Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip

Claim 5

The device of claim 2, wherein the ends of the connector pins within the guide member are biased in the direction of the entrance to the opening in the guide member, said IC chip socket including an abutment member for pressing the chip carrier in a direction opposed to the biasing of the connector pins.

Claim 6

The device of claim 3, wherein the abutment member is integrally formed in the guide member.

Claim 7

The IC chip socket of claim 4, wherein the guide member and abutment member are formed of a plastic material.

Claim 8

The device of claim 3, wherein the abutment member is a separate member secured to the guide member.

Claim 9

The device of claim 6, wherein the abutment member has an opening defining the entrance to the opening of the guide member to permit insertion of the chip carrier therethrough and into an engaged position between the connector pins and abutment member.

Claim 10

The device of claim 4, wherein the abutment member is shaped to permit insertion of the chip carrier therepast into the opening in the guide member and into an engaged position between the connector pins and abutment member.

Claim 11

The IC chip socket of claim 2, wherein the connector pins are made of metal.

Claim 12

The IC chip socket of claim 2, wherein the inner surface of the opening of the guide member is formed with one of a convex or concave positioning portion and the periphery of the chip carrier is formed with the other of a convex or a concave positioning portion, the convex positioning portion and the concave positioning portion being asymmetrically located in a transverse plane in facing relation, whereby erroneous positioning of the chip carrier is prevented.

Claim 13

The device of claim 3, wherein the guide member is formed with a further abutment member to limit the displacement of the chip carrier into the opening of the guide member during insertion, whereby over-flexing and injury to the connector pins may be avoided.

Claim 14

The device of claim 3, wherein the electrodes are formed in at least two opposed side surfaces of the chip carrier for engagement by the ends of connector pins on at least two facing sides to position and return the chip carrier in the guide member.

Claim 15

The device of claim 2, and including encapsulation means covering the exposed surface of the chip positioned on the chip carrier, the electrodes being an electrode pattern.

Claim 16

An IC chip socket for fixedly mounting an interchangeable IC chip carrier utilized for packaging a chip carrier to an electronic circuit substrate, the IC chip carrier having electrodes on the surface thereof, comprising: a guide member formed with a central opening for receiving at least a portion of the chip carrier; and a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for coupling with the electrodes of the chip carrier and a second end extending outside extending in a substantially transverse direction relative to the guide member, whereby the chip carrier is changeably mountable in the IC chip socket and the chip socket is surface mountable on an electronic circuit substrate.

Claim 17

An IC chip socket for fixedly mounting an interchangeable IC chip carrier utilized for packaging a chip carrier to an electronic circuit substrate, the IC chip carrier having electrodes on the surface thereof, comprising: a guide member formed with a central opening for receiving at least a portion of the chip carrier; and a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for coupling with the electrodes of the chip carrier and a second end extending outside extending in a substantially transverse direction relative to the guide member, whereby the chip carrier is changeably mountable in the IC chip socket and the chip socket is surface mountable on an electronic circuit substrate.

Claim 18

An IC chip socket for fixedly mounting an interchangeable IC chip carrier utilized for packaging a chip carrier to an electronic circuit substrate, the IC chip carrier having electrodes on the surface thereof, comprising: a guide member formed with a central opening for receiving at least a portion of the chip carrier; and a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for coupling with the electrodes of the chip carrier and a second end extending outside the guide member, whereby the chip carrier is changeably mountable in the IC chip socket and the chip socket is surface mountable on an electronic circuit substrate the connector pins being made of a resilient material, and the ends of the connector pins projecting within the guide member being disposed opposed to the electrodes arranged on the surface of the chip carrier to bias the chip carrier to retain the chip carrier in the guide member.

Claim 19

An IC chip socket for fixedly mounting an interchangeable IC chip carrier utilized for packaging a chip carrier to an electronic circuit substrate, the IC chip carrier having electrodes on the surface thereof, comprising: a guide member formed with a central opening for receiving at least a portion of the chip carrier; and a plurality of connector pins supported by the guide member, each having one end extending within the central opening of the guide member for coupling with the electrodes of the chip carrier and a second end extending outside the guide member, whereby the chip carrier is changeably mountable in the IC chip socket and the chip socket is surface mountable on an electronic circuit substrate the connector pins being made of a resilient material, and the ends of the connector pins projecting within the guide member being disposed opposed to the electrodes arranged on the surface of the chip carrier to bias the chip carrier to retain the chip carrier in the guide member.

