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US4909960A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor resin composition

Assignee: Hitachi Cable Ltd
•
Filing: 1988-09-27
•
Granted: 1990-03-20
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Expires: 2008-09-27
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Abstract

Abstract A semiconductive resin composition comprising 100 parts by weight of a polymer component comprising an ethylene-based copolymer, an ethylene-propylene rubber, and a low molecular weight polyethylene having an average molecular weight of 1,000 to 4,000 and 40 parts by weight or more of electroconductive carbon black.

Inventors

  • 👤 Kiyoshi Watanabe
  • 👤 Toshio Shiina
  • 👤 Yukio Shimazaki
  • 👤 Hideki Yagyu
  • 👤 Katsutoshi Hanawa
  • 👤 Moritada Marumo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 14:49
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/24; C; C08; C08K; C08K3/00; C08K3/02; C08K3/04; C08L; C08L23/00; C08L23/02; C08L23/04; C08L23/08; C08L23/0846; C08L23/0853; C08L23/0869; C08L2203/00; C08L2203/20; C08L2203/202; C08L2205/00; C08L2205/03; C08L23/06; C08L23/16

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 64 words
A semiconductive resin composition comprising 100 parts by weight of a polymer component comprising 40 to 90 wt% ethylene-based copolymer, 30 to 5 wt% ethylene-propylene rubber, and 30 to 5 wt% low molecular weight polyethylene having an average molecular weight of 1,000 to 4,000, and 40 parts by weight or more of electroconductive carbon black per 100 parts by weight of the polymer component.
Claim 2
Dependent Claim 64 words
A semiconductive resin composition comprising 100 parts by weight of a polymer component comprising 40 to 90 wt% ethylene-based copolymer, 30 to 5 wt% ethylene-propylene rubber, and 30 to 5 wt% low molecular weight polyethylene having an average molecular weight of 1,000 to 4,000, and 40 parts by weight or more of electroconductive carbon black per 100 parts by weight of the polymer component.
Claim 3
Dependent Claim 17 words
A semiconductive resin composition as in claim 1, wherein the ethylene-based copolymer is an ethylene-vinyl acetate copolymer.
Claim 4
Dependent Claim 17 words
A semiconductive resin composition as in claim 1, wherein the ethylene-based copolymer is an ethylene-ethyl acrylate copolymer.
Claim 5
Dependent Claim 30 words
A semiconductive resin composition as in claim 1, wherein the conductive carbon black is at least one member selected from the group consisting of furnace carbon black and acetylene black.
Claim 6
Dependent Claim 46 words
A semiconductive resin composition as in claim 4, wherein the furnace carbon black has an arithmetic mean particle size of 25 to 40 mμ, iodine adsorption of 40 to 60 mg/g, and DBP oil absorption (measured by JIS A method) of 120 to 150 ml/100 g.
Claim 7
Dependent Claim 15 words
A semiconductive resin composition as in claim 1, wherein the composition further comprises an antioxidant.
Claim 8
Dependent Claim 13 words
A semiconductive resin composition as in claim 6, wherein the antioxidant is 4,4'-thio-bis(3-methyl-6-tert-butylphenol).
Claim 9
Dependent Claim 16 words
A semiconductive resin composition as in claim 1, wherein the composition further comprises a crosslinking agent.
Claim 10
Dependent Claim 14 words
A semiconductive resin composition as in claim 8, wherein the crosslinking agent is 1,3-bis(tert-butylperoxyisopropyl)benzene.
Claim 11
Dependent Claim 29 words
A semiconductive resin composition as in claim 1, wherein the ethylene-based copolymer is selected from the group consisting of ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers and ethylene-methyl methacrylate copolymers.
Claim 12
Dependent Claim 24 words
A semiconductive resin composition as in claim 10, wherein the amount of carbon black is 40 parts to 75 parts by weight carbon black.
Claim 13
Dependent Claim 25 words
A semiconductive resin as in claim 11, wherein the conductive carbon black is at least one member selected from furnace carbon black and acetylene black.
Claim 14
Dependent Claim 46 words
A semiconductive resin composition as in claim 12, wherein the furnace carbon black has an arithmetic mean particle size of 25 to 40 mμ, iodine adsorption of 40 to 60 mg/g, and DBP oil absorption (measured by JIS A method) of 120 to 150 ml/100 g.

References Cited (Backward Citations)

US4246142A Cited
US4246142B1 Cited
US4395362A Cited
US4696765A Cited
US4664900A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-03-19 1993-09-18 1994-03-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-03-19 1997-09-18 1998-03-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-03-19 2001-09-18 2002-03-20 $7700.00 Window Closed / Lapsed

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