US4901203A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid integrated circuit module assembly
Assignee: Mitsubishi Electric Corp
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Filing: 1988-12-05
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Granted: 1990-02-13
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Expires: 2008-12-05
Abstract
Abstract A hybrid integrated circuit module asssembly includes a conductive casing having at least a pair of inner surfaces facing each other, first and second insulating substrates mounted on the inner surfaces and facing each other, and first and second circuits which may be a power amplifier circuit and a driving circuit for driving the power amplifier circuit, the first and the second circuits being formed on the facing surfaces of the first and second insulating substrates, respectively.
Inventors
- 👤 Tetsuo Kobayashi
- 👤 Teruhisa Ohkawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:37
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K7/00; H05K7/20; H05K7/2089; H05K7/209; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
93 words
A hybrid integrated circuit module assembly comprising: an electrically conductive plate having opposed first and second surfaces; an electrically conductive cap including inner and outer surfaces, an opening, and a pair of flanges extending from said cap adjacent the opening wherein said cap is mechanically and electrically joined at said flanges to said first surface of said plate; first and second insulating substrates disposed inside said cap on said inner surface and said first surface, respectively; and first and second circuits disposed facing each other on said first and second insulating substrates, respectively.
Claim 2
Dependent Claim
93 words
A hybrid integrated circuit module assembly comprising: an electrically conductive plate having opposed first and second surfaces; an electrically conductive cap including inner and outer surfaces, an opening, and a pair of flanges extending from said cap adjacent the opening wherein said cap is mechanically and electrically joined at said flanges to said first surface of said plate; first and second insulating substrates disposed inside said cap on said inner surface and said first surface, respectively; and first and second circuits disposed facing each other on said first and second insulating substrates, respectively.
Claim 3
Dependent Claim
35 words
The hybrid integrated circuit module assembly according to claim 1 wherein said electrically conductive cap has notches and through holes through which leads of said first circuit and leads of said second circuit respectively extend.
Claim 4
Dependent Claim
31 words
The hybrid integrated circuit module assembly according to claim 1, wherein said electrically conducting cap includes at least one notch through which leads of said first and second circuits commonly extend.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-12 | 1993-08-14 | 1994-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-12 | 1997-08-14 | 1998-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-12 | 2001-08-14 | 2002-02-13 | $7700.00 | Window Closed / Lapsed |