Claim 20

The IC chip socket of claim 15, wherein the ends of the connector pins within the guide member are biased in the direction of the entrance to the opening in the guide member, said IC chip socket including an abutment member for pressing the chip carrier in a direction opposed to the biasing of the connector pins.

Claim 21

The IC chip socket of claim 15, wherein the abutment member is integrally formed in the guide member.

Claim 22

The IC chip socket of claim 17, wherein the guide member and abutment member are formed of a plastic material.

Claim 23

The IC chip socket of claim 15, wherein the abutment member is a separate member secured to the guide member.

Claim 24

The IC chip socket of claim 19, wherein the abutment member has an opening defining the entrance to the opening of the guide member to permit insertion of the chip carrier therethrough and into an engaged position between the connector pins and abutment member.

Claim 25

The IC chip socket of claim 17, wherein the abutment member is shaped to permit insertion of the chip carrier therepast into the opening in the guide member and into an engaged position between the connector pins and abutment member.

Claim 26

The IC chip socket of claim 15, wherein the connector pins are made of metal.

Claim 27

The IC chip socket of claim 15, wherein the inner surface of the opening of the guide member is formed with one of a convex or concave positioning portion and the periphery of the chip carrier is formed with the other of a convex or a concave positioning portion, the convex positioning portion and the concave positioning portion being asymmetrically located in a transverse plane in facing relation, whereby erroneous positioning of the chip carrier is prevented.

Claim 28

The IC chip socket of claim 16, wherein the guide member is formed with a further abutment member to limit the displacement of the chip carrier into the opening of the guide member during insertion, whereby over-flexing and injury to the connector pins may be avoided.

Claim 29

The IC chip socket of claim 15, wherein the electrodes are formed in at least two opposed side surfaces of the chip carrier for engagement by the ends of connector pins on at least two facing sides to position and return the chip carrier in the guide member.

Claim 30

An IC chip socket for fixedly mounting on an electronic circuit substrate an interchangeable lead-less IC chip carrier having a plurality of electrodes on the surface thereof, comprising: a guide member formed with an internal opening for receiving and guiding the periphery of the IC chip carrier; a plurality of connector pins supported by the guide member for electrically connecting the electrodes of the chip carrier with the electronic circuit substrate when the chip carrier is positioned within the guide member, each connector pin having an end extending within the opening in the guide member and an end extending outside the guide member; a lower abutment member provided on the inner surface of the opening of the guide member for preventing damage to the connector pins when attaching the IC chip carrier while permitting the ends of the connector pins within the opening in the guide member to engage the electrodes in the surface of the chip carrier; and an upper abutment member for securing the IC chip carrier between the upper abutment member and the connector pins, wherein the connector pins bias the IC chip towards the upper abutment member, and the lower abutment member and the upper abutment member are integrally formed with the guide member.

Claim 31

An IC chip socket for fixedly mounting on an electronic circuit substrate an interchangeable lead-less IC chip carrier having a plurality of electrodes on the surface thereof, comprising: a guide member formed with an internal opening for receiving and guiding the periphery of the IC chip carrier; a plurality of connector pins supported by the guide member for electrically connecting the electrodes of the chip carrier with the electronic circuit substrate when the chip carrier is positioned within the guide member, each connector pin having an end extending within the opening in the guide member and an end extending outside the guide member; a lower abutment member provided on the inner surface of the opening of the guide member for preventing damage to the connector pins when attaching the IC chip carrier while permitting the ends of the connector pins within the opening in the guide member to engage the electrodes in the surface of the chip carrier; and an upper abutment member for securing the IC chip carrier between the upper abutment member and the connector pins, wherein the connector pins bias the IC chip towards the upper abutment member, and the lower abutment member and the upper abutment member are integrally formed with the guide member.

Claim 32

The IC chip socket of claim 26, and including an erroneous insertion preventing portion formed on the periphery of the IC chip carrier, and a mating erroneous insertion preventing portion formed on the inner surface of the opening in the guide member for insuring proper positioning of the chip carrier.

Claim 33

The IC chip socket of claim 26, wherein the lower abutment limits the displacement of the chip carrier into the opening of the guide member during insertion.

Claim 34

The IC chip socket of claim 26, wherein the upper abutment member is formed with an opening defining the entrance to the opening in the guide member to permit insertion of the chip carrier therethrough, the chip carrier being laterally slidable between the connector pins and the upper abutment member, after insertion, to the operative position.