Patent US4897602A successfully refreshed from Google Patents.
US4897602A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device package with peripheral carrier structure of low-cost plastic
Assignee: Motorola Solutions Inc
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Filing: 1988-10-14
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Granted: 1990-01-30
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Expires: 2008-10-14
Abstract
Abstract An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.
Inventors
- 👤 Paul T. Lin
- 👤 Michael B. McShane
- 👤 Charles G. Bigler
- 👤 John A. Goertz
- 👤 Joan M. Hamilton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 17:11
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50; H10P72/70; H10P72/74
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
159 words
A packaged electronic device having a carrier structure comprising: a lead frame comprising a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, a distal end away from the bonding area and an intermediate portion between the proximal end and the distal end; an electronic element bonded to the proximal ends of leads in the lead frame; a package body over the electronic element and at least an end portion of the proximal ends of each of the leads, the package body being a first material; and a molded plastic carrier structure positioned to encapsulate at least a portion of the distal ends but not the extreme distal ends of a least some of the leads, the molded plastic carrier structure being of a second plastic material different from the first material; at least the intermediate portions of the leads being exposed and not covered by either material.
Claim 2
Dependent Claim
159 words
A packaged electronic device having a carrier structure comprising: a lead frame comprising a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, a distal end away from the bonding area and an intermediate portion between the proximal end and the distal end; an electronic element bonded to the proximal ends of leads in the lead frame; a package body over the electronic element and at least an end portion of the proximal ends of each of the leads, the package body being a first material; and a molded plastic carrier structure positioned to encapsulate at least a portion of the distal ends but not the extreme distal ends of a least some of the leads, the molded plastic carrier structure being of a second plastic material different from the first material; at least the intermediate portions of the leads being exposed and not covered by either material.
Claim 3
Dependent Claim
30 words
The electronic device package of claim 1 wherein the first material is of a first quality and the second material is of a second quality lower than said first quality.
Claim 4
Dependent Claim
36 words
The electronic device package of claim 1 wherein the first material is selected from the group consisting of plastic and ceramic and the second material is a plastic of a lower quality than the first material.
Claim 5
Dependent Claim
19 words
The electronic device package of claim 1 wherein the molded carrier structure at least partially encircles the package body.
Claim 6
Dependent Claim
47 words
The packaged electronic device of claim 1 further comprising a probe area comprising the extreme distal end of the leads, the probe area extending out from the molded carrier structure and formed to substantially conform to the shape of the outer surface of the molded carrier structure.
Claim 7
Dependent Claim
75 words
The packaged electronic device of claim 1 wherein the lead frame is substantially planar over a portion of its length and has first and second major surfaces and wherein the probe area comprises the extreme distal ends of the leads bent in a direction normal to the major surfaces to place the first of the surfaces in substantial alignment with the outer surface of the molded carrier structure and exposing the second surface for test.
Claim 8
Dependent Claim
36 words
The packaged electronic device of claim 1 wherein the molded carrier structure comprises a shaped outer periphery facing away from the package body and having a plurality of crenels in which the probe areas are captured.
Claim 9
Dependent Claim
176 words
A packaged electronic device having a carrier structure comprising: a lead frame comprising a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, a distal end away from the bonding area and an intermediate portion between the proximal end and the distal end; an electronic element bonded to the proximal ends of leads in the lead frame; a package body over the electronic element and the proximal ends of each of the leads, the package body being a first material of a first quality; and a molded carrier structure positioned to encapsulate at least a portion of the distal ends but not the extreme distal ends of at least some of the leads, the carrier structure being of a second material of a second quality different from the first material wherein the second quality is lower than said first quality, the carrier structure additionally at least partially encircling the package body; the intermediate portions of the leads being exposed and not covered by either material.
Claim 10
Dependent Claim
176 words
A packaged electronic device having a carrier structure comprising: a lead frame comprising a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, a distal end away from the bonding area and an intermediate portion between the proximal end and the distal end; an electronic element bonded to the proximal ends of leads in the lead frame; a package body over the electronic element and the proximal ends of each of the leads, the package body being a first material of a first quality; and a molded carrier structure positioned to encapsulate at least a portion of the distal ends but not the extreme distal ends of at least some of the leads, the carrier structure being of a second material of a second quality different from the first material wherein the second quality is lower than said first quality, the carrier structure additionally at least partially encircling the package body; the intermediate portions of the leads being exposed and not covered by either material.
