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US4889960A Expired / Lapsed US ⏱️ 0.0 years remaining

Sealed semiconductor casing

Assignee: Olin Corp
•
Filing: 1985-02-01
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Granted: 1989-12-26
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Expires: 2005-02-01
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Abstract

Abstract Reinforced glass composites are disclosed which are useful in hermetic semiconductor packaging as well as other applications. The disclosed composites include discrete particles in a tin-phosphorous-oxyfluoride glass mixture having a low glass transition temperature to prevent serious degradation of the discrete particles.

Inventors

  • 👤 Sheldon H. Butt

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 02:55
CPC Classifications
C; C03; C03C; C03C14/00; C03C14/004; H; H10; H10W; H10W76/00; H10W76/60; C03C2214/00; C03C2214/04; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 136 words
In a casing adapted to house an electronic component comprising: a metal base member; a metal housing member being mounted upon said base member to provide a hollow enclosed casing for receiving said electronic component; a metal leadframe within said enclosed casing for electrical connection to said electronic component, said leadframe having terminal leads projecting between said base member and said housing member external to said casing, the improvement comprising: means for sealing and bonding said terminal leads to both said base member and to said housing member whereby a hermetically enclosed casing is formed, said sealing and bonding means comprising; about 5 to 25% by volume of discrete particles in a glass matrix; said glass matrix being a tin-phosphorous-oxyfluoride composition having a very low glass transition temperature to prevent serious degradation of said discrete particles.
Claim 2
Dependent Claim 136 words
In a casing adapted to house an electronic component comprising: a metal base member; a metal housing member being mounted upon said base member to provide a hollow enclosed casing for receiving said electronic component; a metal leadframe within said enclosed casing for electrical connection to said electronic component, said leadframe having terminal leads projecting between said base member and said housing member external to said casing, the improvement comprising: means for sealing and bonding said terminal leads to both said base member and to said housing member whereby a hermetically enclosed casing is formed, said sealing and bonding means comprising; about 5 to 25% by volume of discrete particles in a glass matrix; said glass matrix being a tin-phosphorous-oxyfluoride composition having a very low glass transition temperature to prevent serious degradation of said discrete particles.
Claim 3
Dependent Claim 38 words
The casing of claim 1 wherein said glass matrix comprises in weight percent on an elemental basis as calculated from the batch, about 20-85% Sn, 2-20% P, 3-20% O, 10-36% F and at least 75% total of Sn+P+O+F.
Claim 4
Dependent Claim 16 words
The casing of claim 2 wherein said discrete particles are completely surrounded by said glass matrix.
Claim 5
Dependent Claim 16 words
The casing of claim 3 wherein said metal is a copper or a copper base alloy.
Claim 6
Dependent Claim 13 words
The casing of claim 4 wherein said discrete particles comprise an organic polymer.
Claim 7
Dependent Claim 13 words
The casing of claim 4 wherein said discrete particles comprise an inorganic material.

References Cited (Backward Citations)

US3871018A Cited
US4178411A Cited
US4268562A Cited
US4314852A Cited
US4314031A Cited
US4341840A Cited
US4461924A Cited
US4379070A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-12-25 1993-06-26 1993-12-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-12-25 1997-06-26 1997-12-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-12-25 2001-06-26 2001-12-26 $7700.00 Window Closed / Lapsed

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