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US4912541A Expired / Lapsed US ⏱️ 0.0 years remaining

Monolithically integrated bidirectional lateral semiconductor device with insulated gate control in both directions and method of fabrication

Assignee: Silicon Power Corp
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Filing: 1987-05-19
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Granted: 1990-03-27
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Expires: 2007-05-19
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Abstract

Abstract A monolithically integrated reverse conducting lateral insulated gate semiconductor device includes an inherent four layer structure which supplies a sufficient base drive to turn on an inherent lateral transistor under forward bias conditions. Under reverse bias conditions, an inherent five layer structure is activated to provide for high current density low voltage reverse conduction in the device. Forward and reverse current flow can be interrupted by the application of an appropriate bias to the same insulated gate electrode. The disclosed semiconductor device achieves improved current density and concomitantly reduced cell size.

Inventors

  • 👤 Bantval J. Baliga
  • 👤 Deva N. Pattanayak

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 21:04
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/101; H10D84/121; H10D18/00; H10D18/60; H10D18/65; H10D18/655

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 305 words
A monolithically integrated lateral insulated gate semiconductor device including: a body of semiconductor material having a substantially planar upper surface comprising: a first layer of semiconductor material, a first region disposed within said first layer and forming a portion of said upper surface of said device, a second region of one type conductivity disposed within said first region and forming ga portion of said upper surface, said first region being of opposite type conductivity, a third region of opposite type conductivity disposed within a portion of said second region and forming a portion of said upper surface, a fourth region of one type conductivity disposed within said first layer, spaced from said second region and forming a portion of said upper surface, a fifth region of opposite type conductivity disposed within said fourth region, forming a first PN junction with said fourth region and forming a portion of said upper surface, and a sixth region of opposite type conductivity, spaced from said fifth region, disposed within said fourth region, forming a second PN junction with said fourth region and forming a portion of said upper surface; an insulated gate electrode structure associated with a portion of said fourth region which is disposed between said fifth region and said first layer, said insulated gate electrode structure, in response to an appropriate bias voltage, rendering a channel portion of said fourth region coupling said fifth region to said first layer conductive to opposite type conductivity carriers; a first main electrode disposed on said upper surface in ohmic contact with said second and third regions; and a second main electrode spaced from said first main electrode and disposed on said upper surface in ohmic contact with said fourth and sixth region; said fifth region being spaced from said first and second electrodes and free of ohmic contacts thereto.
Claim 2
Dependent Claim 305 words
A monolithically integrated lateral insulated gate semiconductor device including: a body of semiconductor material having a substantially planar upper surface comprising: a first layer of semiconductor material, a first region disposed within said first layer and forming a portion of said upper surface of said device, a second region of one type conductivity disposed within said first region and forming ga portion of said upper surface, said first region being of opposite type conductivity, a third region of opposite type conductivity disposed within a portion of said second region and forming a portion of said upper surface, a fourth region of one type conductivity disposed within said first layer, spaced from said second region and forming a portion of said upper surface, a fifth region of opposite type conductivity disposed within said fourth region, forming a first PN junction with said fourth region and forming a portion of said upper surface, and a sixth region of opposite type conductivity, spaced from said fifth region, disposed within said fourth region, forming a second PN junction with said fourth region and forming a portion of said upper surface; an insulated gate electrode structure associated with a portion of said fourth region which is disposed between said fifth region and said first layer, said insulated gate electrode structure, in response to an appropriate bias voltage, rendering a channel portion of said fourth region coupling said fifth region to said first layer conductive to opposite type conductivity carriers; a first main electrode disposed on said upper surface in ohmic contact with said second and third regions; and a second main electrode spaced from said first main electrode and disposed on said upper surface in ohmic contact with said fourth and sixth region; said fifth region being spaced from said first and second electrodes and free of ohmic contacts thereto.
Claim 3
Dependent Claim 16 words
The semiconductor device of claim 1 wherein said insulated gate is disposed on said upper surface.
Claim 4
Dependent Claim 60 words
The semiconductor device of claim 1 wherein said insulated gate structure also extends over a portion of said fourth region disposed between said fifth and sixth regions, said insulated gate structure, in response to an appropriate bias voltage, rendering a channel portion of said fourth region coupling said fifth region to said sixth region conductive to opposite type conductivity carriers.
Claim 5
Dependent Claim 67 words
The semiconductor device of claim 1 further comprising a second insulated gate electrode structure associated with a portion of said fourth region which is disposed between said fifth and sixth regions, said second insulated gate electrode structure, in response to an appropriate bias voltage, rendering a second channel portion of said fourth region coupling said fifth region to said sixth region conductive to opposite type conductivity carriers.
Claim 6
Dependent Claim 15 words
The semiconductor device of claim 1 wherein said first layer is of opposite type conductivity.
Claim 7
Dependent Claim 28 words
The semiconductor device of claim 5 further including a second layer of one type conductivity disposed on said first layer on a side opposite said insulated gate electrode.
Claim 8
Dependent Claim 76 words
The semiconductor device of claim 1 wherein said insulated gate electrode structure extends over a portion of said fifth region and a portion of said sixth region and in response to an appropriate bias voltage, renders channel portions of said fourth region which extends between said fifth and sixth regions and between said fifth region and said first layer conductive to opposite type conductivity carriers, thereby coupling said first layer and said fifth and sixth regions.
Claim 9
Dependent Claim 22 words
The semiconductor device of claim 1 wherein said fourth region comprises a first heavily doped portion and a second lightly doped portion.
Claim 10
Dependent Claim 39 words
The semiconductor device of claim 1 wherein said second region has first and second portions and said third region is disposed in said first portion of said second region and spaced from said second portion of said second region.
Claim 11
Dependent Claim 58 words
The semiconductor device of claim 1 wherein: said second and fourth region are elongated in a first direction and spaced apart in a second direction perpendicular to said first direction; said third region is substantially shorter, in said first direction, than said second region; said fifth region is substantially shorter, in said first direction, than said fourth region
Claim 12
Dependent Claim 21 words
The semiconductor device of claim 10 wherein: said third and fifth regions are offset from each other in said first direction.
Claim 13
Dependent Claim 39 words
The semiconductor device of claim 11 wherein: a line may be drawn perpendicular to said first direction in a location where said third and fifth regions are disposed on opposite sides of said line and spaced from said line.
Claim 14
Dependent Claim 17 words
The semiconductor device recited in claim 1 wherein: said second region is free of gate controlled channels.

References Cited (Backward Citations)

US4580154A Cited
US4604638A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-03-26 1993-09-25 1994-03-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-03-26 1997-09-25 1998-03-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-03-26 2001-09-25 2002-03-27 $7700.00 Window Closed / Lapsed

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