Patent US4914815A successfully refreshed from Google Patents.
US4914815A
Expired / Lapsed
US
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Method for manufacturing hybrid integrated circuits
Assignee: Mitsubishi Electric Corp
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Filing: 1989-02-21
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Granted: 1990-04-10
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Expires: 2009-02-21
Abstract
Abstract In a method for manufacturing hybrid integrated circuits, a plurality of circuit patterns are formed on one surface of a board, and a connecting film is stuck onto the other surface of the board. Then, the board is divided into portions having the respective circuit patterns while leaving the connecting film intact and component parts are mounted on the portions. Finally, the individual portions are separated by cutting the connecting film. The circuit patterns may be formed over one surface of the board and covered with a connecting film. The connecting film may be a constituent element of each circuit pattern, such as an insulating layer disposed between conducting layers.
Inventors
- 👤 Mitsuyuki Takada
- 👤 Hayato Takasago
- 👤 Yoshiyuki Morihiro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 14:31
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K3/00; H05K3/0011; H05K3/0044; H05K3/0052; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/0909; H05K3/0017; H05K3/0026; H05K3/0029; H05K3/46; H05K3/4644; H05K3/467; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T225/00; Y10T225/10; Y10T225/12; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49789; Y10T29/4979
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
100 words
A method for manufacturing hybrid integrated circuits comprising the steps of: forming a plurality of circuit patterns on a first surface of a board having opposed first and second surfaces; applying a connecting film to said second surface of said board; dividing said board into portions by forming grooves in said board on said first side, each portion including one of said circuit patterns thereon, while leaving said connecting film intact; mounting component parts on said first surface of said board on said respective portions; and separating said portions having said component parts mounted thereon by cutting said connecting film.
Claim 2
Independent Claim
100 words
A method for manufacturing hybrid integrated circuits comprising the steps of: forming a plurality of circuit patterns on a first surface of a board having opposed first and second surfaces; applying a connecting film to said second surface of said board; dividing said board into portions by forming grooves in said board on said first side, each portion including one of said circuit patterns thereon, while leaving said connecting film intact; mounting component parts on said first surface of said board on said respective portions; and separating said portions having said component parts mounted thereon by cutting said connecting film.
Claim 3
Dependent Claim
27 words
A method according to claim 1 wherein dividing said board includes applying pressure to said second side of said board to fracture said board at said grooves.
Claim 4
Dependent Claim
22 words
A method according to claim 2 wherein forming said grooves includes irradiating said first side of said board with a laser beam.
Claim 5
Dependent Claim
13 words
A method according to claim 1 wherein said board is an alumina ceramic.
Claim 6
Dependent Claim
12 words
A method according to claim 1 wherein said board is aluminum nitride.
Claim 7
Dependent Claim
16 words
A method according to claim 1 including mounting said component parts on said board by soldering.
Claim 8
Dependent Claim
12 words
A method according to claim 1 wherein said connecting film is polyimide.
Claim 9
Dependent Claim
14 words
A method according to claim 1, wherein said connecting film is a metal foil.
Claim 10
Dependent Claim
20 words
A method according to claim 1, including cutting said connecting film by irradiating said connecting film with a laser beam.
Claim 11
Dependent Claim
12 words
A method according to claim 1 including mechanically cutting said connecting film.
Claim 12
Independent Claim
90 words
A method for manufacturing hybrid integrated circuits comprising the steps of: forming on a first surface of a board having opposed first and second sides, a plurality of circuit patterns and a connecting film covering said circuit patterns; dividing said board into portions by forming grooves in said board on said second side, each portion including one of said circuit patterns thereon, while leaving said connecting film intact; mounting component parts on said respective portions; and separating said portions having said component parts mounted thereon by cutting said connecting film.
Claim 13
Independent Claim
90 words
A method for manufacturing hybrid integrated circuits comprising the steps of: forming on a first surface of a board having opposed first and second sides, a plurality of circuit patterns and a connecting film covering said circuit patterns; dividing said board into portions by forming grooves in said board on said second side, each portion including one of said circuit patterns thereon, while leaving said connecting film intact; mounting component parts on said respective portions; and separating said portions having said component parts mounted thereon by cutting said connecting film.
Claim 14
Dependent Claim
27 words
A method according to claim 11 wherein dividing said board includes applying pressure to said first side of said board to fracture said board at said grooves.
Claim 15
Dependent Claim
22 words
A method according to claim 11 wherein forming said grooves includes irradiating said first side of said board with a laser beam.
Claim 16
Dependent Claim
13 words
A method according to claim 11 wherein said board is an alumina ceramic.
Claim 17
Dependent Claim
12 words
A method according to claim 11, wherein said board is aluminum nitride.
Claim 18
Dependent Claim
20 words
A method according to claim 11 wherein said connecting film is one constituent element of each of said circuit patterns.
Claim 19
Dependent Claim
15 words
A method according to claim 16, wherein said connecting film is an electrically insulating film.
Claim 20
Dependent Claim
15 words
A method according to claim 17 wherein said connecting film is an organic polymer film.
Claim 21
Dependent Claim
16 words
A method according to claim 11 including mounting said component parts on said board by soldering.
Claim 22
Dependent Claim
12 words
A method according to claim 18, wherein said connecting film is polyimide.
Claim 23
Dependent Claim
20 words
A method according to claim 11 including cutting said connecting film by irradiating said connecting film with a laser beam.
Claim 24
Dependent Claim
12 words
A method according to claim 11 including mechanically cutting said connecting film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-09 | 1993-10-09 | 1994-04-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-09 | 1997-10-09 | 1998-04-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-09 | 2001-10-09 | 2002-04-10 | $7700.00 | Window Closed / Lapsed |