Thermoplastic modified epoxy compositions

Claim 2

A thermoplastic modified epoxy composition comprising: (a) a bis(2,3-epoxycyclopentyl)ether. (b) a diamine hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1,4-bis(p-aminophenoxy)benzene, 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, and (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: ##STR31## wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 1, b is 1 or greater, and c is 5 to 100.

Claim 3

A composition as defined in claim 1 which contains an epoxy resin containing two or more epoxy groups and which is different from (a).

Claim 4

A composition as defined in claim 2 wherein the epoxy resin is of the following structure: ##STR32## where n has a value from about 0 to about 15.

Claim 5

A composition as defined in claim 2 wherein the epoxy resin is a phenol-formaldehyde novolak of the following formula: ##STR33## wherein n=0.1 to 8 and R=hydrogen.

Claim 6

A composition as defined in claim 2 wherein the epoxy resin is a cresol-formaldehyde novolak of the following formula: ##STR34## wherein n=0.1 to 8 and R is CH 3 .

Claim 7

A composition as defined in claim 2 wherein the epoxy resin is N,N,N'N'-tetraglycidyl-4,4'-diaminodiphenyl methane.

Claim 8

A composition as defined in claim 2 wherein the epoxy resin is N,N,N',N'-tetraglycidyl-xylylenediamine.

Claim 9

A composition as defined in claim 2 wherein the epoxy resin is N,N-diglycidyl toluidene.

Claim 10

A composition as defined in claim 2 wherein the epoxy resin is N,N-diglycidyl aniline.

Claim 11

A composition as defined in claim 2 wherein the epoxy resin is N,N,N',N'-tetraglycidylbis(methylamino)cyclohexane.

Claim 12

A composition as defined in claim 2 wherein the epoxy resin is diglycidyl isophthalate.

Claim 13

A composition as defined in claim 2 wherein the epoxy resin is diglycidyl terephthalate.

Claim 14

A composition as defined in claim 2 wherein the epoxy resin is O,N,N-triglycidyl-4-amino phenol or O,N,N-triglycidyl-3-aminophenol.

Claim 15

A composition as defined in claim 2 wherein the epoxy resin is 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate.

Claim 16

A composition as defined in claim 2 wherein the epoxy resin is a N,N'-diglycidyl derivative of dimethylhydantoin.

Claim 17

A composition as defined in claim 1 which contains a structural fiber selected from carbon, graphite, glass, silicon carbide, poly(benzothiazole), poly(benzimidazole), poly(benzoxazole), alumina, titania, boron, and aromatic polyamides.

Claim 18

A composition as defined in claim 1 which contains an accelerator which initiates the rate of cure.

Claim 19

A prepreg comprising (a) a bis(2,3-epoxycyclopentyl)ether, (b) a diamine hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1,4-bis(p-aminophenoxy)benzene, 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: ##STR35## wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 1, b is 1 or greater, and c is 5 to 100, and (d) a structural fiber.

Claim 20

A prepreg comprising (a) a bis(2,3-epoxycyclopentyl)ether, (b) a diamine hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1,4-bis(p-aminophenoxy)benzene, 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: ##STR35## wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 1, b is 1 or greater, and c is 5 to 100, and (d) a structural fiber.

Claim 21

A prepreg as defined in claim 19 which contains an accelerator which increases the rate of cure.

Claim 22

A composite comprising: (i) a matrix resin comprising: (a) bis(2,3-epoxycyclopentyl)ether, (b) a hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1,4-bis(p-aminophenoxy)benzene, 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: ##STR36## wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 1, b is 1 or greater, and c is 5 to 100, and (ii) a structural fiber.

Claim 23

A composite comprising: (i) a matrix resin comprising: (a) bis(2,3-epoxycyclopentyl)ether, (b) a hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1,4-bis(p-aminophenoxy)benzene, 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: ##STR36## wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 1, b is 1 or greater, and c is 5 to 100, and (ii) a structural fiber.

Claim 24

A composite as defined in claim 20 wherein the epoxy resin was cured in the presence of an accelerator which increased the rate of cure.