Mounting part for multilayer hybrid integrated circuit

Abstract

Abstract PURPOSE:To provide an inexpensive mounting part of ready manufacture useful for alleviating the restriction for a space disposition between parts to be mounted of a hybrid IC such as particularly elements to be mounted by devising the stereoscopic space disposition of elements to be mounted. CONSTITUTION:An element A is placed on a mounting part 10 for a multilayer hybrid IC, necessary wirings (gold wirings 121) are formed, the part 10 is so disposed as to locate an element B associated on a ceramic substrate 11 in a space 7, and the contacting part of a leg 6 with the substrate 11 is secured with an adhesive 13. Then, the wirings of a wiring pad 4 for contacting with the exterior on the IC part and the substrate 11 are executed (with gold wirings 121) to complete the assembling of the part 10 of this invention in the hybrid IC. Thus, elements can be disposed, wired stereoscopically between the elements, with the result that a problem of increasing the capacity between the wirings can be eliminated to largely improve the workability in the mounting.

Inventors

• 👤 Shigero Hayashi
• 👤 茂郎 林

Bibliographic Details