Claim 11
Dependent Claim
167 words
A packaged electronic device having a carrier structure comprising: a lead frame including a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, and a distal end away from the bonding area, the leads lying in a plane over a substantial fraction of their length; an electronic element bonded to the proximal ends of leads in the lead frame; a package body enclosing the electronic element and the proximal ends of each of the leads; a molded plastic carrier structure spaced apart from the package body and encapsulating at least a portion of the distal ends but not the extreme distal ends of at least some of the leads and bounded by an outer edge; and an exposed probe area comprising the extreme distal end of the leads, the probe area extending from the outer edge of the molded plastic carrier, angled from the plane, and substantially conforming to the outer edge of the molded carrier.
Claim 12
Dependent Claim
167 words
A packaged electronic device having a carrier structure comprising: a lead frame including a plurality of leads peripherally surrounding an electronic element bonding area, each lead having a proximal end near the bonding area, and a distal end away from the bonding area, the leads lying in a plane over a substantial fraction of their length; an electronic element bonded to the proximal ends of leads in the lead frame; a package body enclosing the electronic element and the proximal ends of each of the leads; a molded plastic carrier structure spaced apart from the package body and encapsulating at least a portion of the distal ends but not the extreme distal ends of at least some of the leads and bounded by an outer edge; and an exposed probe area comprising the extreme distal end of the leads, the probe area extending from the outer edge of the molded plastic carrier, angled from the plane, and substantially conforming to the outer edge of the molded carrier.
Claim 13
Dependent Claim
22 words
The packaged electronic device of claim 9 wherein the package body and the molded plastic carrier structure are formed of different materials.
Claim 14
Dependent Claim
156 words
A packaged electronic device having a carrier structure comprising: a lead frame including a plurality of substantially planar leads peripherally surrounding an electronic element bonding area, each of the leads having a first end near the bonding area and a second end extending away from the bonding area; an electronic element bonded to the first ends of the leads; a molded plastic body enclosing the electronic element and the first ends of the leads; a molded plastic carrier structure spaced apart from the package body and enclosing a portion of the leads intermediate between the first and second ends, the carrier structure having a shaped outer periphery facing away from the molded plastic body; and a probe area comprising the extremity of the second end of the leads, the probe area extending through the carrier structure, bent out of the plane of the leads, and shaped to substantially conform to the shape of the outer periphery.
Claim 15
Dependent Claim
156 words
A packaged electronic device having a carrier structure comprising: a lead frame including a plurality of substantially planar leads peripherally surrounding an electronic element bonding area, each of the leads having a first end near the bonding area and a second end extending away from the bonding area; an electronic element bonded to the first ends of the leads; a molded plastic body enclosing the electronic element and the first ends of the leads; a molded plastic carrier structure spaced apart from the package body and enclosing a portion of the leads intermediate between the first and second ends, the carrier structure having a shaped outer periphery facing away from the molded plastic body; and a probe area comprising the extremity of the second end of the leads, the probe area extending through the carrier structure, bent out of the plane of the leads, and shaped to substantially conform to the shape of the outer periphery.
Claim 16
Dependent Claim
62 words
The device of claim 11 wherein the substantially planar leads have first and second major surfaces and wherein the probe area comprises a portion of the leads bent in a direction normal to the major surfaces to place the first of the surfaces in substantial alignment with and facing the periphery of the carrier structure and exposing the second surface for test.
Claim 17
Dependent Claim
24 words
The device of claim 12 wherein the probe areas are alternately bent upward and downward relative to the plane of the substantially planar leads.
Claim 18
Dependent Claim
37 words
The device of claim 11 wherein the carrier structure comprises a top surface and a bottom surface terminating in the shaped outer periphery and wherein the probe areas extend to one of the top and bottom surfaces.
Claim 19
Dependent Claim
21 words
The device of claim 14 wherein the enclosed portion of the leads are positioned midway between the top and bottom surfaces.
Claim 20
Dependent Claim
29 words
The device of claim 11 wherein the shaped outer periphery comprises a plurality of crenels and wherein the probe areas are captured in the crenels to reduce sideways movement.
References Cited (Backward Citations)
US3267335A
Cited
US4711700A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-29 | 1993-07-31 | 1994-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-29 | 1997-07-31 | 1998-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-29 | 2001-07-31 | 2002-01-30 | $7700.00 | Window Closed / Lapsed |