US4914260A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic multi-layer printed circuit boards
Assignee: NGK Insulators Ltd
•
Filing: 1989-03-30
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Granted: 1990-04-03
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Expires: 2009-03-30
Abstract
Abstract A ceramic multi-layer printed circuit board is manufactured by forming a wiring pattern layer on a ceramic substrate through copper plating and forming an insulating layer thereon and then repeating the steps for forming both layers.
Inventors
- 👤 Go Suzuki
- 👤 Toshiki Goto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 00:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; H05K3/4661; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2201/096; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/38; H05K3/381
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
54 words
A ceramic multi-layer printed circuit board characterized in that a wiring pattern layer is formed on a ceramic substrate by a copper plating and a ceramic insulating layer is formed thereon by a printing process with a ceramic paste and formations of such a wiring pattern layer and insulating layer are repeated plural times.
Claim 2
Dependent Claim
54 words
A ceramic multi-layer printed circuit board characterized in that a wiring pattern layer is formed on a ceramic substrate by a copper plating and a ceramic insulating layer is formed thereon by a printing process with a ceramic paste and formations of such a wiring pattern layer and insulating layer are repeated plural times.
Claim 3
Dependent Claim
28 words
The ceramic multi-layer printed circuit board according to claim 1, wherein said insulating layer is formed by using a ultraviolet ray curing type insulating paste containing ceramic powder.
Claim 4
Dependent Claim
25 words
The ceramic multi-layer printed circuit board according to claim 1, wherein holes having an anchor effect are formed in said substrate and/or said insulating layer.
References Cited (Backward Citations)
US4325780A
Cited
US4529835A
Cited
US4598167A
Cited
US4713494A
Cited
US4795670A
Cited
US4821142A
Cited
US4828961A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-02 | 1993-10-02 | 1994-04-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-02 | 1997-10-02 | 1998-04-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-02 | 2001-10-02 | 2002-04-03 | $7700.00 | Window Closed / Lapsed |