Epoxy resin composition

Abstract

Abstract PURPOSE:The titled composition useful for sealing a semiconductor having a metal electrode, etc., having improved water-vapor resistance, corrosion resistance, obtained by blending an epoxy resin with specific components such as a 2- mecaptothiazole, a mecapto group-containing silane coupling agent, etc. CONSTITUTION:(A) An epoxy resin (e.g., bisphenol A type epoxy resin, etc.) is blended with (B) a curing agent for epoxy resin (e.g., phenolic novolak resin, etc.), (C) an inorganic filler (e.g., crystalline silica, etc.), (D) one or more of a 2- mercaptothiazole(metal salt), a quaternary ammonium salt, and a quaternary phosphonium salt (e.g., 2-mercaptothiazole, etc.), and (E) a mercapto group- containing silane coupling agent (e.g., mercaptopropyltrimethoxysilane, etc.). Preferably 150-450pts.wt. component C, 0.1-5pts.wt. component D, and 0.1- 10pts.wt. component E are used based on 100pts.wt. component A.

Inventors

• 👤 Masatoshi Ichi
• 👤 正年 位地
• 👤 Masayuki Kobayashi
• 👤 正之 小林
• 👤 Shinichiro Asai
• 👤 新一郎 浅井

Bibliographic Details