Patent US4890195A successfully refreshed from Google Patents.
US4890195A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing
Assignee: Harris Corp
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Filing: 1988-02-08
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Granted: 1989-12-26
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Expires: 2008-02-08
Abstract
Abstract A chip carrier assembly and support arrangement provides a thermally and conductively secure chip interface, and enables rapid insertion and removal of the carrier so that replacement or repair of MMIC components may be facilitated. The chip carrier, which contains one or more chip cavities, is cylindrically configured and made of a material that has a coefficient of thermal expansion that is relatively low compared to that of its surrounding housing, so that a substantially uniform radial compressive force, resulting from the difference in coefficients of thermal expansion of the housing and the carrier, acts uniformly between the cylindrical sidewall of the cylindrical slot in the housing and the cylindrical sidewall of the carrier, thereby securing the chip carrier to the housing and providing thermal and electrical continuity between the carrier and its support housing. With thermal control and electrical grounding accomplished at its cylindrical perimeter, the thickness of the chip carrier becomes non-critical and can be tailored for heat spreading and ease of fabrication.
Inventors
- 👤 Douglas E. Heckaman
- 👤 Gilbert R. Perkins
- 👤 Roger H. Higman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:01
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5445; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49826; Y10T29/49863; Y10T29/49865
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
169 words
A method for retaining a circuit component carrier within an electrically and thermally conductive support structure comprising the steps of: (a) configuring said support structure to have a circuit component carrier receiving portion which is sized to accept a circuit component carrier and which support structure contains thermally and electrically conductive material having a first coefficient of thermal expansion; (b) inserting a circuit component carrier containing electrically and thermally conductive material having a second coefficient of thermal expansion, different from said first coefficient of thermal expansion, into the circuit component carrier receiving portion of said support structure; and (c) applying a thermal input to said support structure, so as to cause said circuit component carrier receiving portion of said support structure to expand and accept insertion of said circuit component carrier and, in response to a reduction in the temperature of said support structure, to impart a compressive force against said circuit component carrier and retain said circuit component carrier in electrical and thermal communication with said support structure.
Claim 2
Independent Claim
169 words
A method for retaining a circuit component carrier within an electrically and thermally conductive support structure comprising the steps of: (a) configuring said support structure to have a circuit component carrier receiving portion which is sized to accept a circuit component carrier and which support structure contains thermally and electrically conductive material having a first coefficient of thermal expansion; (b) inserting a circuit component carrier containing electrically and thermally conductive material having a second coefficient of thermal expansion, different from said first coefficient of thermal expansion, into the circuit component carrier receiving portion of said support structure; and (c) applying a thermal input to said support structure, so as to cause said circuit component carrier receiving portion of said support structure to expand and accept insertion of said circuit component carrier and, in response to a reduction in the temperature of said support structure, to impart a compressive force against said circuit component carrier and retain said circuit component carrier in electrical and thermal communication with said support structure.
Claim 3
Dependent Claim
24 words
A method comprising to claim 1, wherein said first coefficient of thermal expansion has a value greater than said second coefficient of thermal expansion.
Claim 4
Dependent Claim
28 words
A method according to claim 2, wherein step (c) comprises the step of controllably increasing the temperature of said support structure. structure contains thermally and electrically conductive material.
Claim 5
Dependent Claim
48 words
A method according to claim 1, wherein said circuit component carrier has a cylindrically shaped perimeter portion and said circuit component carrier receiving portion of said support structure comprises a cylindrically shaped aperture into which said cylindrically shaped carrier may be inserted and retained by said compressive force.
Claim 6
Dependent Claim
67 words
A method according to claim 4, wherein said circuit component carrier comprises a cylindrically shaped metallic block supporting thereon at least one microwave integrated circuit chip, and said support structure comprises a metallic plate member having a cylindrically shaped aperture therein into which said cylindrically shaped metallic block is insertable so as to be in thermal and electrical communication with the cylindrical metallic sidewall of said aperture.
Claim 7
Dependent Claim
30 words
A method according to claim 5, wherein said cylindrically shaped metallic block has a crossed slot surface portion on which said at least one microwave integrated circuit chip is supported.
Claim 8
Dependent Claim
30 words
A method according to claim 6, wherein said crossed slot surface portion is dimensioned to allow access to the respective sides of said at least one microwave integrated circuit chip.
Claim 9
Dependent Claim
34 words
A method according to claim 7, wherein said crossed slots surface portion is comprised of a plurality of crossed slots forming a plurality of cavities at which respective microwave integrated circuit chips are supportable.
Claim 10
Dependent Claim
24 words
A method according to claim 6, wherein said first coefficient of thermal expansion has a value greater than said second coefficient of thermal expansion.
Claim 11
Dependent Claim
35 words
A method according to claim 9, wherein step (c) comprises the step of controllably increasing the temperature of said metallic plate member and inserting said metallic block into said aperture of said metallic plate member.
Claim 12
Dependent Claim
57 words
A method according to claim 5, wherein said cylindrically shaped metallic block has a substantially flat top surface containing a plurality of spaced-apart holes therein into which respective generally cylindrically shaped pins are inserted, the separation between said pins being such as to prevent resonance at the operational frequency of said at least one microwave circuit chip.
Claim 13
Dependent Claim
30 words
A method according to claim 11, further including the step of (d) attaching a conductive cover to said pins so as to enclose said at least one microwave circuit chip.
