Package for piezo-oscillator

Claim 2

A piezo-oscillator package comprising a piezo-vibrator having a casing with an end portion, electrode extensions extending proximate the end portion of said casing, a semiconductor element having oscillating circuit means for oscillating said piezo-vibrator, lead terminals coupled to said semiconductor element, said electrode extensions of said piezo-vibrator being coupled to said lead terminals of said semiconductor element, said semiconductor element, lead terminals and piezo-vibrator being packaged in a unitary resin package formed by injecting resin through a resin port positioned proximate the outer periphery of said package proximate said end portion of said casing of said piezo-vibrator, said electrode extensions of said piezo-vibrator being positioned proximate the outer periphery of said package.

Claim 3

The piezo-oscillator of claim 1, wherein the semiconductor element and the piezo-vibrator are disposed in series.

Claim 4

The piezo-oscillator of claim 1, wherein the semiconductor element and the piezo-vibrator are disposed parallel to each other.

Claim 5

The piezo-oscillator of claim 1, further comprising a die pad, the die pad having a first side and a second opposed side, said semiconductor element being disposed on the first side of the die pad, and the piezo-vibrator being disposed on the second side of the die pad and the die pad protrudes in the direction in which the piezo-vibrator is disposed on the die pad.

Claim 6

The piezo-oscillator of claim 1, wherein the piezo-vibrator is a chip-shaped piezo-vibrator.

Claim 7

The piezo-oscillator of claim 1, wherein the resin package is formed at a temperature lower than the melting point of the materials used in constructing the piezo-oscillator.

Claim 8

The piezo-oscillator of claim 6, wherein the piezo-vibrator casing is affixed around a plug, the electrode extensions extending from the plug.

Claim 9

The piezo-oscillator of claim 7, wherein the casing and plug are constructed with solder, the solder softening at a temperature greater than about 175° C.

Claim 10

The piezo-oscillator of claim 7, wherein the casing and plug are constructed with a solder containing about 90% or more of lead.

Claim 11

The piezo-oscillator of claim 1, wherein the piezo-vibrator is a crystal vibrator.

Claim 12

A piezo-oscillator package comprising a semiconductor element including an oscillating circuit, a piezo-vibrator having vibrator leads extending outwardly therefrom, lead terminals coupling the vibrator leads to the semiconductor element, shielding lead terminals disposed parallel to the vibrator lead terminals, the semiconductor element, the lead terminals, the piezo-vibrator and the shielding lead terminals all being contained within a unitary resin package, the vibrator lead terminals being disposed proximate the outer periphery of the package.

Claim 13

A piezo-oscillator package comprising a semiconductor element including an oscillating circuit, a piezo-vibrator having vibrator leads extending outwardly therefrom, lead terminals coupling the vibrator leads to the semiconductor element, shielding lead terminals disposed parallel to the vibrator lead terminals, the semiconductor element, the lead terminals, the piezo-vibrator and the shielding lead terminals all being contained within a unitary resin package, the vibrator lead terminals being disposed proximate the outer periphery of the package.

Claim 14

The piezo-oscillator of claim 11, further including a die pad, the shielding terminals extending from the die pad to without the package, and extending between the vibrator connecting lead terminals and the second set of lead terminals parallel to the crystal vibrator connecting lead terminals.

Claim 15

The piezo-oscillator of claim 11, wherein the shielding lead terminals extend to the outside of the package.

Claim 16

A piezo-oscillator package comprising a frame having an outer periphery, a piezo-vibrator having a casing with an end portion supported on the frame, electrode extensions extending proximate the end portion of the casing, a semiconductor element having oscillating circuit means for oscillating said piezo-oscillator supported on said frame, lead terminals coupled to said semiconductor element, said electrode extensions of said piezo-vibrator being coupled to said lead terminals of said semiconductor element, a port formed in said frame proximate said end portion of said casing of said piezo-vibrator, said electrode extensions of said piezo-vibrator being positioned proximate the outer periphery of said package, said semiconductor element, lead terminal and piezo-vibrator being packaged in a resin introduced through said port.

Claim 17

A piezo-oscillator package comprising a frame having an outer periphery, a piezo-vibrator having a casing with an end portion supported on the frame, electrode extensions extending proximate the end portion of the casing, a semiconductor element having oscillating circuit means for oscillating said piezo-oscillator supported on said frame, lead terminals coupled to said semiconductor element, said electrode extensions of said piezo-vibrator being coupled to said lead terminals of said semiconductor element, a port formed in said frame proximate said end portion of said casing of said piezo-vibrator, said electrode extensions of said piezo-vibrator being positioned proximate the outer periphery of said package, said semiconductor element, lead terminal and piezo-vibrator being packaged in a resin introduced through said port.

Claim 18

The piezo-oscillator of claim 14, wherein the semiconductor element and the piezo-vibrator are disposed in series on said frame.

Claim 19

The piezo-oscillator of claim 14, wherein the semiconductor element and the piezo-vibrator are disposed parallel to each other on said frame.

Claim 20

The piezo-oscillator of claim 14, further comprising a die pad on said frame, the die pad having a first side and a second opposed side, wherein the semiconductor element being disposed on the first side of the die pad and the piezo-vibrator being disposed on the second side of the die pad and the die pad protrudes in the direction in which the piezo-vibrator is disposed on the die pad.

Claim 21

The piezo-oscillator of claim 14, wherein the piezo-vibrator is a chip-shaped piezo-vibrator.

Claim 22

The piezo-oscillator of claim 14, wherein the resin package is formed at a temperature lower than the melting point of the materials used in constructing the piezo-oscillator.

Claim 23

The piezo-oscillator of claim 14, wherein the piezo-vibrator casing is affixed around a plug, the electrode extensions extending from the plug.

Claim 24

The piezo-oscillator of claim 14, wherein the casing and plug are constructed with solder, the solder softening at a temperature greater than about 175° C.

Claim 25

The piezo-oscillator of claim 14, wherein the casing and plug are constructed with a solder containing about 90% or more of lead.

Claim 26

The piezo-oscillator of claim 14, wherein the piezo-vibrator is a crystal vibrator.