words
The monolithically integrated circuit according to claim 4 wherein said microprocessor core, said at least one power output device, and said isolation means are manufacturable in a substantially similar CMOS process technology.
Claim 7
Dependent Claim
54 words
The monolithically integrated circuit according to claim 5 further comprising a control and driver circuit coupled between said microprocessor core and said power output device for providing a driver voltage to said at least one power output device wherein the magnitude of the driver voltage is greater than a first supply voltage applied thereto.
Claim 8
Dependent Claim
28 words
The monolithically integrated circuit according to claim 6 wherein said control and driver circuit is located between said microprocessor core and said at least one power output device.
Claim 9
Dependent Claim
121 words
A microprocessor circuit fabricated in a semiconductor substrate using a MOS process technology, for driving a load requiring greater than 0.25 amps of current, said microprocessor circuit comprising: at least one power output device exhibiting a rdson of less than 1 ohm; a microprocessor core having a heat sensitive circuit coupled for driving said at least one power output device, said heat sensitive circuit being more sensitive than said substantially all other circuits within said microprocessor core, said heat sensitive circuit located at a greater distance from said power output device than said other circuits; and an isolation means coupled to a voltage and located between said at least one power output device and said microprocessor core for collecting substrate currents.
Claim 10
Dependent Claim
121 words
A microprocessor circuit fabricated in a semiconductor substrate using a MOS process technology, for driving a load requiring greater than 0.25 amps of current, said microprocessor circuit comprising: at least one power output device exhibiting a rdson of less than 1 ohm; a microprocessor core having a heat sensitive circuit coupled for driving said at least one power output device, said heat sensitive circuit being more sensitive than said substantially all other circuits within said microprocessor core, said heat sensitive circuit located at a greater distance from said power output device than said other circuits; and an isolation means coupled to a voltage and located between said at least one power output device and said microprocessor core for collecting substrate currents.
Claim 11
Dependent Claim
30 words
The microprocessor circuit according to claim 8 wherein said isolation means comprises a doped region in said substrate between said at least one power output device and said microprocessor core.
Claim 12
Dependent Claim
24 words
The microprocessor circuit according to claim 9 wherein said substrate has a principle surface, and wherein said doped region extends to said principle surface.
Claim 13
Dependent Claim
56 words
The microprocessor circuit according to claim 10 further comprising a control and driver circuit coupled between said microprocessor core and said at least one power output device for providing a driver voltage to said at least one power output device wherein the magnitude of the driver voltage is greater than a first supply voltage applied thereto.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-07 | 1993-11-06 | 1994-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-07 | 1997-11-06 | 1998-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-07 | 2001-11-06 | 2002-05-08 | $7700.00 | Window Closed / Lapsed |