US4920164A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy resin composition
Assignee: Mitsubishi Gas Chemical Co Inc
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Filing: 1988-07-20
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Granted: 1990-04-24
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Expires: 2008-07-20
Abstract
Abstract An epoxy resin composition consisting essentially of (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) a polyphenylene ether resin, and (E) a filler.
Inventors
- 👤 Yukio Sasaki
- 👤 Takayuki Watanabe
- 👤 Hiroshi Takamiya
- 👤 Kazuo Watanabe
- 👤 Yoko Yamazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 05:56
CPC Classifications
C; C08; C08K; C08K3/00; C08K3/34; C08K3/36; C08L; C08L63/00; C08L71/00; C08L71/08; C08L71/10; C08L71/12; C08L71/123; C08L61/00; C08L61/04; C08L61/06
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
178 words
An epoxy resin composition consisting essentially of (A) an epoxy resin, (B) a curing agent, (C) 0.01 to 10 parts by weight of a curing promoter per 100 parts by weight of the epoxy resin (A), (D) 1 to 100 parts by weight of a polyphenylene ether resin per 100 parts by weight of the epoxy resin (A) and the curing agent (B) combined, said polyphenylene ether resin being a homopolymer or copolymer composed essentially of at least one kind of recurring units of the formula ##STR3## in which R 1 , R 2 and R 3 are identical or different and each represents hydrogen or alkyl having 1 to 3 carbon atoms, provided that R 1 and R 2 are not hydrogen at the same time, and (E) 50 to 1,000 parts by weight of a silica powder per 100 parts by weight of the epoxy resin (A), the curing agent (B) and the polyphenylene ether resin (D) combined, said filler being at least one silica selected from the group consisting of crystalline silica and amorphous silica.
Claim 2
Dependent Claim
178 words
An epoxy resin composition consisting essentially of (A) an epoxy resin, (B) a curing agent, (C) 0.01 to 10 parts by weight of a curing promoter per 100 parts by weight of the epoxy resin (A), (D) 1 to 100 parts by weight of a polyphenylene ether resin per 100 parts by weight of the epoxy resin (A) and the curing agent (B) combined, said polyphenylene ether resin being a homopolymer or copolymer composed essentially of at least one kind of recurring units of the formula ##STR3## in which R 1 , R 2 and R 3 are identical or different and each represents hydrogen or alkyl having 1 to 3 carbon atoms, provided that R 1 and R 2 are not hydrogen at the same time, and (E) 50 to 1,000 parts by weight of a silica powder per 100 parts by weight of the epoxy resin (A), the curing agent (B) and the polyphenylene ether resin (D) combined, said filler being at least one silica selected from the group consisting of crystalline silica and amorphous silica.
Claim 3
Dependent Claim
24 words
The resin composition of claim 1 in which the epoxy resin (A) is an epoxy resin containing at least two epoxy groups per molecule.
Claim 4
Dependent Claim
34 words
The resin composition of claim 1 in which the epoxy resin (A) is at least one epoxy resin selected from the group consisting of novolak-type epoxy resins, bisphenol-type epoxy resins and biphenyl-type epoxy resins.
Claim 5
Dependent Claim
25 words
The resin composition of claim 1 in which the curing agent (B) is a novolak-type phenolic resin having at least two hydroxyl groups per molecule.
Claim 6
Dependent Claim
33 words
The resin composition of claim 1 in which the curing promoter (C) is at least one compound selected from the group consisting of (1) imidazoles, (2) organic phosphines, (3) amines and (4) cycloamidines.
Claim 7
Dependent Claim
14 words
An electronic or electrical component part encapsulated by the resin composition of claim 1.
Claim 8
Dependent Claim
43 words
The resin composition of claim 1 in which the amount of the silica powder (E) is 100 to 500 parts by weight per 100 parts by weight of the epoxy resin (A), the curing agent (B) and the polyphenylene ether resin (D) combined.
Claim 9
Dependent Claim
49 words
The resin composition of claim 1 in which the curing agent (B) is contained in such an amount that the ratio of the epoxy group equivalent of the epoxy resin (A) to the functional group equivalent of the curing agent (B) is in the range of 0.7:1 to 1.3:1.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-23 | 1993-10-23 | 1994-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-23 | 1997-10-23 | 1998-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-23 | 2001-10-23 | 2002-04-24 | $7700.00 | Window Closed / Lapsed |