Filler layer electrical component and method for the manufacture thereof

Claim 1

A filler layer electrical component, comprising: a sintered monolistic ceramic body of dielectric material; said ceramic body being provided with cavities to form ceramic layers in said body, said cavities being open to end faces of said body alternately from layer to layer, said cavities having openings to adjacent lateral faces of said body, said openings in said lateral faces of said body alternate in successive cavities to respective ones of said lateral faces, said openings have a length for each of said cavities in a range of 10 through 80% of an overall length of said lateral faces; ceramic particles being distributed in said cavities to form supporting elements between said ceramic layers; metal fillings being provided in said cavities and being of a material having the property of wetting surfaces of said ceramic layers in said cavities when said material is in a molten condition, said metal fillings substantially completely filling said cavities, said material of said metal fillings having a melting temperature considerably lower than a temperature required for sintering said ceramic body; and contacts at said end faces of said body and extending onto said lateral faces, said contacts being electrically conductively connected to said metal fillings, said contacts being solderable, electrical contact of said contacts to said metal filling at said lateral faces being prevented by said limited openings.

Claim 24

A method for manufacturing a filler layer of electrical component, comprising the steps of: (a) producing layers from a first suspension containing a dielectric material in fine distribution by drying, said layers having a thickness of between approximately 0.03 through 0.1 mm, inclusive, said layers having a length and width amounting to a multiple of a width and length of a an individual ceramic body to be formed; (b) applying and drying a second suspension on said layers in limited regions having a defined arrangement and having a thickness of approximately 0.005 through 0.02 mm, inclusive, said second suspension including constituents that escape during sintering and said suspension containing ceramic particles that remain essentially unaltered during sintering; (c) forming a stack of a plurality of said layers, said limited regions of applied second suspension overlapping in said stack in large sub-areas; (d) compressing said stack by pressing; (e) dividing said stack along cut lines in longitudinal directions and in transverse directions to form said individual ceramic bodies; (f) sintering said individual ceramic bodies at temperatures of at least 1000 degrees Celsius, said sintering being carried out with an appropriate heating and cooling curve; (g) providing said sintered individual bodies with contacts at their end faces, said contacts being of a material selected from the group consisting of nickel and silver; and (h) forcing molten metal into said cavities of said individual bodies predominantly through openings in lateral faces of said individual bodies, said molten metal moistening surfaces of said ceramic layers.

Claim 25

A method for manufacturing a filler layer of electrical component, comprising the steps of: (a) producing layers from a first suspension containing a dielectric material in fine distribution by drying, said layers having a thickness of between approximately 0.03 through 0.1 mm, inclusive, said layers having a length and width amounting to a multiple of a width and length of a an individual ceramic body to be formed; (b) applying and drying a second suspension on said layers in limited regions having a defined arrangement and having a thickness of approximately 0.005 through 0.02 mm, inclusive, said second suspension including constituents that escape during sintering and said suspension containing ceramic particles that remain essentially unaltered during sintering; (c) forming a stack of a plurality of said layers, said limited regions of applied second suspension overlapping in said stack in large sub-areas; (d) compressing said stack by pressing; (e) dividing said stack along cut lines in longitudinal directions and in transverse directions to form said individual ceramic bodies; (f) sintering said individual ceramic bodies at temperatures of at least 1000 degrees Celsius, said sintering being carried out with an appropriate heating and cooling curve; (g) providing said sintered individual bodies with contacts at their end faces, said contacts being of a material selected from the group consisting of nickel and silver; and (h) forcing molten metal into said cavities of said individual bodies predominantly through openings in lateral faces of said individual bodies, said molten metal moistening surfaces of said ceramic layers.