Novel polyetheramide-imide epoxy resin blends

Claim 2

A polyetheramide-imide epoxy resin blend of the formula: ##STR14## wherein A represents a polyamide unit and B represents a polyimide unit of a polyetheramide-imide resin, m represents a mole fraction number greater than or equal to zero, C represents a polyepoxy resin, a represents a resin blend proprotion number greater than zero and less than 1, the sum of a plus b equals 1.0, further wherein said polyamide units is of the formula: ##STR15## and said polyimide unit is of the formula: ##STR16## wherein the O--Z--O units of said polyamide or said polyimide units are in the 3 or 3' or 4 or 4' positions and Z is a member of the class consisting of (1) ##STR17## and (2) divalent organic radicals of the general formula ##STR18## where X is a member selected from the class consisting of divalent radicals of the formulas ##STR19## where q is 0 or 1, y is a whole number from 1 to 5, the divalent bonds of the --O--Z--O-- radical are situated on the phthalic anhydride-derived units, e.g., in the 3,3'-, 3,4'-, 4,3'- or the 4,4'-positions, and R is a divalent organic radical selected from the class consisting of (a) aromatic hydrocarbon radicals having from 6-20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals and cycloalkylene radicals having from 2-20 carbon atoms, C.sub.(2-8) alkylene terminated polydiorganosiloxane, and (c) divalent radicals included by the formula ##STR20## where Q is a member selected from the class consisting of ##STR21## and x is a whole number from 1 to 5 inclusive and further wherein said epoxy resin is a polyepoxy compound possessing at least two 1,2-epoxide groups.

Claim 3

A solventless-dry powder comprising a polyetheramide-imide epoxy resin blend of the formula: ##STR22## wherein A represents a polyamide unit and B represents a polyimide unit of a polyetheramide-imide resin, m represents a mole fraction number greater than or equal to zero, C represents a polyepoxy resin, a represents a resin blend proportion number greater than zero and less than 1, the sum of a plus b equals 1.0, further wherein said polyamide unit is of the formula: ##STR23## and said polyimide unit is of the formula: ##STR24## wherein the O--Z--O units of said polyamide or said polyimide units are in the 3 or 3' or 4 or 4' positions and Z is a member of the class consisting of (1) ##STR25## and (2) divalent organic radicals of the general formula ##STR26## where X is a member selected from the class consisting of divalent radicals of the formulas ##STR27## where q is 0 or 1, y is a whole number from 1 to 5, the divalent bonds of the --O--Z--O-- radical are situated on the phthalic anhydride-derived units, e.g., in the 3,3'-, 3,4'-, 4,3'- or the 4,4'-positions, and R is a divalent organic radical selected from the class consisting of (a) aromatic hydrocarbon radicals having from 6-20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals and cycloalkylene radicals having from 2-20 carbon atoms, C.sub.(2-8) alkylene terminated polydiorganosiloxane, and (c) divalent radicals included by the formula ##STR28## where Q is a member selected from the class consisting of ##STR29## and x is a whole number from 1 to 5 inclusive and further wherein said epoxy resin is a polyepoxy compound possessing at least two 1,2-epoxide groups.

Claim 4

A solventless-dry powder comprising a polyetheramide-imide epoxy resin blend of the formula: ##STR22## wherein A represents a polyamide unit and B represents a polyimide unit of a polyetheramide-imide resin, m represents a mole fraction number greater than or equal to zero, C represents a polyepoxy resin, a represents a resin blend proportion number greater than zero and less than 1, the sum of a plus b equals 1.0, further wherein said polyamide unit is of the formula: ##STR23## and said polyimide unit is of the formula: ##STR24## wherein the O--Z--O units of said polyamide or said polyimide units are in the 3 or 3' or 4 or 4' positions and Z is a member of the class consisting of (1) ##STR25## and (2) divalent organic radicals of the general formula ##STR26## where X is a member selected from the class consisting of divalent radicals of the formulas ##STR27## where q is 0 or 1, y is a whole number from 1 to 5, the divalent bonds of the --O--Z--O-- radical are situated on the phthalic anhydride-derived units, e.g., in the 3,3'-, 3,4'-, 4,3'- or the 4,4'-positions, and R is a divalent organic radical selected from the class consisting of (a) aromatic hydrocarbon radicals having from 6-20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals and cycloalkylene radicals having from 2-20 carbon atoms, C.sub.(2-8) alkylene terminated polydiorganosiloxane, and (c) divalent radicals included by the formula ##STR28## where Q is a member selected from the class consisting of ##STR29## and x is a whole number from 1 to 5 inclusive and further wherein said epoxy resin is a polyepoxy compound possessing at least two 1,2-epoxide groups.

Claim 5

A solventless-dry powder of the composition of claim 2, wherein the powder particles have a diameter within the range of from about 5 to about 200 microns, a sintering temperature range (STR) of from about 75° to about 200° C., a viscous flow temperature range (VFTR) of from about 75° to about 240° C., and a leveling temperature range (LTR) of from about 160° to 280° C.

Claim 6

A solventless-dry powder of the composition of claim 3, wherein the polyepoxide has an equivalent weight within the range of from about 70 to 5,000.

Claim 7

A solventless-dry powder coating of the composition of claim 4, wherein the powder particles have a diameter of from about 5 to about 60 microns, a "STR" of 140 to 190° C., a "VFTR" of 155° to 220° C., and a "LTR" of from 200° to 250° C.

Claim 8

A solventless-dry powder of the composition of claim 4, having an epoxide equivalent weight of from about 450 to about 1,000.

Claim 9

A solventless-dry powder of the composition of claim 2, wherein a is at least equal to the number 0.5.

Claim 10

An electrically conductive metal substrate coated with a polyetheramide-imide epoxy resin blend of the composition of claim 2.

Claim 11

An electrically conductive metal substrate coated with a polyetheramide-imide epoxy resin film of the composition of claim 2.

Claim 12

A coated sheet material comprising a cured layer of the composition of claim 2 in firm adherence to a flexible substrate.

Claim 13

A coated wire comprising a cured layer of the composition of claim 2 in firm adherence to the wire.

Claim 14

A coated wire comprising a temperature resistant polymeric layer in firm adherence to the wire and having an overcoat of a cured layer of the composition of claim 2, in firm adherence to said temperature resistant polymeric layer.

Claim 15

The blend of claim 1, wherein "a" is at least equal to the number 0.5.

Claim 16

The claim 13 blend, having an intrinsic viscosity greater than about 0.15 deciliters per gram.

Claim 17

The claim 14 blend, in substantially solvent-less form.

Claim 18

The claim 15 blend, wherein "a" is in the range of from 0.5-0.95.

Claim 19

The claim 16 blend, wherein the O--Z--O units of said polyamide or said polyimide units are situated in the 3,3'-, 3,4'-, 4,3'- or the 4,4'-positions and Z is the divalent radical of the general formula ##STR30## where X is a divalent radical of the formula --C.sub.y H.sub.2y --, where y is a whole number from 1 to 5.