Patent US4907129A successfully refreshed from Google Patents.
US4907129A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame and electronic divice
Assignee: Hitachi Ltd
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Filing: 1988-12-20
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Granted: 1990-03-06
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Expires: 2008-12-20
Abstract
Abstract A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip support. The one end of at least one of the plurality of leads includes a first lead portion extending in a direction toward the chip support and a second lead portion contiguous with the first lead portion. The second lead portion extends in a direction away from the chip support so that the one of the lead has a bent shape.
Inventors
- 👤 Ichio Shimizu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:40
CPC Classifications
H; H01; H01F; H01F3/00; H01F7/00; H01F7/06; H01F7/08; H01F7/16; H01F7/1607; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/433; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
215 words
A lead frame comprising: chip supporting means for supporting a chip; and a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said inner end of at least one of said plurality of leads including a first lead portion extending toward said chip supporting means in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between a peripheral wall of said chip supporting means and a first end of an adjacent lead of said plurality of leads.
Claim 2
Dependent Claim
215 words
A lead frame comprising: chip supporting means for supporting a chip; and a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said inner end of at least one of said plurality of leads including a first lead portion extending toward said chip supporting means in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between a peripheral wall of said chip supporting means and a first end of an adjacent lead of said plurality of leads.
Claim 3
Dependent Claim
260 words
An electronic device comprising: a semiconductor chip; a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said chip being secured to said chip supporting means; wires electrically connected said leads and said chip; and sealing means sealing said leads, said chip supporting means and said wires; said inner end of at least one of said plurality of leads including a first lead portion extending toward said chip supporting means in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between a peripheral wall of said chip supporting means and a first end of an adjacent lead of said plurality of leads, one of said wires being electrically connected between said second lead portion and a wire bonding space on said chip.
Claim 4
Dependent Claim
260 words
An electronic device comprising: a semiconductor chip; a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said chip being secured to said chip supporting means; wires electrically connected said leads and said chip; and sealing means sealing said leads, said chip supporting means and said wires; said inner end of at least one of said plurality of leads including a first lead portion extending toward said chip supporting means in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between a peripheral wall of said chip supporting means and a first end of an adjacent lead of said plurality of leads, one of said wires being electrically connected between said second lead portion and a wire bonding space on said chip.
Claim 5
Dependent Claim
358 words
A lead frame comprising: chip supporting means for supporting a chip; and a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said inner end of at least one of said plurality of leads including a first lead portion extending in a direction toward said chip supporting means, said first lead portion including a part extending in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said third lead portion having substantially parallel sides extending between said first and second ends thereof, one of said substantially parallel sides being disposed adjacent to and spaced a predetermined distance from a peripheral wall of said chip supporting means facing said first lead portion and extending in a direction substantially parallel with said peripheral wall, said second lead portion extending from said second end of said third lead portion in a direction away from said chip supporting means so as to have an end part thereof disposed at a position farther away from said peripheral wall of said chip supporting means than the other of said substantially parallel sides of said third lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between said peripheral wall of said chip supporting means and a part of a first lead portion of an adjacent lead of said plurality of leads extending in a direction toward and substantially perpendicular to said chip supporting means.
Claim 6
Dependent Claim
358 words
A lead frame comprising: chip supporting means for supporting a chip; and a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said inner end of at least one of said plurality of leads including a first lead portion extending in a direction toward said chip supporting means, said first lead portion including a part extending in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said third lead portion having substantially parallel sides extending between said first and second ends thereof, one of said substantially parallel sides being disposed adjacent to and spaced a predetermined distance from a peripheral wall of said chip supporting means facing said first lead portion and extending in a direction substantially parallel with said peripheral wall, said second lead portion extending from said second end of said third lead portion in a direction away from said chip supporting means so as to have an end part thereof disposed at a position farther away from said peripheral wall of said chip supporting means than the other of said substantially parallel sides of said third lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between said peripheral wall of said chip supporting means and a part of a first lead portion of an adjacent lead of said plurality of leads extending in a direction toward and substantially perpendicular to said chip supporting means.
