US4915795A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plated-through hole plugs for eliminating solder seepage
Assignee: Boeing North American Inc
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Filing: 1989-02-23
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Granted: 1990-04-10
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Expires: 2009-02-23
Abstract
Abstract A process is illustrated to provide plated through holes for connecting between opposite sides of a circuit board such as an insulating ceramic substrate while maintaining a smooth surface on the circuit side to facilitate the process of defining the circuit pattern. The plated-through hole process is designed to uniformly cap or plug all of the plated-through holes to prevent solder from the backside from flowing through the holes to the circuit side and damaging (short-circuitry adjacent paths) the finished product.
Inventors
- 👤 Frank McKiel, Jr.
- 👤 David Garms
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 11:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/15; H05K2203/1518; H05K3/10; H05K3/20; H05K3/205; H05K3/22; H05K3/24; H05K3/241; H05K3/242; H05K3/425; H05K3/426
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
84 words
A method of electrically inter-connecting conductive material on opposite sides of an insulative circuit board comprising the steps of: forming a composite cathode comprising: a non-adherent membrane; a rigid cathodic plate, and electrically conductive compliant material intermediate said membrane and said plate; forceably securing the non-adherent membrane side of said composite cathode to one side of a circuit board containing vias; and placing said composite cathode and circuit board in an activated copper plating bath until concave cylindrical plugs are formed in the vias.
Claim 2
Independent Claim
84 words
A method of electrically inter-connecting conductive material on opposite sides of an insulative circuit board comprising the steps of: forming a composite cathode comprising: a non-adherent membrane; a rigid cathodic plate, and electrically conductive compliant material intermediate said membrane and said plate; forceably securing the non-adherent membrane side of said composite cathode to one side of a circuit board containing vias; and placing said composite cathode and circuit board in an activated copper plating bath until concave cylindrical plugs are formed in the vias.
Claim 3
Independent Claim
81 words
The method of conductively plating and closing off vias in an insulating substrate in a flush manner on one surface of said substrate comprising the steps of: securing a thin non-adherent surface of a compliant cathode to a substrate, having vias between opposite sides of the substrate, on the side of the substrates required to have a smooth surface; immersing the cathode and substrate in a plating solution; and electrically energizing a plating solution-cathode potential until the vias are closed off.
Claim 4
Independent Claim
81 words
The method of conductively plating and closing off vias in an insulating substrate in a flush manner on one surface of said substrate comprising the steps of: securing a thin non-adherent surface of a compliant cathode to a substrate, having vias between opposite sides of the substrate, on the side of the substrates required to have a smooth surface; immersing the cathode and substrate in a plating solution; and electrically energizing a plating solution-cathode potential until the vias are closed off.
Claim 5
Independent Claim
88 words
The method of forming an electrical path for connecting conductive material on opposite sides of a substrate and establishing a smooth surface on one side of said substrate comprising the steps of: forming at least one opening in a substrate; securing a non-bondable compliant electrode to said one side of said substrate; placing the substrate and electrode in a plating solution; applying a potential between said electrode and the plating solution until plated material extends to opposite sides of the opening and the previously open area is closed.
Claim 6
Independent Claim
88 words
The method of forming an electrical path for connecting conductive material on opposite sides of a substrate and establishing a smooth surface on one side of said substrate comprising the steps of: forming at least one opening in a substrate; securing a non-bondable compliant electrode to said one side of said substrate; placing the substrate and electrode in a plating solution; applying a potential between said electrode and the plating solution until plated material extends to opposite sides of the opening and the previously open area is closed.
Claim 7
Dependent Claim
53 words
Preventing solder flow through electrically connecting vias in substrate means comprising the steps of: drilling vias in a substrate; securing a non-adherent compliant electrode to the side of said substrate opposite the side to be soldered; and conductively plating said substrate until cylindrical plugs with a U-shaped cross-section are formed in the vias.
Claim 8
Dependent Claim
53 words
Preventing solder flow through electrically connecting vias in substrate means comprising the steps of: drilling vias in a substrate; securing a non-adherent compliant electrode to the side of said substrate opposite the side to be soldered; and conductively plating said substrate until cylindrical plugs with a U-shaped cross-section are formed in the vias.
Claim 9
Independent Claim
107 words
The method of forming a conductive pathway through an insulative substrate comprising, the steps of: securing an electrode having a conductive compliant surface to a first side of an insulative substrate required to have a smooth surface wherein a membrane of material that will not bond to plating material is situated between the compliant surface of said electrode and the insulative substrate; placing the combination of electrode and substrate in a plating solution; and passing current through the membrane between the plating solution and the electrode until a plated plug is formed in any openings extending from said first side to the opposite side of said substrate.
Claim 10
Independent Claim
107 words
The method of forming a conductive pathway through an insulative substrate comprising, the steps of: securing an electrode having a conductive compliant surface to a first side of an insulative substrate required to have a smooth surface wherein a membrane of material that will not bond to plating material is situated between the compliant surface of said electrode and the insulative substrate; placing the combination of electrode and substrate in a plating solution; and passing current through the membrane between the plating solution and the electrode until a plated plug is formed in any openings extending from said first side to the opposite side of said substrate.
Claim 11
Independent Claim
103 words
A method of depositing metal in a passage through an electrically insulative substrate comprising the steps of: positioning a cathode adjacent at least one opening of a passage on one side of an insulator; immersing the insulative substrate and cathode in an electroplating bath such that the end of said passage opposite the end associated with said cathode is contiguous an anode residing in the electroplating bath; and applying a potential to the electrodes such that metal deposition is initiated at the cathode end of the passage and accumulates in said passage whereby the plated metal conforms to the shape of the passage.
Claim 12
Independent Claim
103 words
A method of depositing metal in a passage through an electrically insulative substrate comprising the steps of: positioning a cathode adjacent at least one opening of a passage on one side of an insulator; immersing the insulative substrate and cathode in an electroplating bath such that the end of said passage opposite the end associated with said cathode is contiguous an anode residing in the electroplating bath; and applying a potential to the electrodes such that metal deposition is initiated at the cathode end of the passage and accumulates in said passage whereby the plated metal conforms to the shape of the passage.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-09 | 1993-10-09 | 1994-04-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-09 | 1997-10-09 | 1998-04-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-09 | 2001-10-09 | 2002-04-10 | $7700.00 | Window Closed / Lapsed |