Epoxy resin composition

Claim 1

An epoxy resin composition consisting essentially of: (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an organic silicon compound represented by the formula ##STR5## in which R 1 's are identical or different and each represents a hydrocarbon group selected from the class consisting of C 1 -C 3 alkyl groups, C 2 -C 4 alkenyl groups, C 6 -C 12 aryl groups, C 3 -C 10 cycloalkyl groups and C 7 -C 12 aralkyl groups, the hydrocarbon group being optionally substituted by 1 to 6 halogen atoms; R 2 represents a group of the general formula ##STR6## where Q 1 is a group of the general formula: --O--.sub.p --C.sub.q H.sub.2q -- p is 0 or 1 and q is an integer of 1 to 3, with the proviso that Q 1 may be bonded to the benzene ring at either end, Q 2 represents a hydrogen atom, a halogen atom, a C 1 -C 3 alkyl group, a C 1 -C 3 alkoxy group, a C 1 -C 3 haloalkyl group or a C 1 -C 3 haloalkoxy group, and r is 1 or 2; m and n represent the numbers of the two types of siloxane moieties contained in the organic silicon compound, and m is 0 or an integer of 1 or more, n is an integer of 1 or more, and the total of m and n is 3 to 250; and, each of the two ends is R 1 or R 2 , and the type of each end group and the number represented by n are selected from the above definitions os that formula [I] contains at least one R 2 group, and (E) a filler.