Claim 7
Dependent Claim
403 words
An electronic device comprising: a semiconductor chip; a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said chip being secured to said chip supporting means; wires electrically connecting said leads and said chip; and sealing means sealing said leads, said chip supporting means and said wires; said inner end of at least one of said plurality of leads including a first lead portion extending in a direction toward said chip supporting means, said first lead portion including a part extending in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said third lead portion having substantially parallel sides extending between said first and second ends thereof, one of said substantially parallel sides being disposed adjacent to and spaced a predetermined distance from a peripheral wall of said chip supporting means facing said first lead portion and extending in a direction substantially parallel with said peripheral wall, said second lead portion extending from said second end of said third lead portion in a direction away from said chip supporting means so as to have an end part thereof disposed at a position farther away from said peripheral wall of said chip supporting means than the other of said substantially parallel sides of said third lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between said peripheral wall of said chip supporting means and a part of a first lead portion of an adjacent lead of said plurality of leads extending in a direction toward and substantially perpendicular to said chip supporting means, one of said wires being electrically connected between said second lead portion and a wire bonding space on said chip.
Claim 8
Dependent Claim
403 words
An electronic device comprising: a semiconductor chip; a plurality of leads arranged around said chip supporting means, each of said plurality of leads having an inner end disposed proximate to said chip supporting means; said chip being secured to said chip supporting means; wires electrically connecting said leads and said chip; and sealing means sealing said leads, said chip supporting means and said wires; said inner end of at least one of said plurality of leads including a first lead portion extending in a direction toward said chip supporting means, said first lead portion including a part extending in a direction substantially perpendicular to said chip supporting means, a second lead portion contiguous with said first lead portion, said second lead portion extending in a direction away from said chip supporting means, and a third lead portion connected between said first lead portion and said second lead portion, said third lead portion being contiguous with said first and second lead portions and having a first end connected to said first lead portion and a second end connected to said second lead portion, said third lead portion having substantially parallel sides extending between said first and second ends thereof, one of said substantially parallel sides being disposed adjacent to and spaced a predetermined distance from a peripheral wall of said chip supporting means facing said first lead portion and extending in a direction substantially parallel with said peripheral wall, said second lead portion extending from said second end of said third lead portion in a direction away from said chip supporting means so as to have an end part thereof disposed at a position farther away from said peripheral wall of said chip supporting means than the other of said substantially parallel sides of said third lead portion, said second lead portion having an end portion which is the end of said inner end of said at least one of said plurality of leads, a part of at least one of said second lead portion and said third lead portion being disposed at a position between said peripheral wall of said chip supporting means and a part of a first lead portion of an adjacent lead of said plurality of leads extending in a direction toward and substantially perpendicular to said chip supporting means, one of said wires being electrically connected between said second lead portion and a wire bonding space on said chip.
Claim 9
Dependent Claim
16 words
A lead frame according to claim 1, wherein said chip supporting means is a tab member.
Claim 10
Dependent Claim
38 words
A lead frame according to claim 1, wherein said second lead portion includes a bonding surface for enabling bonding of a wire establishing an electrical connection between said second lead portion and a bonding pad on said chip.
Claim 11
Dependent Claim
16 words
An electronic device according to claim 2, wherein said chip supporting means is a tab member.
Claim 12
Dependent Claim
16 words
An electronic device according to claim 2, wherein said sealing means is a resin mold member.
Claim 13
Dependent Claim
45 words
An electronic device according to claim 2, wherein said second lead portion includes a bonding surface point thereof at a position farther from said chip supporting means than another position thereof, and said one of said wires is electrically connected to said bonding surface point.
Claim 14
Dependent Claim
16 words
A lead frame according to claim 3, wherein said chip supporting means is a tab member.
Claim 15
Dependent Claim
37 words
A lead frame according to claim 3, wherein said second lead portion includes a bonding surface for enabling bonding of a wire establishing an electrical connection between said lead portion and a bonding pad on said chip.
Claim 16
Dependent Claim
16 words
An electronic device according to claim 4, wherein said chip supporting means is a tab member.
Claim 17
Dependent Claim
16 words
An electronic device according to claim 4, wherein said sealing means is a resin mold member.
Claim 18
Dependent Claim
45 words
An electric device according to claim 4, wherein said second lead portion includes a bonding surface point thereof at a position farther from said chip supporting means than another position thereof, and said one of said wires is electrically connected to said bonding surface point.
References Cited (Backward Citations)
US4797787A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-05 | 1993-09-04 | 1994-03-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-05 | 1997-09-04 | 1998-03-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-05 | 2001-09-04 | 2002-03-06 | $7700.00 | Window Closed / Lapsed |