Claim 14
Dependent Claim
73 words
A method according to claim 5, wherein said cylindrically shaped metallic block contains a plurality of spaced-apart holes therein into which tab portions of a conductive cover are insertable and further including the step of attaching said cover to said metallic block by way of said tabs and said holes, the separation between said tabs being such as to prevent resonance at the operational frequency of said at least one microwave circuit chip.
Claim 15
Dependent Claim
102 words
A method according to claim 6, wherein said cylindrically shaped metallic block is configured to support, on opposite surfaces thereof, a plurality of microwave integrated circuit chips, and said support structure comprises a metallic plate member having a cylindrically shaped aperture therein into which said cylindrically shaped metallic block is insertable so as to be in thermal and electrical communication with the cylindrical metallic sidewall of said aperture, said metallic plate member having a cavity therein beneath said cylindrically shaped aperture so as to accommodate a microwave circuit chip supported on a bottom one of said opposite surfaces of said metallic block.
Claim 16
Dependent Claim
116 words
A packaging arrangement for a circuit component carrier comprising: an electrically and thermally conductive support structure having a circuit component carrier receiving portion that is sizes to accept a circuit component carrier, said support structure containing material having a first coefficient of thermal expansion; a circuit component carrier containing electrically thermally conductive material having a second coefficient of thermal expansion, different from said first coefficient of thermal expansion, inserted into the circuit component carrier receiving portion of said support structure and retained in electrical and thermal communication with said support structure by a compressive force acting against said circuit component carrier in response to the difference between said first and second coefficients of thermal expansion. PG,24
Claim 17
Dependent Claim
116 words
A packaging arrangement for a circuit component carrier comprising: an electrically and thermally conductive support structure having a circuit component carrier receiving portion that is sizes to accept a circuit component carrier, said support structure containing material having a first coefficient of thermal expansion; a circuit component carrier containing electrically thermally conductive material having a second coefficient of thermal expansion, different from said first coefficient of thermal expansion, inserted into the circuit component carrier receiving portion of said support structure and retained in electrical and thermal communication with said support structure by a compressive force acting against said circuit component carrier in response to the difference between said first and second coefficients of thermal expansion. PG,24
Claim 18
Dependent Claim
24 words
An arrangement according to claim 15, wherein said first coefficient of thermal expansion has a value greater than said second coefficient of thermal expansion.
Claim 19
Dependent Claim
47 words
An arrangement according to claim 15, wherein said circuit component carrier has a cylindrically shaped perimeter portion of said circuit component carrier receiving portion of said support structure comprises a cylindrically shaped aperture into which said cylindrically shaped carrier is inserted and retained by said compressive force.
Claim 20
Dependent Claim
67 words
An arrangement according to claim 17, wherein said circuit component carrier has a cylindrically shaped metallic block supporting thereon at least one microwave integrated circuit chip, and said support structure comprises a metallic plate member having a cylindrically shaped aperture therein into which said cylindrically shaped metallic block is insertable so as to be in thermal and electrical communication with the cylindrical metallic sidewall of said aperture.
Claim 21
Dependent Claim
30 words
An arrangement according to claim 18, wherein said cylindrically shaped metallic block has a crossed slot surface portion on which said at least one microwave integrated circuit chip is supported.
Claim 22
Dependent Claim
29 words
An arrangement according to claim 19, wherein said cylindrically shaped metallic block has a plurality of holes into which a gripping tool may be inserted for manipulating said block.
Claim 23
Dependent Claim
30 words
An arrangement according to claim 19, wherein said crossed slot surface portion is dimensioned to allow access to the respective sides of said at least one microwave integrated circuit chip.
Claim 24
Dependent Claim
34 words
An arrangement according to claim 21, wherein said crossed slot surface portion is comprised of a plurality of crossed slots forming a plurality of cavities at which respective microwave integrated circuit chips are supportable.
Claim 25
Dependent Claim
57 words
An arrangement according to claim 18, wherein said cylindrically shaped metallic block has a substantially flat top surface containing a plurality of spaced-apart holes therein into which respective generally cylindrically shaped pins are inserted, the separation between said pins being, such as to prevent resonance at the operational frequency of said at least one microwave circuit chip.
Claim 26
Dependent Claim
26 words
An arrangement according to claim 23, further including a conductive cover attached to said pins so as to enclose said at least one microwave circuit chip.
Claim 27
Dependent Claim
70 words
An arrangement according to claim 18, wherein said cylindrically shaped metallic block contains a plurality of spaced-apart holes therein into which tab portions of a conductive cover are inserted so as to attach said cover to said metallic block by way of said tabs and said holes, the separation between said tabs being such as to prevent resonance at the operational frequency of said at least one microwave circuit chip.
Claim 28
Dependent Claim
103 words
An arrangement according to claim 18, wherein said cylindrically shaped metallic block is configured to support, on opposite surfaces thereof, a plurality of microwave integrated circuit chips, and said support structure comprises a metallic plate member having a cylindrically shaped aperture therein into which said cylindrically shaped metallic block is insertable so as to be in thermal and electrical communication with the cylindrical metallic sidewall of said aperture, said metallic plate member having a cavity therein beneath said cylindrically shaped aperture so as to accommodate a microwave circuit chip supported on a a bottom one of said opposite surfaces of said metallic block.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-25 | 1993-06-26 | 1993-12-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-25 | 1997-06-26 | 1997-12-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-25 | 2001-06-26 | 2001-12-26 | $7700.00 | Window Closed / Lapsed |