Thermal ink jet printhead with internally fed ink reservoir

Claim 2

An improved thermal ink jet printhead of the type formed by the mating and bonding of first and second substrates, the first substrate being silicon and having anisotropically etched in one surface thereof a through recess and a plurality of parallel, elongated grooves, the second substrate having a plurality of heating elements and addressing electrodes patterned on one surface thereof, the through recess serving as an ink reservoir with its open bottom serving as an ink inlet and the elongated grooves serving as ink channels, one end of which is open to serve as ink droplet emitting nozzles, each heating element being located in a respective one of the ink channel grooves a predetermined distance upstream from the nozzles, and said printhead having means to place the ink channel grooves into communication with the through recess, so that selective application of electrical pulses representing digitized data to the heating elements eject and propel ink droplets from the nozzles to a recording medium, wherein the improvement comprises: said ink reservoir being produced by patterning vias in an etch resistant mask on a surface of the first substrate and anisotropically etching for a predetermined time period the first substrate to provide a linear series of individual through recesses and at least one outer shallow, V-groove recess on each of the outer ends of the series of through recesses, so that the ink reservoir is segmented; and means for placing the through recesses and V-groove recesses into communication with each other, so that the V-groove recesses are internally fed from the through recesses of the segmented reservoir.

Claim 3

The improved printhead of claim 1, wherein the means for placing the segmented reservoir into communication with the ink channels is a patterned thick film insulative layer sandwiched between the first and second substrates; and wherein the means for placing the through recesses into communication with each other is having a predetermined spacing between vias which produces the segmented reservoir which will allow complete undercutting prior to completion of the etching time period, so that said undercutting provides ink flow paths between through recesses and the shallow outer V-groove recesses, so that the V-groove recesses are internally fed.

Claim 4

The improved printhead of claim 2, wherein the shallow outer V-grooves may be internally fed by recesses in the thick film insulative layer instead of ink flow paths produced by mask undercutting.

Claim 5

An improved thermal ink jet printhead of the type formed by the mating and bonding of first and second substrates, the first substrate being silicon and having anisotropically etched in one surface thereof a through recess and a plurality of parallel, elongated grooves, the second substrate having a plurality of heating elements and addressing electrodes patterned on one surface thereof, the through recess serving as an ink reservoir with its open bottom serving as an ink inlet and the elongated grooves serving as ink channels, one end of which is open to serve as ink droplet emitting nozzles, each heating element being located in a respective one of the ink channel grooves a predetermined distance upstream from the nozzles, and said printhead having means to place the ink channel grooves into communication with the through recess, so that selective application of electrical pulses representing digitized data to the heating elements eject and propel ink droplets from the nozzles to a recording medium, wherein the improvement comprises: said ink reservoir being segmented by dividing walls to provide a segmented reservoir, the segmented reservoir being produced by patterning vias in an etch resistant mask on a surface of the first substrate and anisotropically etching the first substrate to produce a linear series of separate through recesses, together with at least one shallow, V-groove recess on each of the opposing outer ends of the series of through recesses during a predetermined etching time period, opposing wall surfaces of each dividing wall being in separate adjacent recesses, the spacing between vias which will produce the segmented reservoir having a predetermined dimension to enable complete undercutting prior to completion of the etching time period, so that said undercutting provides ink flow paths between through recesses as well as internally feeding ink to the shallow outer V-groove recesses, the shallow recesses reducing the number of through recesses, so that smaller gaskets may be used to seal the printhead to an external ink supply, while the dividing walls strengthen the first substrate and reduce the effects of angular misalignment between mask and first substrate crystal planes.

Claim 6

An improved thermal ink jet printhead of the type formed by the mating and bonding of first and second substrates, the first substrate being silicon and having anisotropically etched in one surface thereof a through recess and a plurality of parallel, elongated grooves, the second substrate having a plurality of heating elements and addressing electrodes patterned on one surface thereof, the through recess serving as an ink reservoir with its open bottom serving as an ink inlet and the elongated grooves serving as ink channels, one end of which is open to serve as ink droplet emitting nozzles, each heating element being located in a respective one of the ink channel grooves a predetermined distance upstream from the nozzles, and said printhead having means to place the ink channel grooves into communication with the through recess, so that selective application of electrical pulses representing digitized data to the heating elements eject and propel ink droplets from the nozzles to a recording medium, wherein the improvement comprises: said ink reservoir being segmented by dividing walls to provide a segmented reservoir, the segmented reservoir being produced by patterning vias in an etch resistant mask on a surface of the first substrate and anisotropically etching the first substrate to produce a linear series of separate through recesses, together with at least one shallow, V-groove recess on each of the opposing outer ends of the series of through recesses during a predetermined etching time period, opposing wall surfaces of each dividing wall being in separate adjacent recesses, the spacing between vias which will produce the segmented reservoir having a predetermined dimension to enable complete undercutting prior to completion of the etching time period, so that said undercutting provides ink flow paths between through recesses as well as internally feeding ink to the shallow outer V-groove recesses, the shallow recesses reducing the number of through recesses, so that smaller gaskets may be used to seal the printhead to an external ink supply, while the dividing walls strengthen the first substrate and reduce the effects of angular misalignment between mask and first substrate crystal planes.

Claim 7

The improved printhead of claim 4, wherein via spacing between the through recesses and the shallow, V-groove recesses is large enough to prevent undercutting, and wherein the printhead further comprises: a patterned thick film insulative layer sandwiched between the first and second substrates containing recesses therein to expose the heating elements and electrode terminals and to provide at least one recess for enabling the passage of ink from the segmented reservoir to the ink channels, the patterned thick film layer further having recesses to provide communication between the shallow, V-grooves and the through recesses of the segmented reservoir.