US4903119A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semi-conductor device
Assignee: Nitto Denko Corp
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Filing: 1989-03-27
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Granted: 1990-02-20
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Expires: 2009-03-27
Abstract
Abstract A semi-conductor device in which a semi-conductor element is sealed with a molding resin is disclosed. In the device, adhesion between a semi-conductor chip and the molding resin is achieved mainly by oxygen-crosslinking between silicon in the semi-conductor chip and silicon in the molding resin. The device exhibits excellent moisture-resistant reliability even after mounting.
Inventors
- 👤 Satoshi Ito
- 👤 Akiko Kitayama
- 👤 Takatoshi Hamada
- 👤 Miho Yamaguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 17:53
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W74/40; H10W74/47; H10W74/476
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
77 words
A semi-conductor device comprising a semi-conductor element sealed with a molding resin, wherein said molding resin is a cured epoxy resin composition comprising an epoxy resin, a curing agent which is a phenolic resin modified by preliminary reaction with a silane compound, and an inorganic filler, and adhesion between a semi-conductor chip in the semi-conductor device and said molding resin is achieved mainly by oxygen-crosslinking between silicon in said semi-conductor chip and silicon in said molding resin.
Claim 2
Dependent Claim
77 words
A semi-conductor device comprising a semi-conductor element sealed with a molding resin, wherein said molding resin is a cured epoxy resin composition comprising an epoxy resin, a curing agent which is a phenolic resin modified by preliminary reaction with a silane compound, and an inorganic filler, and adhesion between a semi-conductor chip in the semi-conductor device and said molding resin is achieved mainly by oxygen-crosslinking between silicon in said semi-conductor chip and silicon in said molding resin.
Claim 3
Dependent Claim
27 words
A semi-conductor device as in claim 1, wherein said molding resin has a bending modulus of elasticity of from 50 to 300 Kgf/mm 2 at 170° C.
Claim 4
Dependent Claim
17 words
A semi-conductor device as in claim 1, wherein said epoxy resin is modified with a silane compound.
References Cited (Backward Citations)
US2913358A
Cited
US4001870A
Cited
US4327369A
Cited
JPS58225120A
Cited
JPS5948942A
Cited
JPS604527A
Cited
JPH0618517A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-19 | 1993-08-21 | 1994-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-19 | 1997-08-21 | 1998-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-19 | 2001-08-21 | 2002-02-20 | $7700.00 | Window Closed / Lapsed |